JPH0447963Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field to which the invention pertains] The invention involves fixing one surface of a semiconductor substrate to a conductive substrate in a conductive manner, and connecting at least two electrodes to an electrode on the upper surface of the semiconductor substrate by a conductive wire. The present invention relates to a semiconductor device in which two terminals and one terminal conductively fixed to a substrate are pulled out in a direction perpendicular to the substrate surface.

[Prior art and its problems]

2. Description of the Related Art In order to accommodate a semiconductor element having terminals, such as a transistor, in a package, a structure as shown in FIG. 1 is used. That is,
A transistor chip 1 is brazed to a metal substrate 2 which also serves as a heat sink, and a base electrode on the top surface of the chip 1 is bonded to the top surface of a base terminal 4 fixed to the substrate 2 via a ceramic plate 3 with an aluminum wire 5. Connecting. Further, the emitter electrode is similarly connected to the upper surface of an emitter terminal 6 fixed to the substrate 2 via the ceramic plate 3 by bonding with an A1 wire 5. On the other hand, since the collector is connected to the substrate 2, the collector terminal 7 is brazed to the substrate 2 on the open side of the chip 1.
It is bent at right angles together with the base terminal 4 and the emitter terminal 6, and the end portion is exposed from the sealing resin that protects the chip 1 (not shown) and is used for connection with an external circuit. In this case, the adhesive part between the collector terminal 7 and the substrate 2 requires a certain length l in order to ensure adhesive strength, and the substrate 2 must be lengthened by that amount, which increases the area occupied by the semiconductor device. growing.

[Purpose of invention]

An object of the present invention is to provide a structure that reduces the area occupied by such a semiconductor device.

[Key points of the invention] In order to achieve this purpose, the present invention has a three-dimensional terminal structure, in which one surface of a semiconductor substrate is conductively fixed to a conductive substrate that also serves as a heat sink, and the top surface of the semiconductor substrate is At least two first and third L-shaped terminals connected to the electrode by a conductive wire and insulated from the conductive substrate; and a second L-shaped terminal conductively fixed to the conductive substrate. in which one L-shaped end is placed on the conductive substrate and the other L-shaped end is pulled out in a direction perpendicular to the substrate surface of the conductive substrate; One ends of second and third terminals having the same length are located parallel to each other on the conductive substrate with the semiconductor substrate in between, and are connected to an electrode on the upper surface of the semiconductor substrate, one end of which is one end of the second terminal. A shorter first terminal is stacked on top of a second terminal with an insulator interposed therebetween, and the first terminal and the second terminal have their other ends pulled out at different longitudinal ends of the first terminal and the second terminal. The insulator is characterized in that the insulator is exposed at the tip of one end opposite to the other end from which the first terminal is pulled out.

[Example of idea]

In the embodiment shown in FIG. 2, parts common to those in FIG. 1 are given the same reference numerals. In FIG. 2, the collector terminal 7 is brazed to the edge of the substrate 2, which faces the base terminal 4 with the chip 1 in between. The emitter terminal 6 is laminated on the collector terminal 7 with an insulating ceramic plate 3 interposed therebetween. In this case, by leaving one end of the insulating plate 3 slightly exposed, the creepage distance can be increased. The ends of each terminal 4, 6, and 7 are bent at right angles and stand up as in FIG. 1, but the rising part 7 of the collector terminal
1 is provided on the side opposite to the rising portion 61 of the emitter terminal 6. In FIG. 2, this rising portion 71 is provided on the side of the collector terminal 7 when viewed in the longitudinal direction, but as shown in the side view of FIG. It may be formed into In either case, the connection between the emitter terminal 6 and the emitter electrode via the A1 wire 5 can be made using the same equipment and method as in the prior art.

With this configuration, the length of one side of the substrate 2 only needs to be slightly larger than the length of the semiconductor chip 1, and can be made shorter by the l dimension than in the case of FIG.

[Effect of idea]

This invention reduces the size of the semiconductor substrate supporting substrate of a semiconductor device, that is, the area occupied by the semiconductor device, by insulating and stacking the terminals connected to the electrodes on the top surface of the semiconductor substrate on top of the terminals directly connected to the substrate. This has an extremely large effect on the miniaturization of electronic devices. The present invention can be similarly effectively applied to other three-terminal semiconductor devices such as thyristors, or four-terminal semiconductor devices such as Darlington connected transistors.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the front of the package of an example of a conventional power transistor, Fig. 2 is a perspective view of the front of the package of one embodiment of the present invention, and Fig. 3 is a side view of the substrate section of another embodiment. . 1... Semiconductor chip, 2... Metal substrate, 3...
Ceramic board, 4... Base terminal, 5... Aluminum wire, 6... Emitter terminal, 7... Collector terminal, 61, 71... Terminal rising portion.

Claims (1)

[Scope of utility model registration request] One surface of the semiconductor substrate is electrically conductively fixed on a conductive substrate that also serves as a heat sink, and at least two first and second three L-shaped terminals, and a second L-shaped terminal conductively fixed to the conductive substrate.
Each of the L-shaped terminals has one L-shaped end placed on the conductive substrate and the other L-shaped end pulled out in a direction perpendicular to the substrate surface of the conductive substrate, wherein the conductive substrate One ends of the second and third terminals, which are equal in length in one direction, are located parallel to each other on the conductive substrate with the semiconductor substrate in between, and are connected to the electrode on the upper surface of the semiconductor substrate. A first terminal, which is shorter than one end of the terminal of A semiconductor device that is pulled out, and the insulator is exposed at the tip of one end of the first terminal opposite to the other end that is pulled out.