JPH043989A - Light-emitting device - Google Patents

Light-emitting device

Info

Publication number
JPH043989A
JPH043989A JP2106003A JP10600390A JPH043989A JP H043989 A JPH043989 A JP H043989A JP 2106003 A JP2106003 A JP 2106003A JP 10600390 A JP10600390 A JP 10600390A JP H043989 A JPH043989 A JP H043989A
Authority
JP
Japan
Prior art keywords
light emitting
light
fresnel lens
substrate
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2106003A
Other languages
Japanese (ja)
Inventor
Masanobu Tanigami
昌伸 谷上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to JP2106003A priority Critical patent/JPH043989A/en
Publication of JPH043989A publication Critical patent/JPH043989A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To reduce the positioning error of a light-emitting device to less than half that of the conventional structure by arranging the light-emitting edge of the device in alignment with the front edge of a support base, and fixing a Fresnel lens on a substrate to the front edge of the support base, wherein the substrate thickness is approximately equal to the focal length of the lens. CONSTITUTION:A Fresnel lens 2 is composed of a substrate 2a and a lens member 2b formed on the substrate, and it is attached to the front face of a stem 3 with adhesive 9. The substrate 2a of the Fresnel lens 2 has a thickness T, approximately equal to the focal length L of the lens member 2b, which is equal to the difference between the focal length L and the thickness (t) of the adhesive 9. Therefore, the light-emitting edge of a device 1 is positioned at the focal point of the lens member 2b when the Fresnel lens 2 is fixed to the front face of a support base 3a.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明はレーザダイオード等の発光素子を光源にした発
光装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a light emitting device using a light emitting element such as a laser diode as a light source.

（従来の技術） 従来、発光素子からの光を平行な光ヒームにして出力す
るよう構成した発光装置として、第３図に示すものが知
られている。(Prior Art) Conventionally, a light emitting device shown in FIG. 3 is known as a light emitting device configured to output light from a light emitting element as a parallel optical beam.

この発光装置は、ステム３の取り付け台３ａに発光素子
１を取り付けるとともに、この発光素子ｌの前方にフレ
ネルレンズ２を配備したものであり、そのレンズ部２ａ
の焦点距離に発光素子ｌの発光端面が位置するように、
取り付け台３ａの前端面にスペーサ１０を介してフレネ
ルレンズ２が貼付け支持されていた。This light-emitting device includes a light-emitting element 1 attached to a mounting base 3a of a stem 3, and a Fresnel lens 2 disposed in front of the light-emitting element 1.
so that the light emitting end surface of the light emitting element l is located at the focal length of
A Fresnel lens 2 was attached and supported on the front end surface of the mounting base 3a via a spacer 10.

なお、第３図中の４はステム３に取り付けられたキャッ
プ、７はキャップ４の前面開口５を閉塞する透明板、６
はステム３の背面に設けられた入力端子である。In addition, 4 in FIG. 3 is a cap attached to the stem 3, 7 is a transparent plate that closes the front opening 5 of the cap 4, and 6 is a cap attached to the stem 3.
is an input terminal provided on the back surface of the stem 3.

（発明が解決しようとする課題） 上記構成の従来発光装置には次のような欠点があった。(Problem to be solved by the invention) The conventional light emitting device having the above structure has the following drawbacks.

（１）　　焦点距離に応じた厚さのスペーサ１０を用意
する必要があり、部品点数が多くなってコストアップの
一因となる。(1) It is necessary to prepare the spacer 10 with a thickness corresponding to the focal length, which increases the number of parts and causes an increase in cost.

（２）　フレネルレンズ２とステム３との間に２箇所の
接着剤９層が介在されるので、接着剤９層全体の厚さの
バラツキが大きく、発光素子ｌ端面とフレネルレンズ２
との距離精度が低下しやすい。(2) Since the 9 adhesive layers are interposed at two places between the Fresnel lens 2 and the stem 3, there is a large variation in the thickness of the entire 9 adhesive layers.
Distance accuracy tends to decrease.

（３）熱特性の悪い高分子材料の接着剤９が多く使用さ
れることにより、温度条件によって発光素子ｌとフレネ
ルレンズ２との距離が変化したり、発光素子ｌに対して
レンズ光軸が傾斜することになり、温度によって光学系
の特性が劣化しやすい。(3) Since adhesive 9 made of a polymeric material with poor thermal properties is often used, the distance between light emitting element l and Fresnel lens 2 may change depending on temperature conditions, and the optical axis of the lens may change with respect to light emitting element l. As a result, the characteristics of the optical system tend to deteriorate due to temperature.

また、接着剤９から発生したガスが発光素子ｌに悪影響
を及ぼす。Further, the gas generated from the adhesive 9 has an adverse effect on the light emitting element 1.

