JPH0448555B2 - - Google Patents
Info
- Publication number
- JPH0448555B2 JPH0448555B2 JP58085911A JP8591183A JPH0448555B2 JP H0448555 B2 JPH0448555 B2 JP H0448555B2 JP 58085911 A JP58085911 A JP 58085911A JP 8591183 A JP8591183 A JP 8591183A JP H0448555 B2 JPH0448555 B2 JP H0448555B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding layer
- alloy
- bonding
- present
- eutectic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005219 brazing Methods 0.000 claims description 45
- 239000002131 composite material Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 25
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 239000006023 eutectic alloy Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052721 tungsten Inorganic materials 0.000 claims description 11
- 230000005496 eutectics Effects 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 229910001093 Zr alloy Inorganic materials 0.000 claims description 3
- 229910001182 Mo alloy Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 32
- 239000002184 metal Substances 0.000 description 32
- 239000000945 filler Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 16
- 239000000843 powder Substances 0.000 description 13
- 229910001080 W alloy Inorganic materials 0.000 description 9
- 238000001000 micrograph Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000005304 joining Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910000691 Re alloy Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000002591 computed tomography Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052702 rhenium Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、高融点金属材料とグラフアイトとの
接合用ろう材、及びタングステン若しくはそ合
金／接合層／グラフアイトなる構成の層、又はタ
ングステン若しくはその合金／モリブデン／接合
層／グラフアイトなる構成の層を含有するＸ線管
回転陽極用複合ターゲツトにおける該ろう材の利
用に関する。Detailed Description of the Invention [Field of Application of the Invention] The present invention relates to a brazing filler metal for bonding a high-melting point metal material and graphite, and a layer having a composition of tungsten or its alloy/bonding layer/graphite, or a layer composed of tungsten or its alloy/bonding layer/graphite. The present invention relates to the use of the brazing material in a composite target for an X-ray tube rotating anode containing layers of the alloy/molybdenum/bonding layer/graphite composition.
近年、高融点金属材料とグラフアイトとを接合
した部材を使用した機器が各種の用途に利用され
てきている。その例には、耐熱容器、耐火材及び
Ｘ線管用複合ターゲツト等がある。
In recent years, devices using members made by bonding high-melting point metal materials and graphite have been used for various purposes. Examples include heat-resistant containers, refractory materials, and composite targets for x-ray tubes.
しかしながら、従来の接合用ろう材及び接合方
法では、ろう材のぬれ性が阻害され、また接合層
に空洞を生じたり、その厚さが厚い上にバラツキ
があるために、その接合強度に難点があつた。 However, with conventional brazing filler metals and bonding methods, the wettability of the brazing filler metal is inhibited, cavities are formed in the bonding layer, and the thickness of the bonding layer is thick and uneven, resulting in poor bonding strength. It was hot.
以下、従来技術及び本発明について、Ｘ線管回
転陽極用複合ターゲツトを例にとり詳細に説明す
るが、本発明はそれに限定されるものではない。 Hereinafter, the prior art and the present invention will be explained in detail using a composite target for an X-ray tube rotating anode as an example, but the present invention is not limited thereto.
従来からＸ線管回転陽極用ターゲツトとしては
タングステン（以下、Ｗと略記する）の単板が使
用されてきた。その性能改善のため、Ｗに少量の
レニウム（以下、Reと略記する）又はオスミウ
ムなどを添加したＷ合金が用いられている。最近
医療機器用のＸ線CT（Computed tomography）
用のＸ線管の需要が多く、また画像の鮮明化と撮
影時間の短縮のため大容量のものが要求されてき
ている。このためターゲツトの構成としては、直
径を大きくすると共に軽量化する必要がある。こ
のために、ターゲツトの電子衝撃面のみにＷ合金
を用い、その裏面の部分に、比重が小さく、しか
も比熱の大きモリブデン（以下、Moと略記す
る）やグラフアイト（以下、Gtと略記する）を
合体させた、Ｗ若しくはその合金／Mo／Gt又は
Ｗ若しくはその合金／Gtのような複合ターゲツ
トが開発されてきた。 Conventionally, a single plate of tungsten (hereinafter abbreviated as W) has been used as a target for an X-ray tube rotating anode. In order to improve its performance, a W alloy in which a small amount of rhenium (hereinafter abbreviated as Re) or osmium is added to W is used. Recently, X-ray CT (Computed tomography) for medical equipment
There is a great demand for X-ray tubes for use in the field of photography, and large-capacity X-ray tubes are also required to sharpen images and shorten imaging time. Therefore, it is necessary to make the target larger in diameter and lighter in weight. For this purpose, W alloy is used only on the electron impact surface of the target, and on the back side, molybdenum (hereinafter abbreviated as Mo) or graphite (hereinafter abbreviated as Gt), which has a low specific gravity and high specific heat, is used. Composite targets such as W or its alloys/Mo/Gt or W or its alloys/Gt have been developed.
