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Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP1987160138UpriorityCriticalpatent/JPH0442939Y2/ja
Publication of JPH0165138UpublicationCriticalpatent/JPH0165138U/ja
Application grantedgrantedCritical
Publication of JPH0442939Y2publicationCriticalpatent/JPH0442939Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
H01L2224/4805—Shape
H01L2224/4809—Loop shape
H01L2224/48091—Arched
Landscapes
Combinations Of Printed Boards
(AREA)
Lead Frames For Integrated Circuits
(AREA)
Casings For Electric Apparatus
(AREA)
Insulated Metal Substrates For Printed Circuits
(AREA)
Structures For Mounting Electric Components On Printed Circuit Boards
(AREA)
Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure