JPH0442739Y2 - - Google Patents
Info
- Publication number
- JPH0442739Y2 JPH0442739Y2 JP1985170630U JP17063085U JPH0442739Y2 JP H0442739 Y2 JPH0442739 Y2 JP H0442739Y2 JP 1985170630 U JP1985170630 U JP 1985170630U JP 17063085 U JP17063085 U JP 17063085U JP H0442739 Y2 JPH0442739 Y2 JP H0442739Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- substrate
- optical sensor
- light
- transmission window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 description 11
- 239000004698 Polyethylene Substances 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
この考案は、赤外線センサ、紫外線センサなど
の光センサを構成する一部品である、パツケイジ
の構造に関するものである。[Detailed Description of the Invention] (Industrial Application Field) This invention relates to the structure of a package, which is a part of an optical sensor such as an infrared sensor or an ultraviolet sensor.
（従来の技術と問題点）
一般に光センサは、第３図に示すように、光セ
ンサ素子１′を取付けた基板２′に、合成樹脂製、
又は42アロイ等の金属製のパツケイジ３′を冠着
して構成される。(Prior Art and Problems) Generally, as shown in FIG.
Alternatively, it is constructed by attaching a package 3' made of metal such as 42 alloy.
赤外線センサを例にとると、このパツケイジの
上面に設けられた開口部４′には、特定波長領域
の赤外線のみを選択的に透過させる必要がある場
合は、多層膜赤外干渉フイルタ５′が、又は、実
際の使用にあたつて、赤外光のみの選択的透過が
必要でない場合は、ポリエチレンフイルムが貼着
けられている。後者の場合は、赤外線センサ素子
を外部環境から隔絶し、かつ物理的外力からの保
護のみの機能を有する。 Taking an infrared sensor as an example, if it is necessary to selectively transmit only infrared rays in a specific wavelength range, a multilayer infrared interference filter 5' is installed in the opening 4' provided on the top surface of the package. Or, in actual use, if selective transmission of only infrared light is not required, a polyethylene film is attached. In the latter case, the infrared sensor element only has the function of isolating the infrared sensor element from the external environment and protecting it from physical external forces.
いずれの場合も、パツケイジに設けた開口部
に、フイルタ、又はポリエチレンフイルムを貼着
する構成であるため、センサの組立は面倒かつ複
雑な工程を必要とするばかりか、薄いフイルタ、
フイルムを貼着して開口部を塞いでいるので、使
用中に劣化して外気が流入したり、外力で破損す
るなどの欠点があつた。 In either case, the filter or polyethylene film is pasted into the opening provided in the package cage, so assembling the sensor not only requires a troublesome and complicated process, but also requires a thin filter or polyethylene film.
Since the opening is covered with a film, it deteriorates during use, causing outside air to flow in, and causing damage due to external force.
（問題点を解決するための手段）
この考案は、特定波長領域の光を選択的に透過
させる必要がない光センサに用いるもので、光セ
ンサ素子を取付けた基板に冠着される合成樹脂製
パツケイジと光透過用窓とを一体に形成したもの
である。(Means for solving the problem) This idea is used in optical sensors that do not require selective transmission of light in a specific wavelength range, and is made of synthetic resin that is attached to a substrate on which the optical sensor element is mounted. A package and a light transmission window are integrally formed.
（作用）
光透過用窓がパツケイジと一体に形成されてい
るので、光透過用窓の強度が大となり、光センサ
を外部環境から隔絶する機能、物理的外力に対す
る抵抗力が大きくなる。さらに、光センサ組立が
簡単となる。(Function) Since the light transmission window is formed integrally with the package, the strength of the light transmission window is increased, and the function of isolating the optical sensor from the external environment and the resistance against physical external forces are increased. Furthermore, the optical sensor assembly is simplified.
