JPH0440860B2 - - Google Patents

Description

[Detailed description of the invention]

(Field of Industrial Application) The present invention relates to a memory IC module, and particularly to a memory IC module having a function of displaying the capacity of the built-in memory IC. (Prior art) Memory ICs in digital devices are generally designed with the minimum necessary capacity installed at the beginning, and the capacity can be expanded by sequentially adding memory ICs as needed. It is true. In addition, when a large number of ICs are required with large memory capacity, or when downsizing the device, DIP (Dual In-Line Packag) type memory ICs 1, 1, . . . are mounted on the sub-printed board 2 according to the required number, and pins or plug terminals 3, 3, . By arranging them in parallel, the packaging density can be increased. Due to its shape, such modules are generally called SIMM (Single In-Line).
For example, the memory ICs installed inside are arranged in 9 pieces of 64 kilobits, one of which is used as a parity check bit, and each of the other 8 pieces is allocated as 8 bits, or 1 byte, in total.
It is normal to configure a 64 kilobyte memory module, but the capacity of the built-in memory IC varies from the above-mentioned 64 kilobits to 16 kilobits, 256 kilobits, 1 megabit, etc.
SIMMs with different capacities are manufactured. On the other hand, memory ICs implemented in digital devices are
The CPU, address decoder, or other program performs the desired function by controlling the address designation and bus lines by latching, etc., but the number of control terminals or control signal bits for this purpose depends on the memory capacity or Varies depending on type. That is, the number of addresses specified differs depending on the memory capacity, and the memory backup method differs depending on whether the memory is static RAM or dynamic RAM. Therefore, the capacity and shape of memory ICs added for capacity expansion are generally limited to those determined at the beginning of device design, and when mounting a different type of IC, wiring changes, address decoders, etc. There was the inconvenience of having to change the design or modify the program. This problem is similar to the above-mentioned SIMM, and it is extremely difficult to mix different types of SIMM when expanding memory. (Purpose of the Invention) The present invention was made to solve the problems of conventional SIMMs as described above, and eliminates the need to worry about the type of SIMM to be implemented when designing a device. When it comes to memory expansion, the purpose is to provide a SIMM that allows different types of memory expansion to be implemented arbitrarily. (Summary of the Invention) In order to achieve this object, the present invention provides information on the type of memory module of a predetermined one of the terminals of a modularized IC, such as the memory capacity or whether it is a dynamic type or a static type. At the same time, a memory manager or the like that controls these memory modules identifies the type of the module through the information terminal and performs control appropriate to each memory module. make it function like this. (Examples) Hereinafter, the present invention will be described in detail based on examples thereof. FIG. 1 is an external structural diagram showing an embodiment of the present invention. In this embodiment, terminals used as means for displaying physical layout information of a built-in memory IC are defined as first and second terminals. This shows a case in which the display is configured to be displayed by internally grounding it, connecting it to a high potential, or a combination of both. That is, FIGS. 1, 2, and 3 each show a DIP type memory IC, a sub-printed board, and a terminal as in FIG.
Assuming that there are four types of built-in bits: kilobit, 16 kilobit, 256 kilobit, and 1 megabit, now either one or both of the first and second terminals must be grounded or connected to a high potential internally. For example, since there are four possible states as shown in Table 1 below, this can be assigned to each capacity display of the memory IC.

[Table] Furthermore, the third terminal may also be used, and if it is grounded, it will indicate the dynamic type, or if it is set to a high potential, it will indicate the static type. It is also possible to mix things. Note that the above-mentioned identification method is one example, and various other methods can be considered in implementing the present invention. For example, the assigned terminals may be identified by how they are internally interconnected. That is, the first and second of the three terminals,
Different states may be displayed by connecting the first and third terminals, the second and third terminals, and the first, second and third terminals to each other. Alternatively, it will be readily understood that in the implementation described above, the internal connection may be grounded or connected to a high potential. however,
The state in which all terminals are not connected should be considered as excluded from the state display when indicating that no memory module is present at that location. Also, the devices may have different power supply voltages, e.g. +5V,
It is unnecessary to explain that in the case of -5V, 0V, etc., these can be used to identify many states with a small number of terminals. (Effects of the Invention) Since the present invention is structured and functions as described above, it is possible to automatically identify differences in the capacity and type of built-in memory ICs, and to enable the coexistence of various types of built-in memory ICs. SIMM with a high degree of freedom and the ability to use any type for expansion
It is effective in bringing about

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing one embodiment of the present invention, and FIG.
The figure is a structural external view showing an example of a conventional SIMM. 1...DIP type IC, 2...Sub printed board, 3...
...Terminal.

Claims (1)

[Claims] 1. Memory with a required number of memories of the same capacity built-in
In an IC module, some of its terminals are assigned to identify the module, each terminal is grounded inside the module or connected to apply a high potential, and the combination of the potential states is transmitted through the terminal. 1. A memory IC module characterized in that the memory capacity, memory type, or physical arrangement of the IC module can be electrically identified by detecting the memory capacity, memory type, or physical arrangement of the IC module. 2 Memory with the required number of memories of the same capacity built-in
In an IC module, some of its terminals are assigned for identification of the module, the respective terminals are connected to each other inside the module, and the combination of the interconnection states is detected through the terminals to identify the IC. 1. A memory IC module characterized in that the module's memory capacity, memory type, or physical arrangement can be electrically identified.