そのような複合ターゲツトを、添付図面の第１
図に示す。すなわち第１図は、従来のＸ線管回転
陽極用複合ターゲツトの縦断面概略図である。第
１図において、符号１は電子衝撃部（Ｗ又はＷ合
金）、２はMo、３はGt、４は中間層、５は回転
軸を意味する。これら複合ターゲツトの製造方法
としては、CVD、溶射及び接合法等があるが、
特に価格の点で接合法が有利である。接合法によ
る場合、上記４は接合用ろう材からなる接合層で
ある。 Such a compound target can be
As shown in the figure. That is, FIG. 1 is a schematic vertical cross-sectional view of a conventional composite target for an X-ray tube rotating anode. In FIG. 1, numeral 1 means an electron bombardment part (W or W alloy), 2 means Mo, 3 means Gt, 4 means an intermediate layer, and 5 means a rotating shaft. Manufacturing methods for these composite targets include CVD, thermal spraying, and bonding methods.
The bonding method is particularly advantageous in terms of cost. In the case of a bonding method, the above-mentioned 4 is a bonding layer made of a brazing filler metal for bonding.
しかして、従来行われている複合法には問題点
がある。すなわち、Ｗ若しくはその合金又はMo
とGtとの接合は、金属とセラミツクとの接合で
あるので、その接合法には種種の問題点がある。 However, there are problems with the conventional combination method. That is, W or its alloy or Mo
Since the bonding between Gt and Gt involves bonding metal and ceramic, there are various problems with the bonding method.
まず、従来上記のような接合には、ろう材とし
て、ジルコニウム（以下、Zrと略記する）、チタ
ン、Mo，Ｗ及びReなどの金属粉を、単味又は混
合して使用している。そこで、従来のろう材は、
単位重量当りの比表面積が大きく、粉末保管中の
酸化によつて含有酸素量が多くなる。したがつ
て、これらの金属粉は、水素還元などの前処理を
施して、できるだけ清浄な粉末として用いる。し
かしながら、従来の複合ターゲツトの接合法で
は、ろう材、特にZr酸化物の生成を防止するこ
とができず、常に接合層は剥離することが判明し
た。そしてその原因は、接合工程で、金属粉に含
まれる酸素を完全に除去できないことにあること
も判明した。Mo−27.5W−0.5Zr−残の組成の圧
粉体１ｇを加熱した場合に、放出されるガス成分
を質量分析計を用いて分析した。その結果を第２
図に示す。すなわち第２図は、Mo−Ｗ−Zr圧粉
体を加熱した場合における温度（℃）（横軸）と
放出ガスの分圧（×10-3mmＨｇ）（縦軸）との関
係を示すグラフである。H2の放出は、ZrH2が分
解し金属Zrに変わるために生ずるものであるが、
ZrH2の分解は200℃程度の低温から始まる。CO2
及びCOの放出は、原料粉の前処理工程で粉末中
の炭素と酸素との脱酸反応のために生ずるもので
ある。ここで注目すべきことは、ZrH2が分解し
て金属Zrに変わる温度範囲と炭素と酸素とが脱
酸反応してCOを放出する温度範囲が重複する点
である。すなわち粉末ろう材中に含有される酸素
が十分脱酸されなうちにZrH2が分解して活性な
金属Zrが生ずることにより、Zrがゲツターとな
つて粉末中に残留する酸素を吸収してZrO2を生
成する。したがつてろう材のぬれ性を阻害するた
め剥離を生ずることからZr酸化物をもつと低減
するためには原料粉の前処理をより完全なものに
する以外に有効な方法はない。しかしながらZr
などの活性金属を水素還元して清浄なものにする
ことは技術的に困難である。 First, conventionally, in the above-described joining, metal powders such as zirconium (hereinafter abbreviated as Zr), titanium, Mo, W, and Re are used singly or in combination as a brazing material. Therefore, conventional brazing filler metal
It has a large specific surface area per unit weight, and the amount of oxygen it contains increases due to oxidation during powder storage. Therefore, these metal powders are subjected to pretreatment such as hydrogen reduction and used as clean powders as possible. However, it has been found that the conventional bonding method for composite targets cannot prevent the formation of brazing filler metal, especially Zr oxide, and the bonding layer always peels off. It was also discovered that the cause of this was that oxygen contained in the metal powder could not be completely removed during the bonding process. When 1 g of a green compact having the composition of Mo-27.5W-0.5Zr was heated, gas components released were analyzed using a mass spectrometer. The second result is
As shown in the figure. In other words, Figure 2 is a graph showing the relationship between temperature (°C) (horizontal axis) and partial pressure of released gas (×10 -3 mmHg) (vertical axis) when Mo-W-Zr compact is heated. It is. The release of H 2 occurs because ZrH 2 decomposes and turns into metal Zr.
