JPH0373469U

JPH0373469U -

Info

Publication number: JPH0373469U
Application number: JP13490389U
Authority: JP
Priority date: 1989-11-22
Filing date: 1989-11-22
Publication date: 1991-07-24

Description

[Brief explanation of drawings]

第１図ａ，ｂは本考案に係る半導体受光装置を
示す図で、同図ａは平面図、同図ｂは側面図であ
る。第２図は第１図における−線断面図、第
３図ａ〜ｃは第１図における−線断面図で、
同図ａは正常な半導体受光素子を装着した場合を
示し、同図ｂは側面が傾斜して切断された半導体
受光素子を装着した場合を示し、同図ｃはリブの
直角部分が高過ぎる場合を示す。第４図ａ，ｂは
シール材を使用した場合としない場合におけるシ
ート状接着剤に加えられるせん断応力を示すグラ
フで、同図ａは遮光性注型材のない場合を示し、
同図ｂは遮光性注型材がある場合を示す。第５図
は従来の半導体受光装置を示す平面図、第６図は
第５図における−線断面図、第７図は第５図
における−線断面図、第８図ａ，ｂは従来の
半導体受光装置におけるリード体の取付け部分を
拡大して示す断面図で、同図ａは直線状に形成さ
れたリード体を使用した場合を示し、同図ｂは基
部が折曲げられたリード体を使用した場合を示す
。１１……半導体受光素子、１２……ケース、１
２ａ……側壁、１２ｂ……受光用窓部、１２ｄ…
…切欠き、１３……シート状接着剤、１４……位
置決め用リブ、１５……リード体、１７……シー
ル材、１８……遮光性樹脂。 1A and 1B are diagrams showing a semiconductor light receiving device according to the present invention, where FIG. 1A is a plan view and FIG. 1B is a side view. FIG. 2 is a sectional view taken along the - line in FIG. 1, and FIGS. 3 a to 3 c are sectional views taken along the - line in FIG.
Figure a shows the case where a normal semiconductor light-receiving element is installed, figure b shows the case where the semiconductor light-receiving element whose side surface is cut at an angle is installed, and figure c shows the case where the right angle part of the rib is too high. shows. Figures 4a and 4b are graphs showing the shear stress applied to the sheet adhesive with and without a sealant, and Figure 4a shows the case without a light-shielding casting material.
Figure b shows the case where there is a light-shielding casting material. FIG. 5 is a plan view showing a conventional semiconductor light receiving device, FIG. 6 is a sectional view taken along the - line in FIG. 5, FIG. 7 is a sectional view taken along the - line in FIG. 5, and FIGS. These are enlarged cross-sectional views of the mounting portion of the lead body in the light receiving device. Figure a shows a case where a lead body formed in a straight line is used, and figure b shows a case where a lead body with a bent base is used. Indicates the case where 11...Semiconductor photodetector, 12...Case, 1
2a...Side wall, 12b...Light receiving window, 12d...
... Notch, 13 ... Sheet adhesive, 14 ... Positioning rib, 15 ... Lead body, 17 ... Sealing material, 18 ... Light-shielding resin.

Claims

[Claims for Utility Model Registration] (1) A semiconductor light receiving device comprising a bottomed cylindrical case with a light receiving opening provided at the bottom, and a semiconductor light receiving element having an external connection lead bonded to the inner bottom of the case. In the device, a positioning rib is provided in a side wall of the case at a position corresponding to each side of the semiconductor light receiving element, and the rib is placed in contact with the side surface of the semiconductor light receiving element, and a light-shielding casting material is provided in the case to cover the semiconductor light receiving element. A semiconductor light receiving device characterized by being filled. (2) In a semiconductor light-receiving device comprising a bottomed cylindrical case with a light-receiving opening at the bottom, and a semiconductor light-receiving element having an external connection lead bonded to the inner bottom of the case, a side wall of the case is provided. A cutout for leading out the lead is provided, the base of the lead is bent along the inner wall surface of the case, the lead is passed through the cutout, and the case is filled with a light-shielding casting material that covers the semiconductor light-receiving element. Semiconductor photodetector. (3) A semiconductor light-receiving device comprising a bottomed cylindrical case with a light-receiving opening provided at the bottom, and a semiconductor light-receiving element having an external connection lead bonded to the inner bottom of the case, wherein the semiconductor light-receiving element is It is attached to the case with sheet adhesive, and
A semiconductor light-receiving device characterized in that a case is filled with a light-shielding casting material that covers a semiconductor light-receiving element. (4) In the semiconductor light receiving device according to claim 3,
1. A semiconductor light-receiving device characterized in that a sealing material having a coefficient of thermal expansion similar to that of the semiconductor light-receiving element is filled between the semiconductor light-receiving element and a side wall of a case.