JPH044742U - - Google Patents
Info
- Publication number
- JPH044742U JPH044742U JP4472790U JP4472790U JPH044742U JP H044742 U JPH044742 U JP H044742U JP 4472790 U JP4472790 U JP 4472790U JP 4472790 U JP4472790 U JP 4472790U JP H044742 U JPH044742 U JP H044742U
- Authority
- JP
- Japan
- Prior art keywords
- metal mask
- semiconductor wafer
- chip
- mounting table
- electromagnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Landscapes
- Die Bonding (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4472790U JPH087628Y2 (ja) | 1990-04-26 | 1990-04-26 | 金属マスク押圧装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4472790U JPH087628Y2 (ja) | 1990-04-26 | 1990-04-26 | 金属マスク押圧装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH044742U true JPH044742U (US07860544-20101228-C00003.png) | 1992-01-16 |
| JPH087628Y2 JPH087628Y2 (ja) | 1996-03-04 |
Family
ID=31558284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4472790U Expired - Lifetime JPH087628Y2 (ja) | 1990-04-26 | 1990-04-26 | 金属マスク押圧装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087628Y2 (US07860544-20101228-C00003.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010050470A (ja) * | 1996-08-27 | 2010-03-04 | Nippon Steel Materials Co Ltd | ウエハー |
-
1990
- 1990-04-26 JP JP4472790U patent/JPH087628Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010050470A (ja) * | 1996-08-27 | 2010-03-04 | Nippon Steel Materials Co Ltd | ウエハー |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH087628Y2 (ja) | 1996-03-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |