JPS6040687A - Brazing filler metal of active metal - Google Patents
Brazing filler metal of active metalInfo
- Publication number
- JPS6040687A JPS6040687A JP14882983A JP14882983A JPS6040687A JP S6040687 A JPS6040687 A JP S6040687A JP 14882983 A JP14882983 A JP 14882983A JP 14882983 A JP14882983 A JP 14882983A JP S6040687 A JPS6040687 A JP S6040687A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- rare earth
- brazing filler
- active
- metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は希土類元素を含有する活性金属ろう祠に関する
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to active metal brazes containing rare earth elements.
金属とセラミックはそれぞれ異なった原子結合状態を有
し、従って金属とセラミックの化学反応性などの化学的
性質、また熱膨張率、電気伝導度などの物理的性質は、
大きく異なっている。そのため、両部材を良好にぬうし
、信頼性の高い冶金的接合を実施する方法が種々検討さ
八ている。Metals and ceramics have different atomic bonding states, so the chemical properties such as chemical reactivity and physical properties such as thermal expansion coefficient and electrical conductivity of metals and ceramics are
They are very different. Therefore, various methods have been studied to properly weld the two parts and to perform highly reliable metallurgical joining.
ろう接は、母材に変化を与えない。大きな加圧を必要と
しないまた、操作が容易であるなどの利点を有し、金属
とセラミックの接合で重要な接合法になっている。ここ
で金属とセラミックとを良好(:接合するろう材として
知られているもの(=、活性金属を含むろう拐がある。Brazing does not change the base material. This method does not require large amounts of pressure and is easy to operate, making it an important joining method for joining metals and ceramics. Here, there is a brazing material that contains active metals, which is known as a brazing material that joins metals and ceramics.
活性金属はTi 、Zrなど同期律表でIyb族の元素
を示し、いずれも金属とセラミックの接合に有効である
ことが知られている。とくに、活性金属はその融点が単
体では高< < Tt 1720℃、 Zr 1860
℃など)そのままでは通常のろう材として不向であるも
のの、CuNi、Feなとの遷移金属との合金において
はその共晶組成領域において融点を数百℃低下させ、た
とえば最も低いTl−Cu合金で872℃になる。この
ような現象に着目し、遷移金属母材とセラミック母材と
の接合部に活性金属を介在させたり、セラミックとセラ
ミックの母材の接合部に活性金属と遷移金属の両方を介
在させて前記合金を生成せしめ、接合を行う方法などが
特許(US PaT 2,857,663 )に開示さ
れている。さらに、活性金属と遷移金属との合金をろう
材として金属とセラミックとの接合を行う方法も考えら
れるが、活性金属と遷移金属との合金はその多くの組成
域で脆性で箔のようなろう材として望ましい形状にする
ことが困難であることから、前記合金を溶融紡糸法と呼
ばれる方法にて非晶質枯造を有する薄板に成形したろう
祠が開発され、特許(特開昭56−163093)に開
示されている。The active metals are elements of the Iyb group in the synchronous table, such as Ti and Zr, and both are known to be effective in joining metals and ceramics. In particular, active metals have a melting point of high << Tt 1720℃, Zr 1860℃.
Although it is not suitable as a normal brazing filler metal as it is, in alloys with transition metals such as CuNi and Fe, the melting point is lowered by several hundred degrees Celsius in the eutectic composition region, for example, the lowest Tl-Cu alloy. It becomes 872℃. Focusing on this phenomenon, we have introduced active metals at the joints between transition metal base materials and ceramic base materials, or interposed both active metals and transition metals at the joints between ceramic and ceramic base materials. A patent (US PaT 2,857,663) discloses a method for forming alloys and performing bonding. Another possibility is to use an alloy of an active metal and a transition metal as a brazing material to join metals and ceramics, but alloys of active metals and transition metals are brittle and foil-like in many composition ranges. Since it is difficult to form a material into a desired shape, a waxwork made by forming the alloy into a thin plate with an amorphous structure using a method called melt spinning was developed and patented (Japanese Unexamined Patent Publication No. 56-163093 ) is disclosed.
