JP6509451B1 - Optical module - Google Patents

Abstract

In the optical module, the first lens and the second lens provided between the light emitting unit and the light receiving unit, the light emitting unit and the light receiving unit are mounted, and the first lens and the second lens are fixed via the adhesive resin. And a base member. The first adhesive direction in which the first adhesive surface of the first lens is adhesively fixed via the adhesive resin, and the second adhesive direction in which the second adhesive surface of the second lens is adhesively fixed via the adhesive resin Is also a direction perpendicular to the optical axis direction of light, and the direction in which the first adhesive surface faces is different from the direction in which the second adhesive surface faces. As a result, high bonding efficiency can be realized regardless of the curing shrinkage of the adhesive resin and the volume fluctuation associated with the change with time.

Description

  The present invention relates to an optical module provided with a light emitting unit, a light receiving unit, and a plurality of lenses.

  A technology that integrates multiple functions in one package has attracted attention as a technology that meets the demands for smaller size, lower power consumption, and lower cost of optical communication devices. For example, a multi-lane integration type optical transmission module having a plurality of semiconductor lasers emitting signal light of different wavelengths and combining the signal light into one output light is given as an example. Also, a multi-lane integration type optical receiving module in which a plurality of light receiving elements for demultiplexing signal light in which multiple wavelengths are multiplexed into signal light of each wavelength and converting the separated signal light into an electric signal is integrated. is there. Furthermore, there is also an optical transmission module in which a wavelength tunable semiconductor laser that outputs continuous light of an arbitrary wavelength and an optical modulator element represented by an MZ-type phase modulator are integrated.

One of the important issues in the field of optical modules is to achieve high efficiency optical coupling between multiple functional components. Here, the main factor of the decrease in coupling efficiency is due to the mounting position deviation of each functional component of the semiconductor laser or the optical modulator element, or of the optical component of the lens, the optical filter or the optical fiber. In particular, in the semiconductor device, since the spot size of the input and output optical waveguides is small, the coupling efficiency is significantly reduced by a slight positional deviation of the lens in the input and output optical waveguides. When the lens is mounted with an adhesive resin, shrinkage upon curing of the adhesive resin or change in resin volume due to aging is inevitable.
The coupling efficiency refers to the ratio of the amount of light incident on the light receiving unit to the amount of light emitted from the light source.

  In order to solve the above problems, in the method of bonding and fixing an optical component described in Patent Document 1 and an optical device, when fixing a lens with a bonding resin, the amount of variation due to curing and shrinkage of the bonding resin is predicted. Offset and mount the lens on the optical device. Furthermore, the mounts for fixing the lens are arranged to be sandwiched by at least two other fixed mounts. Thereby, the loss of the incident light intensity between the optical components can be reduced.

  Further, in the bonding and fixing method of an optical component described in Patent Document 2, the lens unit is fixed via a supporting member having bonding surfaces on two different surfaces. Thus, the lens unit can be freely adjusted in position and fixed with respect to the semiconductor laser.

JP, 2008-250002, A JP 2007-219337 A

  However, in the bonding and fixing method of the optical component described in Patent Document 1, although the variation of the mounting position of the lens due to the volume variation of the bonding resin is suppressed, two fixing pedestals are required for one lens. Therefore, there is a problem that the process and mechanism for adjusting the position of the lens and the base are complicated, and the mounting cost is increased.

  Further, Patent Document 2 discloses a technique capable of freely adjusting the position of a lens with respect to a semiconductor laser. In the bonding and fixing method of an optical component described in Patent Document 2, by reducing the thickness of the adhesive resin under the lens, it is possible to suppress the positional deviation of the optical component due to curing and shrinkage. However, since the thickness of the resin can not be made “0”, it is difficult to completely suppress the displacement of the lens due to the volume fluctuation. Further, in order to reduce the thickness of the resin, it is necessary to use a resin having a low viscosity, which narrows the range of selection of the resin. Furthermore, there is a problem that the process and mechanism for adjusting the position of the lens and the base are complicated and the mounting cost is increased.

  This invention is made in order to solve such a problem, and it aims at providing the optical module which can implement | achieve high coupling efficiency, using a simple lens mounting structure.

In order to solve the above problems, an optical module according to the present invention is provided between a light emitting unit that emits light, a light receiving unit that receives light emitted by the light emitting unit, and a light emitting unit and a light receiving unit. A first lens and a second lens provided side by side in the optical axis direction of light emitted from the light emitting portion, and the light emitting portion and the light receiving portion are mounted, and the first lens and the second lens have a predetermined thickness And a base member fixed via a layer of adhesive resin, wherein the first lens has a first adhesive surface and only the first adhesive surface is adhered to the base member via a layer of adhesive resin. The first lens is fixed to the base member, and the second lens has the second adhesive surface, and only the second adhesive surface is bonded to the base member through the layer of adhesive resin, thereby the second lens It is fixed to the base member, the first first lens A first bonding direction is the stacking direction of the layers of Chakumen the adhesive resin, and the second adhesive direction, which is the stacking direction of the layers of the second adhesive surface and the adhesive resin of the second lens, any optical light The direction perpendicular to the axial direction is different from the direction in which the first adhesive surface faces and the direction in which the second adhesive surface faces.

  According to the optical module according to the present invention, it is possible to realize high coupling efficiency by suppressing a decrease in coupling efficiency after using a simple lens mounting structure.

It is the schematic which shows the optical module concerning Embodiment 1 of this invention. It is the schematic which shows the optical module concerning the conventional example. It is a graph which compares the change of the coupling efficiency of the optical module shown in FIG. 1, and the conventional optical module shown in FIG. It is the schematic which shows the modification of the optical module shown in FIG. It is the schematic which shows the modification of the optical module shown in FIG. It is the schematic which shows the optical module concerning Embodiment 2 of this invention. It is a graph which compares the change of the coupling efficiency of the optical module shown in FIG. 6, and the conventional optical module shown in FIG. It is the schematic which shows the modification of the optical module shown in FIG. It is the schematic which shows the optical module concerning Embodiment 3 of this invention. It is the schematic which shows the optical module concerning Embodiment 4 of this invention. It is the schematic which shows the optical module concerning Embodiment 5 of this invention. It is the schematic which shows the optical module concerning Embodiment 6 of this invention. It is the schematic which shows the modification of the optical module shown in FIG.

Hereinafter, an embodiment of the present invention will be described based on the attached drawings.
In the following description, “direction” is a concept indicating a straight line in three dimensions, and “direction” is a concept including information on which to go on a straight line, in addition to information on the direction. That is, "direction" is represented by a straight line having an opposite direction, and "direction" is represented by an arrow having one arrow head.

Embodiment 1
FIG. 1 is a schematic view showing a configuration of an optical module 100 according to Embodiment 1 of the present invention.
As shown in FIG. 1, this optical module 100 has a first substrate 11 and a second substrate 12, and submount substrates 21 and 22 mounted on each of the first substrate 11 and the second substrate 12 . Here, the submount substrates 21 and 22 are formed of, for example, AIN or alumina. A semiconductor laser 31 is provided on the submount substrate 21 mounted on the first substrate 11, and an optical modulator element 32 is provided on the submount substrate 22 mounted on the second substrate 12. There is. That is, the semiconductor laser 31 is mounted on the first substrate 11 via the submount substrate 21, and the light modulator element 32 is mounted on the second substrate 12 via the submount substrate 22. The semiconductor laser 31 emits light 7 which is received by the light modulator element 32. Here, the optical axis direction L of the light 7 is a direction in which the optical axis of the light 7 extends and a direction in which the light 7 travels.
The first substrate 11, the second substrate 12, and the submount substrates 21 and 22 constitute a base member. In addition, a base member is not limited to when consisting of several members, A single member may be sufficient.
The semiconductor laser 31 constitutes a light emitting part, and the light modulator element 32 constitutes a light receiving part.

