JPH0445394Y2 - - Google Patents

Info

Publication number

JPH0445394Y2

JPH0445394Y2 JP1986065858U JP6585886U JPH0445394Y2 JP H0445394 Y2 JPH0445394 Y2 JP H0445394Y2 JP 1986065858 U JP1986065858 U JP 1986065858U JP 6585886 U JP6585886 U JP 6585886U JP H0445394 Y2 JPH0445394 Y2 JP H0445394Y2

Authority

JP

Japan

Prior art keywords

circuit board

insulated wire

conductive parts

core

cable

Prior art date

1986-04-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000004020 conductor Substances 0.000 claims description 8
• 239000011810 insulating material Substances 0.000 claims description 2
• 239000000758 substrate Substances 0.000 description 9
• 230000000694 effects Effects 0.000 description 3
• LNUFLCYMSVYYNW-ZPJMAFJPSA-N [(2r,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6r)-6-[(2r,3r,4s,5r,6r)-6-[(2r,3r,4s,5r,6r)-6-[[(3s,5s,8r,9s,10s,13r,14s,17r)-10,13-dimethyl-17-[(2r)-6-methylheptan-2-yl]-2,3,4,5,6,7,8,9,11,12,14,15,16,17-tetradecahydro-1h-cyclopenta[a]phenanthren-3-yl]oxy]-4,5-disulfo Chemical compound O([C@@H]1[C@@H](COS(O)(=O)=O)O[C@@H]([C@@H]([C@H]1OS(O)(=O)=O)OS(O)(=O)=O)O[C@@H]1[C@@H](COS(O)(=O)=O)O[C@@H]([C@@H]([C@H]1OS(O)(=O)=O)OS(O)(=O)=O)O[C@@H]1[C@@H](COS(O)(=O)=O)O[C@H]([C@@H]([C@H]1OS(O)(=O)=O)OS(O)(=O)=O)O[C@@H]1C[C@@H]2CC[C@H]3[C@@H]4CC[C@@H]([C@]4(CC[C@@H]3[C@@]2(C)CC1)C)[C@H](C)CCCC(C)C)[C@H]1O[C@H](COS(O)(=O)=O)[C@@H](OS(O)(=O)=O)[C@H](OS(O)(=O)=O)[C@H]1OS(O)(=O)=O LNUFLCYMSVYYNW-ZPJMAFJPSA-N 0.000 description 2
• 229940125898 compound 5 Drugs 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• 239000004925 Acrylic resin Substances 0.000 description 1
• 229920000178 Acrylic resin Polymers 0.000 description 1
• 229920001342 Bakelite® Polymers 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000004593 Epoxy Substances 0.000 description 1
• 239000004637 bakelite Substances 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229940125904 compound 1 Drugs 0.000 description 1
• 150000001875 compounds Chemical class 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 239000011521 glass Substances 0.000 description 1
• 238000009413 insulation Methods 0.000 description 1
• 230000000149 penetrating effect Effects 0.000 description 1
• 239000011253 protective coating Substances 0.000 description 1