The decomposition of ZrH 2 begins at a low temperature of around 200°C. CO2
The release of CO and CO occurs due to the deoxidation reaction between carbon and oxygen in the powder during the pretreatment process of the raw material powder. What should be noted here is that the temperature range in which ZrH 2 decomposes into metallic Zr overlaps with the temperature range in which carbon and oxygen undergo a deoxidation reaction and release CO. In other words, ZrH 2 decomposes and active metal Zr is generated before the oxygen contained in the powdered brazing filler metal is sufficiently deoxidized, and Zr becomes a getter and absorbs the oxygen remaining in the powder to form ZrO. Generate 2 . Therefore, since it inhibits the wettability of the brazing filler metal and causes peeling, there is no effective way to reduce the presence of Zr oxides other than by making the pretreatment of the raw material powder more complete. However, Zr
It is technically difficult to reduce active metals such as hydrogen and make them clean.
次に、従来の複合ターゲツトの製法では、上記
の金属粉にエチルセルロース等の有機溶剤を加え
てペースト状にしたものをGt基板に塗布し、次
いでＷ合金板等を重ね合せ、真空中で高温に加熱
加圧して接合を行う。この従来法では、製造中に
溶剤から排出される水分、不純物及び解離した酸
化物によつてろう材の酸化が促進され、融体が酸
化物層で包囲された形となつて、ぬれ性が著しく
阻害される結果、健全な接合層を形成できない欠
点がある。また、従来法では、接合層の組成及び
厚さを一定にすることが困難であるので、接合層
に大きな空洞及び酸化物の巻込みを生じたり、厚
さにバラツキが生じたりした。しかも一般に厚さ
も厚いので接合強度に難点があつた。それは、一
般に接合層の厚さは、50〜100μmのものが強度が
最大といわれている〔「溶接学会誌」第34巻第８
号第20頁左欄（1965）参照〕のに対して、従来品
は、厚さが100μmを越えるからである。これらの
点を、添付の顕微鏡写真で具体的に説明する。 Next, in the conventional manufacturing method for composite targets, a paste made by adding an organic solvent such as ethyl cellulose to the above metal powder is applied to a Gt substrate, then W alloy plates etc. are stacked on top of each other, and heated to high temperature in a vacuum. Joining is performed by heating and pressurizing. In this conventional method, the moisture, impurities, and dissociated oxides discharged from the solvent during manufacturing accelerate the oxidation of the brazing filler metal, and the melt becomes surrounded by an oxide layer, improving its wettability. As a result, a healthy bonding layer cannot be formed. Furthermore, in the conventional method, it is difficult to make the composition and thickness of the bonding layer constant, resulting in large cavities and oxide inclusions in the bonding layer, and variations in thickness. Moreover, since they are generally thick, there is a problem in bonding strength. It is generally said that the strength of the bonding layer is maximum when the thickness is 50 to 100 μm [Journal of the Welding Society, Vol. 34, No. 8
20, left column (1965)], the conventional product has a thickness of over 100 μm. These points will be specifically explained using the attached micrographs.
