JPH0444217Y2 - - Google Patents
Info
- Publication number
- JPH0444217Y2 JPH0444217Y2 JP1985153309U JP15330985U JPH0444217Y2 JP H0444217 Y2 JPH0444217 Y2 JP H0444217Y2 JP 1985153309 U JP1985153309 U JP 1985153309U JP 15330985 U JP15330985 U JP 15330985U JP H0444217 Y2 JPH0444217 Y2 JP H0444217Y2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- spinner
- solvent
- coating liquid
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011248 coating agent Substances 0.000 claims description 39
- 238000000576 coating method Methods 0.000 claims description 39
- 239000007788 liquid Substances 0.000 claims description 30
- 239000002904 solvent Substances 0.000 claims description 30
- 239000007789 gas Substances 0.000 description 5
- 239000003595 mist Substances 0.000 description 5
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は半導体ウエハー、金属板、セラミツク
ス、プリント基板或いはガラス板等の被処理物表
面に膜形成用塗布液を塗布する装置に関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an apparatus for applying a film-forming coating liquid to the surface of a workpiece such as a semiconductor wafer, metal plate, ceramics, printed circuit board, or glass plate.
（従来の技術）
半導体ウエハーなどの被処理物の表面にホトレ
ジスト或いは拡散材を塗布する装置としてスピン
ナーを備えた装置が知られている。(Prior Art) A device equipped with a spinner is known as a device for applying photoresist or a diffusion material to the surface of a workpiece such as a semiconductor wafer.
この塗布装置は上方が開放された筒状ケース内
にスピンナーを配置し、このスピンナー上面に被
処理物を載置するとともにスピンナー上面に形成
した真空引き用の溝で被処理物を吸着し、スピン
ナーの回転によつて被処理物を一体的に回転せし
め、この回転に伴う遠心力で、上方のノズルから
滴下した塗布液を、被処理物表面に均一に広げる
ようにしたものである。 In this coating device, a spinner is placed in a cylindrical case with an open top, and the workpiece is placed on top of the spinner, and the workpiece is sucked by a vacuum groove formed on the top of the spinner. The object to be treated is rotated integrally by the rotation of the , and the centrifugal force accompanying this rotation causes the coating liquid dropped from the upper nozzle to be spread uniformly over the surface of the object to be treated.
（考案が解決しようとする問題点）
ところで被処理物表面に滴下した塗布液は、ス
ピンナーの回転に伴う遠心力によつて被処理物の
外周部に至つたのち、次第に下面に廻り込むこと
となる。さらにこの廻り込んだ塗布液は放置する
と塗布液中の溶媒が蒸発して被処理物に固化付着
し、このままの状態で被処理物を後の搬送行程等
におくと、固化付着した塗膜が破壊・剥離され小
片と化す。この小片が次工程に於て被処理物表面
に付着して、塗膜を不均一なものとし、結果とし
て製品不良を惹起し、歩留りを低下せしめてい
た。(Problem to be solved by the invention) By the way, the coating liquid dropped onto the surface of the workpiece reaches the outer periphery of the workpiece due to the centrifugal force caused by the rotation of the spinner, and then gradually goes around the bottom surface of the workpiece. Become. Furthermore, if the coating liquid that has gone around is left to stand, the solvent in the coating liquid will evaporate and it will solidify and adhere to the object to be treated, and if the object to be treated is left in this state for the subsequent transportation process, the solidified coating film will be removed. It is destroyed and peeled off into small pieces. These small pieces adhere to the surface of the object to be treated in the next step, making the coating film non-uniform, resulting in product defects and lower yields.
（問題点を解決するための手段）
上記問題点を解決すべく本考案は、被処理物の
外周部下面に向けて溶剤を噴出する噴出流路をス
ピンナーガイドに形成して、この溶剤によつて被
処理物の外周部下面に廻り込んだ塗布液を除去す
るようにした。(Means for Solving the Problems) In order to solve the above problems, the present invention forms a jet flow path in the spinner guide that jets the solvent toward the lower surface of the outer periphery of the workpiece, and The coating liquid that has gotten around to the lower surface of the outer periphery of the object to be treated is removed.