（４）　２回の接着工程を要し、生産性が低い。(4) Two bonding steps are required, resulting in low productivity.

本発明はこのような従来構造における欠点を解消するこ
とを目的とする。The present invention aims to eliminate the drawbacks of such conventional structures.

（課題を解決するための手段） 上記目的を達成するため本発明は、ステムの取り付け台
に取り付けた発光素子からの光を、基板外面にレンズ部
が一体に備えられたフレネルレンズを通して外部に出射
するよう構成した発光装置で、前記発光素子をその発光
端面が前記取り付け台面端面と一致するように設け、前
記フレネルレンズを前記取り付け台面端面に貼着し、か
つ、前記フレネルレンズの基板厚さを前記レンズ部の焦
点距離に略等しく設定した。(Means for Solving the Problems) In order to achieve the above object, the present invention emits light from a light emitting element attached to a mounting base of a stem to the outside through a Fresnel lens having a lens portion integrally provided on the outer surface of a substrate. In the light emitting device, the light emitting element is provided so that its light emitting end surface coincides with the end surface of the mounting surface, the Fresnel lens is adhered to the end surface of the mounting surface, and the substrate thickness of the Fresnel lens is The focal length was set to be approximately equal to the focal length of the lens section.

（作用） 本発明構成によると、フレネルレンズをステムの取り付
け台面端面に直接貼付けることによって、発光素子の発
光端面がレンズ部の焦点距離位置に位置する。(Function) According to the configuration of the present invention, by directly attaching the Fresnel lens to the end face of the mounting base of the stem, the light emitting end face of the light emitting element is located at the focal length position of the lens portion.

この場合、発光素子の位置誤差は接着剤層の厚さの誤差
であるが、この接着剤層は一層だけであるために位置誤
差は従来構造の半分以下となる。In this case, the positional error of the light emitting element is due to the thickness of the adhesive layer, but since this adhesive layer is only one layer, the positional error is less than half that of the conventional structure.

（実施例） 第１図に本発明の一実施例に係る発光装置の断面が示さ
れている。(Example) FIG. 1 shows a cross section of a light emitting device according to an example of the present invention.

この発光装置は、発光素子ｌ及びマイクロフレネルレン
ズ２をステム３の取り付け台３ａに支持し、これらをキ
ャップ４で外囲し、発光素子１からの光をフレネルレン
ズ２を介して平行な光ビームとしてキャップ４前面の開
口５から出力するよう構成し１こものである。なお、ス
テム３の背面には素子駆動信号入力用の端子６が設けら
れ、また、キャップ４の開口５は透明板７て閉塞されて
いる。This light emitting device supports a light emitting element 1 and a micro Fresnel lens 2 on a mounting base 3a of a stem 3, surrounds them with a cap 4, and directs light from the light emitting element 1 through the Fresnel lens 2 into a parallel light beam. It is constructed so that the output is output from the opening 5 on the front surface of the cap 4. Note that a terminal 6 for inputting an element drive signal is provided on the back surface of the stem 3, and an opening 5 of the cap 4 is closed by a transparent plate 7.

前記発光素子ｌは、その発光端面がステム３の取り付け
台３ａの前端面と一致するように取り付け台３ａ上に支
持基板８を介して取り付けられている。The light emitting element 1 is mounted on the mount 3a via the support substrate 8 so that its light emitting end surface coincides with the front end surface of the mount 3a of the stem 3.

また、第２図に示すように、フレネルレンズ２は基板部
２ａの外面にレンズ部２ｂを形成したものに構成され、
ステム３の前端面に接着剤９層を介して直接に貼着され
ている。そして、このフレネルレンズ２の基板部２ａの
厚さＴがレンズ部２ｂの焦点距離りに略等しく設定され
、この実施例においては、レンズ部２ｂの焦点距離りか
ら接着剤９層の厚さｔを差し引いた寸法に設定されてい
る。Further, as shown in FIG. 2, the Fresnel lens 2 is constructed by forming a lens portion 2b on the outer surface of a substrate portion 2a.
It is directly attached to the front end surface of the stem 3 via nine layers of adhesive. The thickness T of the substrate portion 2a of this Fresnel lens 2 is set approximately equal to the focal length of the lens portion 2b, and in this embodiment, the thickness T of the adhesive 9 layer is set from the focal length of the lens portion 2b. The dimensions are set by subtracting .

従って、フレネルレンズ２を取り付け台３ａの前端面に
貼付けることで、発光素子ｌの発光端面がレンズ部２ｂ
の焦点に位置することになる。Therefore, by attaching the Fresnel lens 2 to the front end surface of the mounting base 3a, the light emitting end surface of the light emitting element l can be attached to the lens portion 2b.
will be located at the focal point.