すなわち第３図は、ろう材としてZr及びMoの
混合粉末を使用して従来法によつて製造したもの
の接合層付近の断面組織の顕微鏡写真、第４図
は、Zr、Mo及びＷ粉末を使用した市販品の接合
層付近の断面組織の顕微鏡写真である。各図にお
いて符号２１はＷ合金、３はGt、４１は接合層
を意味する。 In other words, Fig. 3 is a micrograph of the cross-sectional structure near the bonding layer of a product manufactured by the conventional method using a mixed powder of Zr and Mo as a brazing material, and Fig. 4 is a micrograph of a cross-sectional structure near the bonding layer using Zr, Mo, and W powders. This is a micrograph of a cross-sectional structure near the bonding layer of a commercially available product. In each figure, numeral 21 means a W alloy, 3 means Gt, and 41 means a bonding layer.
第３図から明らかなように、接合層は空洞が多
く、厚さも約270μmと厚い。また第４図の接合層
も、約750μmと厚い点で、いずれも不適当であ
る。 As is clear from FIG. 3, the bonding layer has many cavities and is thick, approximately 270 μm. Further, the bonding layer shown in FIG. 4 is also unsuitable because it is thick at about 750 μm.
本発明は、従来技術の問題点を解決するために
なされたものであり、その目的は、高融点金属材
料とGtとの新たな接合用ろう材、それを使用し
た接合強度の改良されたＸ線管回転陽極用複合タ
ーゲツトを提供することにある。
The present invention has been made in order to solve the problems of the prior art, and its purpose is to provide a new brazing material for joining high melting point metal materials and Gt, and a An object of the present invention is to provide a composite target for a wire tube rotating anode.
本発明を概説すれば、本発明の第１の発明は、
高融点金属材料とGtとの接合用ろう材に関する
発明であつて、それが、Ｗ又はMoとZrとの共晶
組織を有する共晶合金からなることを特徴とす
る。
To summarize the present invention, the first invention of the present invention is as follows:
This invention relates to a brazing material for joining a high melting point metal material and Gt, and is characterized in that it is made of a eutectic alloy having a eutectic structure of W or Mo and Zr.
また本発明の第２の発明は、Ｗ若しくはその合
金／接合層／Gtなる構成の層、又はＷ若しくは
その合金／Mo／接合層／Gtなる構成の層を含有
するＸ線管回転陽極用複合ターゲツトに関する発
明であつて、そのＷ若しくは合金とGt、又はMo
とGtとの該接合層における接合用ろう材が、本
発明の第１の発明のろう材であることを特徴とす
る。 The second aspect of the present invention is a composite for an X-ray tube rotating anode containing a layer having the composition of W or its alloy/bonding layer/Gt, or a layer having the composition of W or its alloy/Mo/bonding layer/Gt. An invention related to a target, which includes W or an alloy and Gt or Mo.
The brazing filler metal for bonding in the bonding layer between Gt and Gt is characterized in that it is the brazing filler metal of the first aspect of the present invention.
前記第２の発明のターゲツトを製造するための
好適な方法においては、前記第２の発明のＸ線管
回転陽極用複合ターゲツトの製造に当り、Ｗ若し
くはその合金又はMoとGt基板とを接合させる場
合に、該Ｗ若しくはその合金板又はMo板の回転
軸及び／又はその周辺部に、前記第１の発明のろ
う材を埋設し、次いでGt基板を重ね合せ、次い
で該ろう材の共晶点より高温において、かつその
まま又は一定の圧力下で加熱して接合を行うこと
を特徴とする。 In a preferred method for manufacturing the target of the second invention, in manufacturing the composite target for an X-ray tube rotating anode of the second invention, W or an alloy thereof, or Mo and a Gt substrate are bonded. In this case, the brazing material of the first invention is embedded in the rotation axis of the W or its alloy plate or the Mo plate and/or its periphery, and then the Gt substrate is superimposed, and then the eutectic point of the brazing material is It is characterized by being joined by heating at a higher temperature and either as it is or under a constant pressure.
本発明においてろう材として使用する共晶合金
それ自体は、その平衡状態図も含めて周知のもの
である。 The eutectic alloy itself used as a brazing material in the present invention, including its equilibrium phase diagram, is well known.
これらは、アーク溶解などにより、清浄な溶製
合金塊として得られる。 These are obtained as clean molten alloy ingots by arc melting or the like.
