JPH0444144U - - Google Patents

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Publication number
JPH0444144U
JPH0444144U JP8712390U JP8712390U JPH0444144U JP H0444144 U JPH0444144 U JP H0444144U JP 8712390 U JP8712390 U JP 8712390U JP 8712390 U JP8712390 U JP 8712390U JP H0444144 U JPH0444144 U JP H0444144U
Authority
JP
Japan
Prior art keywords
package
semiconductor
encapsulation mold
resin
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8712390U
Other languages
English (en)
Japanese (ja)
Other versions
JP2543657Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990087123U priority Critical patent/JP2543657Y2/ja
Publication of JPH0444144U publication Critical patent/JPH0444144U/ja
Application granted granted Critical
Publication of JP2543657Y2 publication Critical patent/JP2543657Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1990087123U 1990-08-21 1990-08-21 半導体製造装置 Expired - Lifetime JP2543657Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990087123U JP2543657Y2 (ja) 1990-08-21 1990-08-21 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990087123U JP2543657Y2 (ja) 1990-08-21 1990-08-21 半導体製造装置

Publications (2)

Publication Number Publication Date
JPH0444144U true JPH0444144U (enrdf_load_stackoverflow) 1992-04-15
JP2543657Y2 JP2543657Y2 (ja) 1997-08-13

Family

ID=31819214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990087123U Expired - Lifetime JP2543657Y2 (ja) 1990-08-21 1990-08-21 半導体製造装置

Country Status (1)

Country Link
JP (1) JP2543657Y2 (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180126A (ja) * 1984-02-28 1985-09-13 Toshiba Corp 半導体装置の製造方法
JPS63237422A (ja) * 1987-03-25 1988-10-03 Seiko Keiyo Kogyo Kk レジンモ−ルド半導体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180126A (ja) * 1984-02-28 1985-09-13 Toshiba Corp 半導体装置の製造方法
JPS63237422A (ja) * 1987-03-25 1988-10-03 Seiko Keiyo Kogyo Kk レジンモ−ルド半導体の製造方法

Also Published As

Publication number Publication date
JP2543657Y2 (ja) 1997-08-13

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