（実施例）
以下に本考案の実施例を添付図面に基いて説明
する。(Example) An example of the present invention will be described below based on the accompanying drawings.
第１図は本考案に係る塗布装置の縦断面図、第
２図は同塗布装置の平面図であり、塗布装置のケ
ース１は上板２、壁板３及び底板４から構成さ
れ、上板２及び底板４の中央には円孔５，６が形
成され、底板４の円孔６の周囲には突部７が形成
され、この突部７上にスピンナーガイド８が取付
けられ、このスピンナーガイド８によつて形成さ
れる空間に下方からスピンナー９が臨んでいる。
スピンナー９はモータ１０によつて回転せしめら
れるとともに、その上部は大径部とされ、上面に
は第３図に示す如く同心円状の多数の真空引き用
の溝１１及びこれら溝１１をつなぐ十字状の真空
引き用の溝１２が穿設されている。 FIG. 1 is a longitudinal cross-sectional view of a coating device according to the present invention, and FIG. 2 is a plan view of the same coating device. 2 and the bottom plate 4 are formed with circular holes 5 and 6, and a protrusion 7 is formed around the circular hole 6 of the bottom plate 4. A spinner guide 8 is mounted on the protrusion 7, and the spinner guide 8 is attached to the protrusion 7. A spinner 9 faces the space formed by the spinner 8 from below.
The spinner 9 is rotated by a motor 10, and its upper part has a large diameter part, and the upper surface has a large number of concentric vacuum grooves 11 and a cross shape connecting these grooves 11, as shown in FIG. A groove 12 for vacuuming is bored.
また、上板２の下部には径方向外方に向つて下
方に下がる壁部１３を形成し、この壁部１３によ
つて真空ポンプとつながる排気通路１４を画成
し、この排気通路１４と壁板３及び壁部１３間に
形成される吸引室１５とを孔１６によつて連通し
ている。 Further, a wall portion 13 is formed at the lower part of the upper plate 2 and extends downward in the radial direction, and this wall portion 13 defines an exhaust passage 14 connected to a vacuum pump. A suction chamber 15 formed between the wall plate 3 and the wall portion 13 is communicated with each other through a hole 16 .
また、上板２の円孔５にはリング部材１７を嵌
着している。このリング部材１７の下部はスカー
ト部１７ａとされ、このスカート部１７ａは前記
吸引室１５に垂下し、スピンナーガイド８上面と
スカート部１７ａ下端との間の隙間を絞つてい
る。 Further, a ring member 17 is fitted into the circular hole 5 of the upper plate 2. The lower part of the ring member 17 is a skirt portion 17a, which hangs down into the suction chamber 15 and narrows the gap between the upper surface of the spinner guide 8 and the lower end of the skirt portion 17a.
更に、壁板３の下部には径方向内方に向つて突
出するガイド部１８を一体的に形成し、このガイ
ド部１８上面を傾斜面とし、ガイド部１８の内端
部と前記突部７外周部との間に溶剤の流入口１９
を形成している。そして、ガイド部１８の下面と
底板４の上面との間には溶剤の溜り部２０を形成
し、この溜り部２０内に流入した溶剤（塗布液を
含む）を排出口２１及びパイプ２２を介して回収
するようにしている。 Furthermore, a guide portion 18 that protrudes radially inward is integrally formed at the lower part of the wall plate 3, and the upper surface of this guide portion 18 is an inclined surface, so that the inner end of the guide portion 18 and the protrusion 7 A solvent inlet 19 is provided between the outer circumference and the
is formed. A solvent reservoir 20 is formed between the lower surface of the guide section 18 and the upper surface of the bottom plate 4, and the solvent (including the coating liquid) flowing into the reservoir 20 is passed through the discharge port 21 and the pipe 22. We are trying to collect them.