しかして、これを本発明に従つてＸ線管回転陽
極用複合ターゲツトの製造に使用する場合、Ｘ線
管の動作におけるターゲツトの温度は1350℃に達
するので、それ以上の高融点のものが必要であ
る。そこで、ろう材として使用できる共晶合金の
例には、22〜67.78重量％Mo−Zr共晶合金、及び
８〜80.12重量％Ｗ−Zr共晶合金があり、特に共
晶点組織が最も好ましく、31重量％Mo−Zr及び
19重量％Ｗ−Zr共晶合金がある。共晶組織を有
する合金によつて共晶温度で融液が形成されるこ
とから、共晶温度付近の低い温度において接合を
行うことができる。 However, when this is used to manufacture a composite target for an X-ray tube rotating anode according to the present invention, the temperature of the target during operation of the X-ray tube reaches 1350°C, so a material with a higher melting point is required. It is. Therefore, examples of eutectic alloys that can be used as brazing filler metals include 22 to 67.78% by weight Mo-Zr eutectic alloy and 8 to 80.12% by weight W-Zr eutectic alloy, with eutectic point structures being the most preferred. , 31 wt% Mo-Zr and
There is a 19 wt% W-Zr eutectic alloy. Since a melt is formed at the eutectic temperature by an alloy having a eutectic structure, bonding can be performed at a low temperature near the eutectic temperature.
次に、本発明のろう材の使用方法について説明
すると、本発明のろう材を、本発明の第２の発明
におけるＸ線管回転陽極用複合ターゲツトを製造
するときに使用する場合には、前記したように、
前記の方法で使用するのが好適である。その場合
に、該ろう材の埋設の仕方の１例を、添付の第５
図〜第７図で具体的に説明する。すなわち第５図
及び第６図は、ろう材の埋設位置の１実施の態様
を示す縦断面概略図であり、第７図は、第６図の
ものの平面図である。各図において符号２はＷ若
しくはその合金又はMo、３はGt、６は本発明の
ろう材を意味する。 Next, the method of using the brazing filler metal of the present invention will be explained. When the brazing filler metal of the present invention is used when manufacturing the composite target for an X-ray tube rotating anode according to the second aspect of the present invention, As I did,
Preferably, it is used in the manner described above. In that case, an example of how to bury the brazing filler metal is shown in the attached 5th page.
This will be explained in detail with reference to FIGS. That is, FIGS. 5 and 6 are schematic vertical cross-sectional views showing one embodiment of the buried position of the brazing material, and FIG. 7 is a plan view of the structure shown in FIG. 6. In each figure, numeral 2 means W or its alloy or Mo, 3 means Gt, and 6 means the brazing material of the present invention.
第５図及び第６図に示したものを、加圧又は静
圧下に、好ましくは真空中で、ろう材の共晶点よ
り高温に加熱すれば、COガスの発生による還元
作用によつてぬれ性が改良され、Gt基板３の表
面をメタライズし、また該Gt基板３と金属板２
との小さな〓間が毛細管現象となつてろう材が浸
透する結果、強度的に有利な薄い接合層を持つ複
合ターゲツトを製造することができる。更に第６
図に示した方法によれば、ろう材の融体は、隙間
を十分に満すことができるので、電子照射面の直
径が大きな高出力の複合ターゲツトを得ることが
できる。 If the materials shown in Figures 5 and 6 are heated under pressure or static pressure, preferably in a vacuum, to a temperature higher than the eutectic point of the brazing filler metal, it will become wet due to the reduction action caused by the generation of CO gas. The surface of the Gt substrate 3 is metalized, and the Gt substrate 3 and the metal plate 2 are
As a result of the capillary action in the small gap between the soldering material and the soldering material, it is possible to manufacture a composite target with a thin bonding layer that is advantageous in terms of strength. Furthermore, the sixth
According to the method shown in the figure, the molten brazing material can sufficiently fill the gap, so that a high-output composite target with a large diameter electron irradiation surface can be obtained.
本発明によれば、接合層が薄く、しかも空胴が
ないため、熱伝導性が優れている。そして簡単な
方法であるため、経済的に有利である。更に、特
に第６図に示した方法によれば、金属板２とGt
基板３との熱膨張率差に基因する剥離を防止する
こともできる。 According to the present invention, since the bonding layer is thin and has no cavity, it has excellent thermal conductivity. Since it is a simple method, it is economically advantageous. Furthermore, especially according to the method shown in FIG.