（実施例）
第１図ないし第２図は、赤外光のみを選択的に
透過させる必要がない赤外線センサに使用する実
施例を示す。(Embodiment) FIGS. 1 and 2 show an embodiment used in an infrared sensor that does not require selective transmission of only infrared light.
１はポリエチレン製の箱状パツケイジで、上面
中央には、厚み0.2mm以下の光透過窓２が、イン
ジエクシヨンモールドにより、パツケイジと一体
に成型されている。ここで、光透過用窓２の厚み
が、0.2mm以上になると、透過光の減衰が大きく
実用的でない。勿論、この光透過用窓の上下両面
は鏡面に仕上げられる。 Reference numeral 1 denotes a box-shaped package made of polyethylene, and a light transmitting window 2 with a thickness of 0.2 mm or less is molded integrally with the package at the center of the upper surface by injection molding. Here, if the thickness of the light transmission window 2 is 0.2 mm or more, the attenuation of the transmitted light is large and it is not practical. Of course, both the upper and lower surfaces of this light transmission window are finished with mirror surfaces.
又、パツケイジ１の内側面には、対向する突起
３が設けられている。赤外線センサ組立時、赤外
線センサ素子４を取付けた基板５の外側面に、前
記突起３に対応して設けた凹部６へこの突起を嵌
め込めば、容易にパツケイジを基板に冠着できる
ように構成されている。 Furthermore, opposing protrusions 3 are provided on the inner surface of the package 1. When assembling the infrared sensor, the package can be easily attached to the substrate by fitting the protrusion into a recess 6 provided on the outer surface of the substrate 5 on which the infrared sensor element 4 is attached, corresponding to the protrusion 3. has been done.
なお、基板の形状によりパツケイジの形状を円
筒状など任意の形状に形成でき、又、必要に応じ
て、光透過用窓に特定波長領域の光を選択的に透
過するフイルタを張付けることも可能である。 Depending on the shape of the substrate, the package can be formed into any shape such as a cylinder, and if necessary, it is also possible to attach a filter to the light transmission window that selectively transmits light in a specific wavelength range. It is.
（効果）
パツケイジと光透過用窓が一体に形成されてい
るので、光センサの強度が大きく、劣化に強いう
え、組立が容易であつてコスト低減に効果があ
る。(Effects) Since the package and the light transmission window are integrally formed, the optical sensor has high strength and is resistant to deterioration, and is easy to assemble and is effective in reducing costs.
第１図は断面図、第２図はパツケイジと基板と
の斜視図である。第３図は従来のパツケイジの断
面図である。
１……パツケイジ、２……光透過用窓、５……
基板。
FIG. 1 is a sectional view, and FIG. 2 is a perspective view of the package and the substrate. FIG. 3 is a sectional view of a conventional package. 1...Pack cage, 2...Light transmission window, 5...
substrate.
Claims (1)
樹脂パツケイジに於いて、光透過用窓をパツケイ
ジと一体に形成したことを特徴とする光センサの
パツケイジ。 A package for an optical sensor, characterized in that a light transmitting window is formed integrally with the synthetic resin package which is attached to a substrate on which an optical sensor element is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985170630U JPH0442739Y2 (en) | 1985-11-05 | 1985-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985170630U JPH0442739Y2 (en) | 1985-11-05 | 1985-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6279119U JPS6279119U (en) | 1987-05-20 |
| JPH0442739Y2 true JPH0442739Y2 (en) | 1992-10-09 |
Family
ID=31105527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985170630U Expired JPH0442739Y2 (en) | 1985-11-05 | 1985-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442739Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008260430A (en) * | 2007-04-12 | 2008-10-30 | Noba Denko Kk | Solar radiation sensor fitting structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530857B2 (en) * | 1976-02-25 | 1980-08-14 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530857U (en) * | 1978-08-18 | 1980-02-28 |
-
1985
- 1985-11-05 JP JP1985170630U patent/JPH0442739Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530857B2 (en) * | 1976-02-25 | 1980-08-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6279119U (en) | 1987-05-20 |