これらのろう材は多くの用途を満足させるものであった
。しかしながら前述のよう(二、金属とセラミックと−
の熱膨張係数は異なるものが多く、特にエレクトロニク
ス部品で多く必要とされるセラミックとCuのような組
み合わせの接合ではたとえばSi、N4セラミツクはそ
の熱膨張係数が約2.5XIO”−”/K、またAJN
は約4X10−’/にであるのに対してCuは17xl
O’/にであり、両者は、大きく異なる。そのため熱膨
張係数の大きく異なる金属とセラミックの接合において
は、度々加熱に伴う両相の熱膨張差に起因する応力の発
生(二よりセラミックラックが発生し問題となる。また
、前記応力は加熱温度が高い程増大するため、金属とセ
ラミックとの接合温度の低下、そのため(=は融点の低
いろう材でなおかつ金属とセラミックとの接合に適する
ろう伺の開発が望まれている。These brazing materials satisfied many uses. However, as mentioned above (2. Metals and ceramics)
There are many different thermal expansion coefficients, especially when bonding combinations such as ceramic and Cu, which are often required in electronic parts, for example, Si and N4 ceramics have a thermal expansion coefficient of about 2.5XIO"-"/K, Also AJN
is approximately 4X10-'/, while Cu is approximately 17xl
O'/, and the two are very different. Therefore, when joining metals and ceramics that have significantly different coefficients of thermal expansion, stress often occurs due to the difference in thermal expansion between the two phases due to heating (secondarily, a ceramic rack is generated, causing a problem. As the temperature increases as the temperature increases, the bonding temperature between metal and ceramic decreases.Therefore, it is desired to develop a brazing filler metal with a low melting point that is suitable for bonding metal and ceramic.
本発明は、前記問題点を改良し融点を低下し、かつ金属
とセラミックとの接合に適する活性金属ろう材の提供を
目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide an active metal brazing material which improves the above-mentioned problems, has a lower melting point, and is suitable for joining metals and ceramics.
本発明者らは、前記問題点を改良すべく鋭意研究を重ね
るなかで、遷移金属と活性金属との合金に、さらC:希
土類元素を添加することC−より、合金の融点を低下さ
せることができ、かつ、活性金属の効果により、金属と
セラミックとを良好に接合するろう材となりうろことを
見いだし本発明(=到った。In the course of intensive research to improve the above-mentioned problems, the inventors of the present invention discovered that by further adding C: a rare earth element to an alloy of a transition metal and an active metal, the melting point of the alloy was lowered by C-. The present invention was achieved by discovering a scale that can be used as a brazing material that can bond metals and ceramics well due to the effects of active metals.
すなわち、本発明は、遷移金属と活性金属との合金の中
でも、特に低い融点を有する合金を形成するCu、Ni
およびその合金とTiあるいはZrの組み合わせにより
得られる合金にLa、Ce、Prのような希土類元素を
添加させることを特徴とするものである。That is, the present invention utilizes Cu and Ni, which form an alloy having a particularly low melting point among alloys of transition metals and active metals.
It is characterized by adding rare earth elements such as La, Ce, and Pr to the alloy obtained by combining the alloy with Ti or Zr.
本発明において遷移金属と希土類元素と(特にCu−C
e、Cu−Pr、Ni −Ce )の合金は、その共晶
組成領域において、融点がそれぞれ415℃、472’
C、453℃であり、500℃以下の低い融点を有する
。そのため、前記活性金属と遷移金属との合金に、これ
らの希土類元素を添加するごとにより、さらに合金の融
点を低下することが号能である。希土類元素の添加量が
増加するに従って、合金の融点が低下する効果が大きい
。希土類元素の添加は合金の融点を低下するのみならず
、希土類類元素は酸素との親和力が強く、酸化物系セラ
ミックの接合においては、少量の希土類元素添加は、接
合部での楔止め効果や母材との化学結合の向上などの各
種機構(二よる酸化皮膜の剥離抑制効果が期待できる。In the present invention, transition metals and rare earth elements (especially Cu-C
In the eutectic composition region, the melting points of alloys of
C, 453°C, and has a low melting point of 500°C or less. Therefore, it is important to further lower the melting point of the alloy by adding these rare earth elements to the alloy of the active metal and transition metal. As the amount of rare earth elements added increases, the effect of lowering the melting point of the alloy becomes greater. Addition of rare earth elements not only lowers the melting point of the alloy, but also rare earth elements have a strong affinity with oxygen, and when joining oxide ceramics, the addition of a small amount of rare earth elements has a wedging effect and Various mechanisms such as improving chemical bonding with the base material can be expected to suppress the peeling of the oxide film.