It is also possible to prevent peeling due to the difference in thermal expansion coefficient from the substrate 3.
〔発明の実施例〕
以下、本発明を実施例及び比較例によつて更に
具体的に説明するが、本発明はこれら実施例に限
定されるものではない。[Examples of the Invention] Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.
実施例 １
アーク溶解により、31重量％Mo−Zr共晶合金
及び19重量％Ｗ−Zr共晶合金を溶解して、本発
明の各ろう材を得た。Example 1 Each brazing filler metal of the present invention was obtained by melting a 31% by weight Mo-Zr eutectic alloy and a 19% by weight W-Zr eutectic alloy by arc melting.
実施例 ２
第５図に示した配置を採用した（但し２はＷ−
Re合金板を意味する）。ろう材として、実施例１
に記載のMo−ZrはＷ−Zr共晶合金溶製ろう材を
使用し、静圧をかけながら真空中で加熱し、接合
を行つて、Ｗ−Re合金／接合層／Gt複合ターゲ
ツトを得た。なお、加熱温度と時間は、Mo−Zr
共晶合金ろうの場合に1600℃×0.5時間、Ｗ−Zr
共晶合金ろうの場合に1750℃×0.5時間とした。Example 2 The arrangement shown in Fig. 5 was adopted (however, W-
(means Re alloy plate). Example 1 as a brazing material
The Mo-Zr described in 1. uses a W-Zr eutectic alloy melt brazing filler metal, is heated in vacuum while applying static pressure, and is bonded to obtain a W-Re alloy/bonding layer/Gt composite target. Ta. In addition, the heating temperature and time are Mo−Zr
In the case of eutectic alloy solder, 1600℃ x 0.5 hours, W-Zr
In the case of eutectic alloy solder, the temperature was set at 1750°C for 0.5 hours.
得られた複合ターゲツトの接合層付近の断面組
織を図面で示す。すなわち第８図は、Mo−Zrろ
うを使用した接合層付近の顕微鏡写真、第９図
は、Ｗ−Zrろうを使用した接合層付近の顕微鏡
写真である。各図において、符号２１，３及び４
１は第３図と同義である。 The cross-sectional structure near the bonding layer of the obtained composite target is shown in the drawing. That is, FIG. 8 is a microscopic photograph of the vicinity of the bonding layer using Mo-Zr solder, and FIG. 9 is a microscopic photograph of the vicinity of the bonding layer using W-Zr solder. In each figure, symbols 21, 3 and 4
1 has the same meaning as in FIG.
第８図及び第９図から明らかなように、、本発
明による接合層４１は、空洞が全くない健全なも
のであり、その厚さが、約50〜70μm程度と薄く、
したがつて本発明によつて、接合強度の優れた複
合ターゲツトを製造することができた。 As is clear from FIGS. 8 and 9, the bonding layer 41 according to the present invention is completely free of cavities and has a thin thickness of about 50 to 70 μm.
Therefore, according to the present invention, a composite target with excellent bonding strength could be manufactured.
実施例 ３
第６図に示した配置を採用した（但し２はMo
板を意味する）。ろう材として、実施例１に記載
のろう材を使用し、実施例２と同様にしてＷ合
金／Mo／接合層／Gt複合ターゲツトを得た。Example 3 The arrangement shown in Figure 6 was adopted (however, Mo
(meaning board). A W alloy/Mo/bonding layer/Gt composite target was obtained in the same manner as in Example 2 using the brazing filler metal described in Example 1 as the brazing filler metal.
得られた複合ターゲツトの接合層付近の断面組
織を図面に示す。すなわち第１０図は、Mo−Zr
ろうを使用した接合層付近の顕微鏡写真、第１１
図は、Ｗ−Zrろうを使用した接合層付近の顕微
鏡写真である。各図において符号２２はMo、３
はGt、４１は接合層を意味する。 The cross-sectional structure near the bonding layer of the obtained composite target is shown in the drawing. In other words, Fig. 10 shows Mo-Zr
Micrograph of the vicinity of the bonding layer using wax, No. 11
The figure is a micrograph of the vicinity of the bonding layer using W-Zr solder. In each figure, the code 22 is Mo, 3
represents Gt, and 41 represents a bonding layer.