一方、上板２には溶剤の供給源とつながる溶剤
の流路２３及びN2ガス等の不活性ガス源につな
がるガス通路２４が穿設され、溶剤の流路２３は
壁部１３に嵌め込んだノズル２３ａに接続され、
ノズル２３ａから壁部１３表面に溶剤を供給する
ようにしている。またガス通路２４はガス噴出孔
２５につながつており、このガス噴出孔２５は周
方向に等間隔で多数設けられ、且つガス噴出孔２
５の向きは塗布液の滴下ノズル２６の上方に向い
ており、スピンナー９に吸着された被処理物Ｗ上
方の雰囲気をN2に富んだものとし、例えば塗布
液がアンチモンを含むものであるような場合に、
アンチモンは空気中の水分と接触すると変質する
ので、空気中の水分を少なくし、吸湿防止を図つ
ている。 On the other hand, the upper plate 2 is provided with a solvent passage 23 connected to a solvent supply source and a gas passage 24 connected to an inert gas source such as N2 gas, and the solvent passage 23 is fitted into the wall 13. It is connected to the nozzle 23a,
The solvent is supplied to the surface of the wall portion 13 from the nozzle 23a. Further, the gas passage 24 is connected to gas ejection holes 25, and a large number of gas ejection holes 25 are provided at equal intervals in the circumferential direction.
5 faces above the coating liquid dropping nozzle 26, and the atmosphere above the workpiece W adsorbed by the spinner 9 is rich in N2 , for example, when the coating liquid contains antimony. To,
Antimony deteriorates when it comes into contact with moisture in the air, so efforts are being made to reduce moisture in the air and prevent moisture absorption.
また、底板４にも溶剤の供給源とつながる溶剤
の流路２７が穿設され、この流路２７はスピンナ
ーガイド８に被処理物外周部下面方向に向けて穿
設された溶剤の噴出流路２８に連通している。こ
の噴出流路２８から噴出した溶剤によつて被処理
物Ｗの外周部下面に廻り込んだ第４図に示す如き
塗布液Ａを除去し、さらにこの溶剤は戻り流路２
９を通つて下方に導かれ溶剤の溜り部２０内に流
入するようにしている。 Further, a solvent flow path 27 connected to a solvent supply source is also formed in the bottom plate 4, and this flow path 27 is a solvent jet flow path formed in the spinner guide 8 toward the lower surface of the outer periphery of the object to be treated. It is connected to 28. The solvent ejected from the ejection channel 28 removes the coating liquid A as shown in FIG.
9 and is guided downward into a reservoir 20 of the solvent.
戻り流路２９によつて使用済みの溶剤が溜り部
２０内へ流入する上記の構成は、被処理物Ｗの外
周部下面に付着した塗布液Ａ及び溶剤の除去を迅
速に行う事が可能であり、またこの迅速な除去に
よつてスピンナー９の回転による上記塗布液Ａ及
び溶剤の飛散を防ぐ効果がある。 The above configuration in which the used solvent flows into the reservoir 20 through the return flow path 29 makes it possible to quickly remove the coating liquid A and the solvent attached to the lower surface of the outer periphery of the workpiece W. Moreover, this rapid removal has the effect of preventing the coating liquid A and the solvent from scattering due to the rotation of the spinner 9.
以上の如き構成からなる塗布装置の作用を以下
に述べる。 The operation of the coating device constructed as above will be described below.
先ず、スピンナー９の上面に被処理物Ｗを載置
し、真空引きして被処理物Ｗをスピンナー９上面
に吸着する。次いで滴下ノズル２６から塗布液を
被処理物Ｗの中心に滴下する。このとき、被処理
物Ｗ上方の雰囲気は噴出孔２５からの不活性ガ
ス、例えばN2ガスによつて水分の少ない雰囲気
となつているため、塗布液がアンチモンを含むよ
うな場合であつても塗布液が吸湿することがな
い。 First, the workpiece W is placed on the upper surface of the spinner 9, and vacuum is applied to attract the workpiece W to the upper surface of the spinner 9. Next, the coating liquid is dropped from the dropping nozzle 26 onto the center of the object W to be processed. At this time, the atmosphere above the workpiece W is low in moisture due to the inert gas e.g. The coating solution does not absorb moisture.
そして、被処理物Ｗ上に塗布液を滴下するとと
もに、モータ１０によつてスピンナー９を回転せ
しめ、スピンナー９と一体的に被処理物Ｗを回転
せしめ、この回転に伴なう遠心力で塗布液を被処
理物Ｗ表面に均一に広げる。 Then, the coating liquid is dropped onto the workpiece W, and the spinner 9 is rotated by the motor 10 to rotate the workpiece W integrally with the spinner 9, and the centrifugal force accompanying this rotation is used to coat the workpiece W. Spread the liquid uniformly on the surface of the object W to be processed.