さらに、希土類元素の添加量が多い場合には、接合部で
希土類元素の酸化物など化合物が生成する確率が高くな
り、そのため、金属とセラミックとの接合強度が緩和さ
れる現象が生じるが、これは同時に接合時に生じる熱応
力に対する緩和の効果が期待できるものである。Furthermore, when the amount of rare earth elements added is large, there is a high probability that compounds such as rare earth element oxides will be formed at the joint, which causes a phenomenon in which the joint strength between metal and ceramic is weakened. At the same time, it can be expected to have the effect of alleviating thermal stress generated during bonding.
希土類元素の量は、5原子%未満では、融点低下の効果
が少なく、また70原子%を越えると、ろう材の酸化が
生じる場合がある。If the amount of the rare earth element is less than 5 at %, the effect of lowering the melting point will be small, and if it exceeds 70 at %, oxidation of the brazing material may occur.
本発明(二おいて、接合すべきセラミックの対象は、窒
化物(AJN 、 8i、N、など)、炭化物(SiC
など)、酸化物(A7.o3など)をはじめとする各種
セラミックである。In the present invention (2), the ceramics to be bonded include nitrides (AJN, 8i, N, etc.) and carbides (SiC).
etc.) and various ceramics including oxides (A7.o3 etc.).
また、本発明の活性金属ろう材は常用の溶湯急冷法を適
用して製造することも可能である。すなわち、目的とす
るフィラーメタルの組成の溶融物を調整し、その溶融物
を高速回転する急冷用のドラムの上(:噴出せしめて製
造される。このとき、冷却速度を少なくとも10”T:
/5ff−こすることが好ましい。このようにして、
連続した箔で延性に富んだ活性金属ろう材が得られる。Further, the active metal brazing material of the present invention can also be manufactured by applying a commonly used molten metal quenching method. That is, it is manufactured by preparing a melt having the composition of the desired filler metal, and spouting the melt onto a rapidly rotating rapidly cooling drum. At this time, the cooling rate is set at least 10"T.
/5ff-rubbing is preferred. In this way,
A continuous foil provides a highly ductile active metal filler metal.
Cu72原子%、T128原子%を含む活性金属ろう材
にlO原子%のCe を添加したろう材ン調整した。前
記活性金属ろう材の融点が約880℃であったのに対し
、実施例によるろう材の融点は、約830Cであり、5
0℃の融点低下が確認された。A brazing filler metal was prepared by adding 10 at.% of Ce to an active metal brazing filler metal containing 72 at.% of Cu and 128 at.% of T. While the melting point of the active metal brazing material was about 880°C, the melting point of the brazing material according to the example was about 830°C, which was 5.
A decrease in melting point of 0°C was confirmed.
つぎに、溶湯急冷法で本発明に係る活性金属ろう材(厚
み40μm)を作製した。Next, an active metal brazing material (thickness: 40 μm) according to the present invention was produced by a molten metal quenching method.
lO龍角、厚さ2nのAANと10朋角で厚さ100μ
mの無酸素銅の接合面をトリクレンおよびアセトンで洗
浄、脱脂処理したのち、接合部に実施例のフィラーメタ
ルを挿入し、2 X 10 ”Torrの真空度にした
ホットプレス中にセットした。母材間に、上下方向から
0. I Kp /−の圧力を印加し高周波加熱(二よ
り接合部を850℃で10分間保持した。10 long angle, 2n thick AAN and 10 mm thick, 100μ thick
After cleaning and degreasing the joint surface of the oxygen-free copper with trichlene and acetone, the filler metal of the example was inserted into the joint and set in a hot press with a vacuum level of 2 x 10'' Torr. A pressure of 0. I Kp /- was applied from above and below between the materials, and high frequency heating was applied (the two-stranded joint was held at 850° C. for 10 minutes.
接合部断面を光学顕微鏡で観察した結果、接合部にボイ
ドやクラックは見られず、良好な接合状態を示していた
。As a result of observing the cross section of the joint using an optical microscope, no voids or cracks were observed in the joint, indicating a good joint condition.
本発明では以上の如く、融点が低下し金属とセラミック
との接合鑑二適する活性金属ろう相カー?尋られる。As described above, the present invention provides an active metal wax phase car that has a lower melting point and is suitable for joining metals and ceramics. asked.