第１０図及び第１１図から明らかなように、本
発明による接合層は空洞が全くなく、その厚さが
約30〜40μmと薄いので、本発明によつて、接合
強度の優れた複合ターゲツトを得ることができ
た。 As is clear from FIGS. 10 and 11, the bonding layer according to the present invention has no cavities at all and has a thin thickness of about 30 to 40 μm, so the present invention can provide a composite target with excellent bonding strength. I was able to get it.
試験例 １
実施例２及び３の本発明の複合ターゲツトにつ
いて引張りによる剥離試験を行つた結果、いずれ
もGtで破断した。これは接合層の接合強度が大
きいことの証拠である。Test Example 1 A tensile peel test was conducted on the composite targets of the present invention in Examples 2 and 3, and as a result, both were broken at Gt. This is evidence that the bonding strength of the bonding layer is high.
比較例 １
比較のために、従来法による接合を行つた。ま
ず、Zr及びMoの各粉末を一緒に混合し、それ
を、ニトロセルロースを含む溶剤中に分散させ、
次いでGt基板に塗布した。これにＷ合金板をの
せ、真空中、1600℃で0.5時間加熱して、Ｗ合
金／接合層／Gt複合ターゲツトを得た。その接
合層付近の断面組織の顕微鏡写真が、既述の第３
図である。空洞及び厚さ点で接合強度が劣つてい
る。Comparative Example 1 For comparison, bonding was performed using a conventional method. First, Zr and Mo powders are mixed together and dispersed in a solvent containing nitrocellulose.
It was then applied to a Gt substrate. A W alloy plate was placed on this and heated in vacuum at 1600° C. for 0.5 hours to obtain a W alloy/bonding layer/Gt composite target. A micrograph of the cross-sectional structure near the bonding layer is shown in the third
It is a diagram. Bonding strength is poor due to cavities and thickness.
実施例 ４
実施例１と同様にして、50重量％Mo−Zr合
金、及び60重量％Ｗ−Zr合金を溶製し、ろう材
を得た。Example 4 In the same manner as in Example 1, a 50% by weight Mo-Zr alloy and a 60% by weight W-Zr alloy were melted to obtain a brazing filler metal.
これらのろう材を用いて、第５図に示す配置
で、Ｗ２とGt３とを真空中で加熱し、接合を行
つた。前者は1750℃、後者は2000℃で加熱した。 Using these brazing materials, W2 and Gt3 were heated in vacuum and joined together in the arrangement shown in FIG. The former was heated at 1750°C and the latter at 2000°C.
本発明による接合層は、空洞が全くなく、その
厚さは約100μmと若干厚いものとなつたが、良好
な接合を得ることができることが確認された。 Although the bonding layer according to the present invention had no cavities and was slightly thick at about 100 μm, it was confirmed that good bonding could be obtained.
以上説明したように、本発明のろう材は、清浄
で不活性のために、ぬれ性が改良され、酸化物の
巻込みなく、空洞のない接合層が得られる。しか
も、このろう材自体の強度が高く、安価なため経
済的に有利である。したがつて、本発明のろう材
は、Ｘ線管回転陽極用複合ターゲツトにおいて、
接合用ろう材として有用なものである。
As explained above, since the brazing material of the present invention is clean and inert, the wettability is improved, and a bonding layer without oxides and voids can be obtained. Moreover, this brazing material itself has high strength and is inexpensive, making it economically advantageous. Therefore, the brazing material of the present invention can be used in a composite target for an X-ray tube rotating anode.
It is useful as a brazing material for joining.
また、本発明のろう材の使用方法によれば、発
生するCOガスによる還元効果と、ろう材がGt表
面をメタライズすること、及び毛細管現象によつ
てろう材が浸透する結果とにより、強度の優れた
薄い接合層を形成することができる。しかも熱伝
導性が良く、熱膨張率差による接合層の剥離がな
く、方法が簡単であるので、複合ターゲツトを経
済的に有利に製造することができるという顕著な
効果が奏せられた。 Furthermore, according to the method of using the brazing filler metal of the present invention, the strength is improved due to the reducing effect of the generated CO gas, the brazing filler metallizing the Gt surface, and the penetration of the brazing filler metal through capillary action. An excellent thin bonding layer can be formed. Moreover, it has good thermal conductivity, there is no peeling of the bonding layer due to the difference in coefficient of thermal expansion, and the method is simple, so a remarkable effect has been achieved in that the composite target can be manufactured economically.
