JPH0215750U - - Google Patents
Info
- Publication number
- JPH0215750U JPH0215750U JP9499988U JP9499988U JPH0215750U JP H0215750 U JPH0215750 U JP H0215750U JP 9499988 U JP9499988 U JP 9499988U JP 9499988 U JP9499988 U JP 9499988U JP H0215750 U JPH0215750 U JP H0215750U
- Authority
- JP
- Japan
- Prior art keywords
- window
- light
- metal cover
- attached
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図ないし第４図は本考案の実施例に係り、
第１図は第１の実施例の赤外線センサの一部破断
斜視図、第２図は第１図の側面断面図、第３図は
第２の実施例に係る側面断面図、第４図は第３の
実施例に係る側面断面図である。第５図および第
６図は従来例に係り、第５図は同従来例の外観斜
視図、第６図は同従来例の側面断面図である。
４……主表面、６……赤外線検出素子、８……
ベース板、１６……金属カバー、１８……窓部、
２２……光透過性樹脂、２４……光装置、２６…
…溝、２８……内周面、３０……外周面。
1 to 4 relate to embodiments of the present invention,
FIG. 1 is a partially cutaway perspective view of the infrared sensor of the first embodiment, FIG. 2 is a side sectional view of FIG. 1, FIG. 3 is a side sectional view of the second embodiment, and FIG. 4 is a side sectional view of the infrared sensor of the first embodiment. FIG. 7 is a side sectional view according to a third embodiment. 5 and 6 relate to a conventional example, FIG. 5 is an external perspective view of the conventional example, and FIG. 6 is a side sectional view of the conventional example. 4...Main surface, 6...Infrared detection element, 8...
Base plate, 16...metal cover, 18...window section,
22... Light-transmitting resin, 24... Optical device, 26...
...Groove, 28...Inner peripheral surface, 30...Outer peripheral surface.
Claims (1)
ース板と、前記主表面を覆う形状でそのベース板
の周縁に取り付けられた、窓部を有する金属カバ
ーと、前記窓部を構成する前記金属カバーの周縁
部分に沿つてかつその窓部を閉じるようにして取
り付けられた光透過性樹脂とからなる光装置であ
つて、 前記光透過性樹脂を、前記金属カバーにおける
前記窓部側の周縁部分およびその内周面もしくは
外周面の少なくとも一方にモールド成形したこと
を特徴とする光装置。[Claims for Utility Model Registration] A base plate on which a component that operates in response to light is mounted on its main surface; a metal cover having a window portion attached to the periphery of the base plate in a shape that covers the main surface; and a light-transmitting resin attached along the peripheral edge of the metal cover constituting the window so as to close the window, the light-transmitting resin being attached to the metal cover. An optical device characterized in that at least one of the peripheral edge portion on the window side and the inner circumferential surface or outer circumferential surface thereof is molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9499988U JPH0215750U (en) | 1988-07-18 | 1988-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9499988U JPH0215750U (en) | 1988-07-18 | 1988-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215750U true JPH0215750U (en) | 1990-01-31 |
Family
ID=31319603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9499988U Pending JPH0215750U (en) | 1988-07-18 | 1988-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215750U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04269635A (en) * | 1991-02-25 | 1992-09-25 | Matsushita Electric Works Ltd | Hot-wire type detector |
| WO2015052995A1 (en) * | 2013-10-07 | 2015-04-16 | シャープ株式会社 | Semiconductor laser device and production method therefor |
-
1988
- 1988-07-18 JP JP9499988U patent/JPH0215750U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04269635A (en) * | 1991-02-25 | 1992-09-25 | Matsushita Electric Works Ltd | Hot-wire type detector |
| WO2015052995A1 (en) * | 2013-10-07 | 2015-04-16 | シャープ株式会社 | Semiconductor laser device and production method therefor |
| CN104718671A (en) * | 2013-10-07 | 2015-06-17 | 夏普株式会社 | Semiconductor laser device and production method therefor |
| US20160126697A1 (en) * | 2013-10-07 | 2016-05-05 | Sharp Kabushiki Kaisha | Semiconductor laser device and method for producing same |
| JP6088061B2 (en) * | 2013-10-07 | 2017-03-01 | シャープ株式会社 | Semiconductor laser device and manufacturing method thereof |