ここで、被処理物Ｗ上に滴下された塗布液の一
部は遠心力によつて飛散し、吸引室１５の内壁に
付着する、しかしながら吸引室１５の内壁にはノ
ズル２３ａからの溶剤が流下しているため、飛散
して付着した塗布液は、この溶剤中に溶け込み、
吸引室１５の内壁及びガイド部１８の上面をつた
つて溜り部２０内に流れ込み、この溜り部２０か
ら排出口２１及びパイプ２２を介して回収され
る。 Here, a part of the coating liquid dropped onto the workpiece W is scattered by centrifugal force and adheres to the inner wall of the suction chamber 15. However, the solvent from the nozzle 23a flows down onto the inner wall of the suction chamber 15. Because of this, the coating liquid that scatters and adheres to the solvent dissolves in this solvent.
It flows into the reservoir section 20 through the inner wall of the suction chamber 15 and the upper surface of the guide section 18, and is collected from the reservoir section 20 via the discharge port 21 and the pipe 22.
また、滴下された塗布液の一部はミスト状とな
つて吸引室１５内及び被処理物Ｗ上方に飛散す
る。ここで、前記リング部材１７のスカート部１
７ａは吸引室１５内に垂下しているため、吸引室
１５内に飛散したミスト状塗布液は被処理物Ｗ上
方に流れることはなく、また垂下するスカート部
１７ａは、スピンナーガイド８上面とスカート部
１７ａ下端との間の隙間を絞つているため、被処
理物Ｗ上方に舞い上がつたミスト状塗布液は該隙
間を介して強制的に吸引室１５内に吸引され、ミ
スト状塗布液はいずれも孔１６を介して排気通路
１４内に吸引されて外部に排出されるので、被処
理物Ｗ表面にミスト状塗布液が落下することがな
い。 Further, a part of the dropped coating liquid becomes a mist and scatters inside the suction chamber 15 and above the object W to be treated. Here, the skirt portion 1 of the ring member 17
7a hangs down inside the suction chamber 15, the mist coating liquid scattered inside the suction chamber 15 does not flow above the workpiece W, and the hanging skirt part 17a is connected to the upper surface of the spinner guide 8 and the skirt. Since the gap between the lower end of the part 17a and the lower end of the part 17a is narrowed, the mist coating liquid that has risen above the workpiece W is forcibly sucked into the suction chamber 15 through the gap, and the mist coating liquid is Since both are sucked into the exhaust passage 14 through the hole 16 and discharged to the outside, the mist coating liquid does not fall onto the surface of the object W to be treated.
更に、被処理物Ｗ表面に広がつた塗布液の一部
は被処理物Ｗの周縁から下面に廻り込むが、この
廻り込んだ塗布液Ａは噴出流路２８から噴出する
溶剤によつて除去される。 Further, a part of the coating liquid that has spread over the surface of the workpiece W goes around from the periphery of the workpiece W to the lower surface, but this spread coating liquid A is removed by the solvent jetted from the jetting channel 28. be done.
（考案の効果）
以上に説明したように、本考案によれば、被処
理物の外周部下面に向けて溶剤を噴出する噴出流
路をスピンナーガイドに形成したので、被処理物
表面上に滴下した塗布液の一部が被処理物の外周
部下面に廻り込んだとしても、この廻り込んだ塗
布液を溶剤によつて除去することが可能となる。
従つて廻り込んだ塗布液の放置による弊害、例え
ばピンホールの発生や不均一な膜の形成を防止で
き、製品の歩留りを著しく向上することができ
る。(Effects of the invention) As explained above, according to the invention, a jet flow path is formed in the spinner guide for jetting the solvent toward the lower surface of the outer periphery of the workpiece, so that the solvent is dripped onto the surface of the workpiece. Even if a part of the applied coating liquid flows around to the lower surface of the outer periphery of the object to be treated, it is possible to remove the applied liquid that has spread around with the solvent.