第１図は従来のＸ線管回転陽極用複合ターゲツ
トの縦断面概略図、第２図はMo−Ｗ−Zr圧粉体
を加熱した場合における温度と放出ガスの分圧と
の関係を示すグラフ、第３図及び第４図は従来法
による複合ターゲツトの接合層付近の断面組織の
顕微鏡写真、第５図及び第６図は本発明における
ろう材の埋設位置の１実施の態様を示す縦断面概
略図、第７図は第６図のものの平面図、第８図〜
第１１図は、本発明による複合ターゲツトの接合
層付近の断面組織の顕微鏡写真である。
１：電子衝撃部、２：Ｗ若しくはその合金又は
Mo、２１：Ｗ合金、２２：Mo、３：Gt、４：
中間層、４１：接合層、５：回転軸、６：本発明
のろう材。
Figure 1 is a schematic longitudinal cross-sectional view of a conventional composite target for an X-ray tube rotating anode, and Figure 2 is a graph showing the relationship between temperature and partial pressure of released gas when Mo-W-Zr powder compact is heated. , Fig. 3 and Fig. 4 are micrographs of the cross-sectional structure near the bonding layer of a composite target obtained by the conventional method, and Fig. 5 and Fig. 6 are longitudinal cross-sections showing one embodiment of the buried position of the brazing material in the present invention. Schematic diagram, Figure 7 is a plan view of the one in Figure 6, Figures 8-
FIG. 11 is a micrograph of a cross-sectional structure near the bonding layer of the composite target according to the present invention. 1: Electron impact part, 2: W or its alloy or
Mo, 21: W alloy, 22: Mo, 3: Gt, 4:
Intermediate layer, 41: Bonding layer, 5: Rotating shaft, 6: Brazing material of the present invention.
Claims (1)
う材において、それがタングステン又はモリブデ
ンとジルコニウムとの共晶組織を有する共晶合金
からなることを特徴とするろう材。 ２ タングステン若しくはその合金／接合層／グ
ラフアイトなる構成の層、又はタングステン若し
くはその合金／モリブデン／接合層／グラフアイ
トなる構成の層を含有するＸ線管回転陽極用複合
ターゲツトにおいて、前記接合層は、タングステ
ン又はモリブデンとジルコニウムとの共晶組織を
有する共晶合金からなることを特徴とするＸ線管
回転陽極用複合ターゲツト。[Scope of Claims] 1. A brazing material for bonding a high melting point metal material and graphite, characterized in that the brazing material is made of tungsten or a eutectic alloy of molybdenum and zirconium having a eutectic structure. 2. In a composite target for an X-ray tube rotating anode containing a layer composed of tungsten or its alloy/bonding layer/graphite, or a layer composed of tungsten or its alloy/molybdenum/bonding layer/graphite, the bonding layer A composite target for an X-ray tube rotating anode, characterized in that it is made of a eutectic alloy having a eutectic structure of tungsten or molybdenum and zirconium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8591183A JPS59212188A (en) | 1983-05-18 | 1983-05-18 | Brazing filler metal and use thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8591183A JPS59212188A (en) | 1983-05-18 | 1983-05-18 | Brazing filler metal and use thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59212188A JPS59212188A (en) | 1984-12-01 |
| JPH0448555B2 true JPH0448555B2 (en) | 1992-08-07 |
Family
ID=13871995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8591183A Granted JPS59212188A (en) | 1983-05-18 | 1983-05-18 | Brazing filler metal and use thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59212188A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107309575A (en) * | 2017-08-15 | 2017-11-03 | 广东威特真空电子制造有限公司 | Solder composition and solder and its preparation method and application |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63144176A (en) * | 1986-12-08 | 1988-06-16 | 株式会社住友金属セラミックス | Method of joining ceramic to metal |
| CN106660177B (en) * | 2014-09-09 | 2020-02-21 | 株式会社村田制作所 | Metal composition and bonding material |
-
1983
- 1983-05-18 JP JP8591183A patent/JPS59212188A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107309575A (en) * | 2017-08-15 | 2017-11-03 | 广东威特真空电子制造有限公司 | Solder composition and solder and its preparation method and application |
| CN107309575B (en) * | 2017-08-15 | 2020-04-17 | 广东威特真空电子制造有限公司 | Solder composition, solder, preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59212188A (en) | 1984-12-01 |
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