A first lens 41 and a second lens 42 for optically coupling the semiconductor laser 31 and the light modulator element 32 are provided between the semiconductor laser 31 and the light modulator element 32. The first lens 41 and the second lens 42 are aligned along the optical axis direction L of the light 7 emitted by the semiconductor laser 31, and the light 7 passes through the first lens 41 and the second lens 42. The first lens 41 is attached to the first substrate 11, and the second lens 42 is attached to the second substrate 12. Also, a post 62 is provided on the second substrate 12. Here, the adhesive resin 51 is applied and provided on the lower surface side of the first lens 41, and the first lens 41 is adhesively fixed directly to the first substrate 11 via the adhesive resin 51. The surface of the first lens 41 on the side where the adhesive resin 51 is provided is referred to as a first adhesive surface 41 a. Also, the second lens 42 is adhesively fixed to the post 62 via the adhesive resin 52. That is, the second lens 42 is bonded to the second substrate 12 via the adhesive resin 52 and the post 62. The surface of the second lens 42 on which the adhesive resin 52 is provided is referred to as a second adhesive surface 42 a. Here, the direction in which the first adhesive surface 41a of the first lens 41 faces is X1, and the direction in which the first adhesive surface 41a of the first lens 41 is adhesively fixed is the first adhesive direction M1. The direction in which the second adhesive surface 42a of the second lens 42 faces is Y1, and the direction in which the second adhesive surface 42a of the second lens 42 is adhesively fixed is the second adhesive direction M2. The first bonding direction M1 and the second bonding direction M2 are both perpendicular to the optical axis direction L of the light 7. Further, the direction X1 and the direction Y1 are different by 90 ° from each other.
The post 62 constitutes a part of the base member.
Further, the bonding direction is a lamination direction of the bonding surface of the lens and the bonding resin for bonding and fixing the bonding surface. Therefore, the first bonding direction M1 is the stacking direction of the first bonding surface 41a of the first lens 41 and the bonding resin 51 for bonding and fixing the first bonding surface 41a. The second bonding direction M2 is a stacking direction of the second bonding surface 42a of the second lens 42 and the bonding resin 52 for bonding and fixing the second bonding surface 42a.

  As described above, in the optical module 100 according to the first embodiment, the first adhesion direction M1 of the first lens 41 and the second adhesion direction M2 of the second lens 42 are both perpendicular to the optical axis direction L of the light 7 is there. Further, the direction X1 facing the first adhesive surface 41a and the direction Y1 facing the second adhesive surface 42a are different from each other. Thereby, even if the adhesive resins 51 and 52 change in volume due to shrinkage and aging with curing of the adhesive resins 51 and 52 and the positions of the first lens 41 and the second lens 42 change, the incident light intensity You can reduce the loss of Therefore, it is possible to suppress a change in coupling efficiency between the semiconductor laser 31 and the light modulator element 32.

An effect of suppressing a change in coupling efficiency between the semiconductor laser 31 and the light modulator element 32 by the structure of the optical module 100 will be described below. FIG. 2 shows the configuration of the conventional optical module 200 shown for comparison. The same reference numerals as the reference numerals shown in FIG. 1 have the same or similar structures, and thus the description thereof is omitted.
The conventional optical module 200 is an optical module in that the direction X2 facing the first adhesive surface 41a of the first lens 41 and the direction Y2 facing the second adhesive surface 42a ′ of the second lens 42 are the same. Different from 100. The adhering direction M1 ′ of the first lens 41 of the optical module 200 and the adhering direction M2 ′ of the second lens 42 are the same as the first adhering direction M1 of the first lens 41 of the optical module 100, It is perpendicular to the optical axis direction L of the light 7. Specifically, in FIG. 2, the adhesive resin 51 is applied to the lower side in the direction X 2 of the first lens 41 and fixed to the first substrate 11, and the second lens 42 is also the lower direction in the direction Y 2. An adhesive resin 52 is applied to the side and fixed to the second substrate 12.

When the optical module 100 shown in FIG. 1 is compared with the conventional optical module 200 shown in FIG. 2, the semiconductor laser 31 and the optical modulator element 32 due to the positional change of the first lens 41 and the second lens 42. The graph of the calculation result of the change of the coupling efficiency of is shown in FIG.
As shown in FIG. 3, when the lens position variation of the first lens 41 or the second lens 42 is 0.1 μm, the change of the coupling efficiency in the conventional optical module 200 is −0.3 dB. In the optical module 100 according to the first embodiment, the change in coupling efficiency is suppressed to −0.23 dB. In addition, when the lens position variation is 0.16 μm, the change in coupling efficiency in the conventional optical module 200 is −0.5 dB, while the change in coupling efficiency is −0.4 dB in the optical module 100. It is suppressed.

From the above, from the viewpoint of optical coupling, the conventional structure in which the lens moves in the same direction in the direction perpendicular to the optical axis direction L of the light 7 causes the largest deterioration, so in the first embodiment Is improving.
In the graph of the calculation result shown in FIG. 3, the position fluctuation amount of the first lens 41 and the position fluctuation amount of the second lens 42 have the same value. Further, in general, the change in the adhesive resin is also a change in the shrinkage direction as a change upon curing and a change with time, so that the direction of the position change is the application direction of the adhesive resin 51, 52. Moreover, in this calculation, only curing shrinkage or aging of the adhesive resin 51, 52 is taken into consideration, but even in the case of, for example, expansion at high temperature, basically, the adhesive resin 51, 52 moves in the same direction. , With similar results.

