JPS6252950U - - Google Patents
Info
- Publication number
- JPS6252950U JPS6252950U JP1985145278U JP14527885U JPS6252950U JP S6252950 U JPS6252950 U JP S6252950U JP 1985145278 U JP1985145278 U JP 1985145278U JP 14527885 U JP14527885 U JP 14527885U JP S6252950 U JPS6252950 U JP S6252950U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- light
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図はその断面図、第３図は本考案の他の実施例を
示す斜視図、第４図は従来の固体撮像装置の断面
構造を示す図、第５図は従来の固体撮像装置の梱
包方法の一例を示す断面図、第６図は従来の固体
撮像装置の保護方法の一例を示す斜視図である。
１……固体撮像素子、２……収納ケース、３…
…ガラス板、１１，１２……保護キヤツプ、１１
ａ……固定用突起、２ａ……係合用溝。
Fig. 1 is a perspective view showing one embodiment of the present invention;
3 is a perspective view showing another embodiment of the present invention, FIG. 4 is a diagram showing a sectional structure of a conventional solid-state imaging device, and FIG. 5 is a conventional packing method for a solid-state imaging device. FIG. 6 is a cross-sectional view showing an example of this, and FIG. 6 is a perspective view showing an example of a conventional method of protecting a solid-state imaging device. 1...Solid-state image sensor, 2...Storage case, 3...
...Glass plate, 11, 12...Protective cap, 11
a...Fixing protrusion, 2a...Engagement groove.
Claims (1)
と、この固体撮像素子を採光可能に収納するケー
スと、このケースの採光面に貼着され前記固体撮
像素子に採光をおこなう透光性部材とを備える固
体撮像装置に係合する保護部材であつて、前記透
光性部材と離間しつつ前記透光性部材の全面をお
おうように形成され、かつその端部に前記収納ケ
ースと着脱自在に係合する係合部を有するように
してなる固体撮像装置の保護部材。 ２ 係合部が、固体撮像装置のケース側面に形成
された溝と係合する突起である実用新案登録請求
の範囲第１項記載の固体撮像装置の保護部材。 ３ 係合部が固体撮像装置のケース側面と摩擦に
より係合するようにしてなる実用新案登録請求の
範囲第１項記載の固体撮像装置の保護部材。 ４ 全体が透明樹脂で形成された実用新案登録請
求の範囲第２項または第３項記載の固体撮像装置
の保護部材。[Claims for Utility Model Registration] 1. A solid-state image sensor formed by arranging a plurality of photosensitive elements, a case for housing the solid-state image sensor in a manner that allows sunlight to enter, and a device that is attached to the light-emitting surface of the case and that is attached to the solid-state image sensor. A protective member that engages with a solid-state imaging device comprising a light-transmitting member that lets in light, the protective member being formed so as to cover the entire surface of the light-transmitting member while being spaced apart from the light-transmitting member, and having an end portion thereof. A protection member for a solid-state imaging device, comprising an engaging portion that detachably engages with the storage case. 2. The protection member for a solid-state imaging device according to claim 1, wherein the engaging portion is a protrusion that engages with a groove formed on a side surface of a case of the solid-state imaging device. 3. A protection member for a solid-state imaging device according to claim 1, wherein the engaging portion is frictionally engaged with a side surface of a case of the solid-state imaging device. 4. A protective member for a solid-state imaging device according to claim 2 or 3, which is entirely formed of transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985145278U JPS6252950U (en) | 1985-09-24 | 1985-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985145278U JPS6252950U (en) | 1985-09-24 | 1985-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6252950U true JPS6252950U (en) | 1987-04-02 |
Family
ID=31056669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985145278U Pending JPS6252950U (en) | 1985-09-24 | 1985-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6252950U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116762A (en) * | 2003-10-07 | 2005-04-28 | Fujitsu Ltd | Method for protecting semiconductor device, cover for semiconductor device, semiconductor device unit, and packaging structure of semiconductor device |
-
1985
- 1985-09-24 JP JP1985145278U patent/JPS6252950U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116762A (en) * | 2003-10-07 | 2005-04-28 | Fujitsu Ltd | Method for protecting semiconductor device, cover for semiconductor device, semiconductor device unit, and packaging structure of semiconductor device |
| US8164181B2 (en) | 2003-10-07 | 2012-04-24 | Fujitsu Semiconductor Limited | Semiconductor device packaging structure |
| US8268670B2 (en) | 2003-10-07 | 2012-09-18 | Fujitsu Semiconductor Limited | Method of semiconductor device protection |
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