（発明の効果） 以上説明したように、本発明によれば次のような効果が
得られる。(Effects of the Invention) As explained above, according to the present invention, the following effects can be obtained.

（１）　　スペーサが不要となるため部品点数が少なく
なり、コスト低減となる。(1) Since no spacer is required, the number of parts is reduced, resulting in cost reduction.

（２）接着剤層が一層だけであるため接着剤層厚さのバ
ラツキによる発光素子とフレネルレンズとの距離誤差が
小さい。(2) Since there is only one adhesive layer, the distance error between the light emitting element and the Fresnel lens due to variations in the thickness of the adhesive layer is small.

（３）接着剤の量が少ないので、温度による光学系の特
性劣化が少ない。(3) Since the amount of adhesive is small, there is little deterioration of the characteristics of the optical system due to temperature.

（４）接着剤からの発生ガスが少なく、発光素子への悪
影響が少ない。(4) There is little gas generated from the adhesive, and there is little adverse effect on the light emitting element.

（５）接着工程が１回であるため生産性が高まる。(5) Productivity is increased because the bonding process is performed only once.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明に係る発光装置の断面図、第２図はその
要部の拡大断面図、第３図は従来の発光装置の断面図で
ある。 ｌ・・・発光素子、 ２・・フレネルレンズ、 ２ａ・・・基板、 ２ｂ　・・レンズ部、 ３・・ステム、 ３ａ ・取り付け台。FIG. 1 is a cross-sectional view of a light-emitting device according to the present invention, FIG. 2 is an enlarged cross-sectional view of a main part thereof, and FIG. 3 is a cross-sectional view of a conventional light-emitting device. l... Light emitting element, 2... Fresnel lens, 2a... Substrate, 2b... Lens section, 3... Stem, 3a - Mounting stand.

Claims (1)

【特許請求の範囲】[Claims] （１）ステム（３）の取り付け台（３ａ）に取り付けた
発光素子（１）からの光を、基板（２ａ）外面にレンズ
部（２ｂ）が一体に備えられたフレネルレンズ（２）を
通して外部に出射するよう構成した発光装置であり、 前記発光素子（１）をその発光端面が前記取り付け台（
３ａ）前端面と一致するように設け、前記フレネルレン
ズ（２）を前記取り付け台（３ａ）前端面に貼着し、か
つ、前記フレネルレンズ（２）の基板（２ａ）厚さを前
記レンズ部（２ｂ）の焦点距離に略等しく設定してある
発光装置。(1) Light from the light emitting element (1) attached to the mounting base (3a) of the stem (3) is passed through the Fresnel lens (2), which has a lens part (2b) integrally provided on the outer surface of the substrate (2a), to the outside. This is a light emitting device configured to emit light at
3a) The Fresnel lens (2) is attached to the front end surface of the mounting base (3a), and the thickness of the substrate (2a) of the Fresnel lens (2) is adjusted to match the front end surface of the lens part. A light emitting device whose focal length is set approximately equal to the focal length of (2b).
JP2106003A 1990-04-20 1990-04-20 Light-emitting device Pending JPH043989A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2106003A JPH043989A (en) 1990-04-20 1990-04-20 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2106003A JPH043989A (en) 1990-04-20 1990-04-20 Light-emitting device

Publications (1)

Publication Number Publication Date
JPH043989A true JPH043989A (en) 1992-01-08

Family

ID=14422516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2106003A Pending JPH043989A (en) 1990-04-20 1990-04-20 Light-emitting device

Country Status (1)

Country Link
JP (1) JPH043989A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4955733A (en) * 1988-03-14 1990-09-11 Brother Kogyo Kabushiki Kaisha Printing apparatus with expanded pitch mode and underlining
JP2009029512A (en) * 2007-07-26 2009-02-12 Jaegu Moon Container lid integrally formed with packing with wing
US20200313399A1 (en) * 2017-10-12 2020-10-01 Osram Oled Gmbh Semiconductor laser and method of production for optoelectronic semiconductor parts

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4955733A (en) * 1988-03-14 1990-09-11 Brother Kogyo Kabushiki Kaisha Printing apparatus with expanded pitch mode and underlining
JP2009029512A (en) * 2007-07-26 2009-02-12 Jaegu Moon Container lid integrally formed with packing with wing
US20200313399A1 (en) * 2017-10-12 2020-10-01 Osram Oled Gmbh Semiconductor laser and method of production for optoelectronic semiconductor parts
US11735887B2 (en) * 2017-10-12 2023-08-22 Osram Oled Gmbh Semiconductor laser and method of production for optoelectronic semiconductor parts
US11870214B2 (en) 2017-10-12 2024-01-09 Osram Oled Gmbh Semiconductor laser and method of production for optoelectronic semiconductor parts

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