The configuration of the optical module 100 according to the first embodiment is not limited to the configuration shown in FIG. A schematic view of a variation of the optical module 100 is shown in FIGS.
The first substrate 11 and the second substrate 12 may be ceramic materials such as alumina or AIN, may be glass such as quartz, or may be metal, and TEC (Thermo-electric Cooler) It may be a functional member such as For example, as shown in FIG. 4, when the optical module 100 has TECs 111 and 112 as base members instead of the first substrate 11 and the second substrate 12, the semiconductor laser 31 and the semiconductor laser 31 can be adjusted by the temperature control function of the TECs 111 and 112. The light modulator element 32 can be driven at a more optimal temperature. The positions of the first lens 41 and the second lens 42 can be brought closer to more optimal positions by adjusting the amount of expansion and contraction of the adhesive resins 51 and 52 depending on the temperature.

  Also, the materials of the submount substrates 21 and 22 are not limited to ceramic materials such as alumina or AIN as well. The material of the submount substrates 21 and 22 may be glass such as quartz or metal. When the material of the submount substrates 21 and 22 as the base member is a material having a high thermal conductivity of approximately 100 W / m / K or more, such as metal or AIN, the semiconductor laser 31 and the light modulator The heat of the element 32 can be dissipated efficiently. In addition, it is possible to prevent the adhesive resins 51 and 52 from expanding excessively due to the temperature rise due to the heat generation of the semiconductor laser 31 and the light modulator element 32.

  Further, the light emitting unit and the light receiving unit of the optical module 100 are not limited to the combination of the semiconductor laser 31 and the optical modulator device 32. For example, the combination of a semiconductor laser and an optical fiber may be used. Further, the combination of the light emitting part and the light receiving part may be a combination of a semiconductor laser and a light receiving element, or a combination of an optical fiber and a light receiving element. Here, as shown in FIG. 5, when using the optical fiber 132 for the light receiving portion, it is necessary to provide the groove 22a having a V-shaped cross section in the submount substrate 22 and fix the optical fiber 132 in the groove 22a. is there. Further, the optical fiber 132 can be fixed by welding to the metal submount substrate 22.

Also, the post 62 may be integrally formed with the second substrate 12 or may be configured by a separate member different from the second substrate 12. When the post 62 and the second substrate 12 are integrally formed, the mounting process is simplified, so that the cost can be reduced. When the post 62 is fixed to the second substrate 12 as a separate member, the position of the post 62 can be simultaneously adjusted when adjusting the positions of the first lens 41 and the second lens 42. Thus, the thickness of the adhesive resin 52 can be reduced, and the amount of fluctuation of the second lens 42 due to the cure shrinkage or the change with time of the adhesive resin 52 can be reduced. When the post 62 is configured as a separate member, the post 62 can be fixed to the second substrate 12 by a method not using an adhesive resin, such as welding or solder bonding. As a result, the second lens 42 can be prevented from fluctuating with respect to the application direction of the adhesive resin 52, that is, the second adhesion direction M2, and the deterioration of the coupling efficiency of the optical module 100 can be suppressed.
Moreover, the application direction and direction of the adhesive resins 51 and 52 of the first lens 41 and the second lens 42 are not limited to those shown in FIG. 1 as long as they are perpendicular to the optical axis direction L of the light 7.

Second Embodiment
FIG. 6 is a schematic view of a configuration of an optical module 300 according to Embodiment 2 of the present invention. In addition, since the same reference numerals as the reference numerals in FIG. 1 are the same or similar constituent elements, the detailed description thereof will be omitted in the following description.
As shown in FIG. 6, a post 61 is provided on the first substrate 11. Further, the first lens 41 is adhesively fixed to the post 61 via an adhesive resin 51 applied and provided on the first adhesive surface 41 b of the first lens 41.
The post 61 constitutes a part of the base member.

  The direction in which the first bonding surface 41b of the first lens 41 of the optical module 300 faces is X3, and the bonding direction of the first bonding surface 41b of the first lens 41 is the first bonding direction M3. The first bonding direction M3 of the first lens 41 is the same as the second bonding direction M2 of the second lens 42, and is perpendicular to the optical axis direction L of the light 7. Further, the direction X3 facing the first adhesive surface 41b and the direction Y1 facing the second adhesive surface 42a are directions different by 180 ° from each other.

