JPH0445251Y2 - - Google Patents
Info
- Publication number
- JPH0445251Y2 JPH0445251Y2 JP421686U JP421686U JPH0445251Y2 JP H0445251 Y2 JPH0445251 Y2 JP H0445251Y2 JP 421686 U JP421686 U JP 421686U JP 421686 U JP421686 U JP 421686U JP H0445251 Y2 JPH0445251 Y2 JP H0445251Y2
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- lead terminal
- resin
- substrate
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000009413 insulation Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP421686U JPH0445251Y2 (US07534539-20090519-C00280.png) | 1986-01-14 | 1986-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP421686U JPH0445251Y2 (US07534539-20090519-C00280.png) | 1986-01-14 | 1986-01-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62116553U JPS62116553U (US07534539-20090519-C00280.png) | 1987-07-24 |
| JPH0445251Y2 true JPH0445251Y2 (US07534539-20090519-C00280.png) | 1992-10-23 |
Family
ID=30784683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP421686U Expired JPH0445251Y2 (US07534539-20090519-C00280.png) | 1986-01-14 | 1986-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0445251Y2 (US07534539-20090519-C00280.png) |
-
1986
- 1986-01-14 JP JP421686U patent/JPH0445251Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62116553U (US07534539-20090519-C00280.png) | 1987-07-24 |
