JPH044328B2 - - Google Patents

Info

Publication number
JPH044328B2
JPH044328B2 JP5922382A JP5922382A JPH044328B2 JP H044328 B2 JPH044328 B2 JP H044328B2 JP 5922382 A JP5922382 A JP 5922382A JP 5922382 A JP5922382 A JP 5922382A JP H044328 B2 JPH044328 B2 JP H044328B2
Authority
JP
Japan
Prior art keywords
parts
epoxy resin
resin
weight
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5922382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58176237A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5922382A priority Critical patent/JPS58176237A/ja
Publication of JPS58176237A publication Critical patent/JPS58176237A/ja
Publication of JPH044328B2 publication Critical patent/JPH044328B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
JP5922382A 1982-04-09 1982-04-09 半導体封止用エポキシ樹脂組成物 Granted JPS58176237A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5922382A JPS58176237A (ja) 1982-04-09 1982-04-09 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5922382A JPS58176237A (ja) 1982-04-09 1982-04-09 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58176237A JPS58176237A (ja) 1983-10-15
JPH044328B2 true JPH044328B2 (US06168776-20010102-C00041.png) 1992-01-28

Family

ID=13107159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5922382A Granted JPS58176237A (ja) 1982-04-09 1982-04-09 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58176237A (US06168776-20010102-C00041.png)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62212422A (ja) * 1986-03-14 1987-09-18 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH036213A (ja) * 1989-06-01 1991-01-11 Matsushita Electric Ind Co Ltd 紫外線硬化型樹脂
JP3410173B2 (ja) * 1993-11-02 2003-05-26 三井化学株式会社 エポキシ樹脂組成物から成形された半導体装置用中空パッケージならびにそれを用いた半導体装置
US5965269A (en) * 1995-04-04 1999-10-12 Hitachi Chemical Company, Ltd. Adhesive, adhesive film and adhesive-backed metal foil
JP3289125B2 (ja) 1996-03-15 2002-06-04 ソニーケミカル株式会社 光情報記録媒体
JP2006344651A (ja) * 2005-06-07 2006-12-21 Hitachi Chem Co Ltd 熱硬化性樹脂ペースト及びこれを用いたフレキシブル配線板

Also Published As

Publication number Publication date
JPS58176237A (ja) 1983-10-15

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