JPH0448555B2 - - Google Patents

Info

Publication number
JPH0448555B2
JPH0448555B2 JP58085911A JP8591183A JPH0448555B2 JP H0448555 B2 JPH0448555 B2 JP H0448555B2 JP 58085911 A JP58085911 A JP 58085911A JP 8591183 A JP8591183 A JP 8591183A JP H0448555 B2 JPH0448555 B2 JP H0448555B2
Authority
JP
Japan
Prior art keywords
bonding layer
alloy
bonding
present
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58085911A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59212188A (ja
Inventor
Tetsuo Koyama
Tsuneo Yamada
Noboru Baba
Masateru Suwa
Jusaku Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Healthcare Manufacturing Ltd
Original Assignee
Hitachi Ltd
Hitachi Medical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Medical Corp filed Critical Hitachi Ltd
Priority to JP8591183A priority Critical patent/JPS59212188A/ja
Publication of JPS59212188A publication Critical patent/JPS59212188A/ja
Publication of JPH0448555B2 publication Critical patent/JPH0448555B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
JP8591183A 1983-05-18 1983-05-18 ろう材及びその使用 Granted JPS59212188A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8591183A JPS59212188A (ja) 1983-05-18 1983-05-18 ろう材及びその使用

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8591183A JPS59212188A (ja) 1983-05-18 1983-05-18 ろう材及びその使用

Publications (2)

Publication Number Publication Date
JPS59212188A JPS59212188A (ja) 1984-12-01
JPH0448555B2 true JPH0448555B2 (enrdf_load_stackoverflow) 1992-08-07

Family

ID=13871995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8591183A Granted JPS59212188A (ja) 1983-05-18 1983-05-18 ろう材及びその使用

Country Status (1)

Country Link
JP (1) JPS59212188A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107309575A (zh) * 2017-08-15 2017-11-03 广东威特真空电子制造有限公司 焊料组合物和焊料及其制备方法和应用

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144176A (ja) * 1986-12-08 1988-06-16 株式会社住友金属セラミックス セラミツクスと金属の接合方法
CN106660177B (zh) * 2014-09-09 2020-02-21 株式会社村田制作所 金属组合物、接合材料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107309575A (zh) * 2017-08-15 2017-11-03 广东威特真空电子制造有限公司 焊料组合物和焊料及其制备方法和应用
CN107309575B (zh) * 2017-08-15 2020-04-17 广东威特真空电子制造有限公司 焊料组合物和焊料及其制备方法和应用

Also Published As

Publication number Publication date
JPS59212188A (ja) 1984-12-01

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