Therefore, it is possible to prevent the harmful effects caused by leaving the coating liquid that has spread around, such as the generation of pinholes and the formation of non-uniform films, and it is possible to significantly improve the yield of products.
また戻り流路を形成したことにより、噴出流路
から噴出した溶剤及びこの溶剤に溶け込んだ塗布
液は速やかに溶剤の溜り部に導かれることとなり
好都合である上、スピンナーの回転により生ずる
塗布液含有溶剤の飛散を防ぐことも可能となる。 In addition, by forming the return flow path, the solvent spouted from the jet flow path and the coating liquid dissolved in this solvent are quickly guided to the solvent reservoir, which is convenient. It is also possible to prevent the solvent from scattering.
第１図は本考案に係る塗布装置の縦断面図、第
２図は同塗布装置の平面図、第３図はスピンナー
の斜視図、第４図は被処理物の外周部を示す拡大
断面図である。
尚、図面中１はケース、８はスピンナーガイ
ド、９はスピンナー、２６は滴下ノズル、２８は
噴出流路、２９は戻り流路、Ｗは被処理物、Ａは
廻り込んだ塗布液である。
Fig. 1 is a longitudinal sectional view of the coating device according to the present invention, Fig. 2 is a plan view of the coating device, Fig. 3 is a perspective view of the spinner, and Fig. 4 is an enlarged sectional view showing the outer periphery of the object to be treated. It is. In the drawings, 1 is a case, 8 is a spinner guide, 9 is a spinner, 26 is a dripping nozzle, 28 is an ejection flow path, 29 is a return flow path, W is a workpiece, and A is a coating liquid that has gone around.
Claims (1)
方からスピンナー９を臨ませ、このスピンナー９
上に被処理物Ｗを載置し、スピンナー９にて被処
理物Ｗを回転せしめることで被処理物Ｗ表面に滴
下ノズル２６から滴下した塗布液を遠心力で被処
理物Ｗ表面に均一に広げるようにした塗布装置に
おいて、前記スピンナーガイド８に被処理物Ｗの
外周部下面に向けて溶剤を噴出する噴出流路２８
及び、噴出流路２８から噴出した溶剤を下方に導
く戻り流路２９を形成したことを特徴とする塗布
装置。 A spinner 9 is placed in the spinner guide 8 provided in the case 1 and is placed in the spinner guide 8 from below.
The workpiece W is placed on top of the workpiece W, and by rotating the workpiece W using the spinner 9, the coating liquid dropped from the dripping nozzle 26 onto the surface of the workpiece W is uniformly distributed over the surface of the workpiece W by centrifugal force. In the spreadable coating device, the spinner guide 8 includes a jetting passage 28 that jets the solvent toward the lower surface of the outer periphery of the workpiece W.
A coating device characterized in that a return flow path 29 is formed to guide the solvent jetted from the jet flow path 28 downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985153309U JPH0444217Y2 (en) | 1985-10-07 | 1985-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985153309U JPH0444217Y2 (en) | 1985-10-07 | 1985-10-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6262869U JPS6262869U (en) | 1987-04-18 |
| JPH0444217Y2 true JPH0444217Y2 (en) | 1992-10-19 |
Family
ID=31072075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985153309U Expired JPH0444217Y2 (en) | 1985-10-07 | 1985-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444217Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS636843A (en) * | 1986-06-26 | 1988-01-12 | Dainippon Screen Mfg Co Ltd | Substrate surface treatment |
| JP2767308B2 (en) * | 1990-01-25 | 1998-06-18 | 富士写真フイルム株式会社 | Method for manufacturing optical information recording medium |
| JP5029486B2 (en) | 2008-05-13 | 2012-09-19 | 東京エレクトロン株式会社 | Coating apparatus, coating method, and storage medium |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57201564A (en) * | 1981-06-01 | 1982-12-10 | Dainippon Printing Co Ltd | Coating method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074775U (en) * | 1984-09-13 | 1985-05-25 | 大日本スクリーン製造株式会社 | Rotary surface treatment equipment |
-
1985
- 1985-10-07 JP JP1985153309U patent/JPH0444217Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57201564A (en) * | 1981-06-01 | 1982-12-10 | Dainippon Printing Co Ltd | Coating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6262869U (en) | 1987-04-18 |
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