代理人 弁理士 則 近 惹 佑 (他1名) PJ′r[ 0発 明 者 白 兼 誠 川1 り 奇1Agent: Patent Attorney Noriyuki Chika (1 other person) PJ′r[ 0 shots clear person white Kane Makotokawa 1 the law of nature Odd 1
Claims (1)
Ti、Zrの少なくとも1種15〜80原子%および5
原子%以上の希土類元素を含有する活性金属ろう伺。 (2)希土類元素か、5〜70原子%のLa、Ce。 Prの少なくとも1種である特許請求の範囲第1項記載
の活性金属ろう材。[Claims] (10 to 80 atomic % of at least one of Cu and Ni,
15 to 80 at% of at least one of Ti and Zr and 5
Active metal wax containing atomic percent or more of rare earth elements. (2) Rare earth elements, 5 to 70 atomic % La, Ce. The active metal brazing material according to claim 1, which is at least one type of Pr.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14882983A JPH0630829B2 (en) | 1983-08-16 | 1983-08-16 | Active metal brazing material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14882983A JPH0630829B2 (en) | 1983-08-16 | 1983-08-16 | Active metal brazing material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6040687A true JPS6040687A (en) | 1985-03-04 |
JPH0630829B2 JPH0630829B2 (en) | 1994-04-27 |
Family
ID=15461654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14882983A Expired - Lifetime JPH0630829B2 (en) | 1983-08-16 | 1983-08-16 | Active metal brazing material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0630829B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63273592A (en) * | 1987-04-30 | 1988-11-10 | Daido Steel Co Ltd | Ti brazing material |
JPS63309394A (en) * | 1987-06-09 | 1988-12-16 | Daido Steel Co Ltd | Brazing material |
JPH04157089A (en) * | 1990-10-18 | 1992-05-29 | Nippon Steel Corp | Ni base heat resisting brazing filler metal excellent in wettability and oxidation resistance |
JPH08255852A (en) * | 1987-02-10 | 1996-10-01 | Toshiba Corp | Electronic component |
KR20030012584A (en) * | 2001-08-01 | 2003-02-12 | 주식회사삼화합금사 | an alloy composition for a filler metal and preparation method thereof |
CN104772578A (en) * | 2015-04-10 | 2015-07-15 | 北京航空航天大学 | Brazing filler metal comprising titanium-zirconium-copper-nickel |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69510363T2 (en) * | 1994-10-14 | 1999-10-14 | Honda Motor Co Ltd | ROTOR FOR ROTATING MACHINE, METHOD FOR THE PRODUCTION THEREOF AND MAGNETIC UNIT |
CN102814600B (en) * | 2012-08-28 | 2015-05-20 | 广州有色金属研究院 | Amorphous foil brazing filler metal for ceramic braze welding |
CN110551918B (en) * | 2019-09-20 | 2020-09-04 | 安泰天龙钨钼科技有限公司 | Titanium alloy high-temperature brazing filler metal and preparation method thereof |
-
1983
- 1983-08-16 JP JP14882983A patent/JPH0630829B2/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08255852A (en) * | 1987-02-10 | 1996-10-01 | Toshiba Corp | Electronic component |
JPS63273592A (en) * | 1987-04-30 | 1988-11-10 | Daido Steel Co Ltd | Ti brazing material |
JPS63309394A (en) * | 1987-06-09 | 1988-12-16 | Daido Steel Co Ltd | Brazing material |
JPH04157089A (en) * | 1990-10-18 | 1992-05-29 | Nippon Steel Corp | Ni base heat resisting brazing filler metal excellent in wettability and oxidation resistance |
KR20030012584A (en) * | 2001-08-01 | 2003-02-12 | 주식회사삼화합금사 | an alloy composition for a filler metal and preparation method thereof |
CN104772578A (en) * | 2015-04-10 | 2015-07-15 | 北京航空航天大学 | Brazing filler metal comprising titanium-zirconium-copper-nickel |
CN104772578B (en) * | 2015-04-10 | 2018-01-09 | 北京航空航天大学 | A kind of solder for including titanium zirconium cupro-nickel |
Also Published As
Publication number | Publication date |
---|---|
JPH0630829B2 (en) | 1994-04-27 |
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