  As described above, in the optical module 300 according to the second embodiment, the first adhesion direction M3 of the first lens 41 and the second adhesion direction M2 of the second lens 42 are the same direction, and the optical axis direction of the light 7 It is perpendicular to L. Further, the direction X3 facing the first adhesive surface 41b and the direction Y1 facing the second adhesive surface 42a differ from each other by 180 °. Specifically, as shown in FIG. 6, the first adhesive surface 41b of the first lens 41 is located on the left side with respect to the direction in which the light 7 travels, with the optical axis of the light 7 being interposed. On the other hand, the second adhesive surface 42 a of the second lens 42 is located on the right side with respect to the direction in which the light 7 travels, with the optical axis of the light 7 being interposed. Thereby, in the optical module 300, the influence of the positional deviation of the first lens 41 and the second lens 42 due to the contraction of the adhesive resins 51 and 52 is offset, and the variation of the coupling efficiency is more than that of the optical module 100 of the first embodiment. It becomes possible to suppress efficiently.

When the optical module 300 shown in FIG. 6 is compared with the conventional optical module 200 shown in FIG. 2, the semiconductor laser 31 and the optical modulator element 32 accompanying the positional change of the first lens 41 and the second lens 42 The graph of the calculation result of the change of coupling efficiency is shown in FIG.
As shown in FIG. 7, when the lens position variation amount of the first lens 41 or the second lens 42 is 0.1 μm, the change of the coupling efficiency in the conventional optical module 200 is -0.3 dB. In the optical module 300 according to the second embodiment, the change in coupling efficiency is suppressed to -0.08 dB. Further, when the lens position variation amount is 0.16 μm, the change in coupling efficiency in the conventional optical module 200 is −0.5 dB, while the change in coupling efficiency is −0.12 dB in the optical module 300 It is suppressed by
In the graph of the calculation result shown in FIG. 7, the positional fluctuation amount of the first lens 41 and the positional fluctuation amount of the second lens 42 have the same value, as in FIG. 3. In addition, since the adhesive resin is a change in the curing direction or a change with time, it is a fluctuation in the shrinkage direction, so the direction of positional fluctuation is the application direction of the adhesive resin 51, 52, that is, the first adhesive direction M3 and the second adhesive direction It is assumed to be M2.

The configuration of the optical module 300 is not limited to that of the second embodiment.
The first substrate 11 and the second substrate 12 may be ceramic materials such as alumina or AIN, glass such as quartz, or metal. Further, as shown in FIG. 8, the base members may be functional members such as TECs 311 and 312.
Also, the materials of the submount substrates 21 and 22 are not limited to ceramic materials such as alumina or AIN as well.

Further, the light emitting unit and the light receiving unit of the optical module 300 are not limited to the combination of the semiconductor laser 31 and the light modulator device 32. For example, a combination of a semiconductor laser and an optical fiber may be used. Further, the combination of the light emitting part and the light receiving part may be a combination of a semiconductor laser and a light receiving element, or a combination of an optical fiber and a light receiving element.
Further, the posts 61 and 62 may be integrally formed with the second substrate 12 or may be formed of separate members different from the second substrate 12.

Third Embodiment
FIG. 9 is a schematic view of a configuration of an optical module 400 according to Embodiment 3 of the present invention.
As shown in FIG. 9, the post 62 of the light module 400 has a lens support 62a. The lens support 62 a is disposed above the second lens 42. The second lens 42 has a second adhesive surface 42 b on the upper surface, and is adhered to the second adhesive surface 42 b by an adhesive resin 52 provided so that the second lens 42 is in a state of being suspended from the lens support portion 62 a It is fixed. Further, similarly to the optical module 100, the adhesive resin 51 is applied and provided on the first adhesive surface 41 a on the lower surface side of the first lens 41, and the first lens 41 is attached to the first substrate 11 via the adhesive resin 51. It is adhesively fixed directly to the

  As described above, in the optical module 400 according to the third embodiment, the first bonding direction M1 in which the first bonding surface 41a of the first lens 41 is bonded and fixed, and the second bonding surface 42b of the second lens 42 are bonded and fixed. The second bonding direction M5 to be carried out indicates the vertical direction. That is, the first bonding direction M1 and the second bonding direction M5 are directions perpendicular to the optical axis direction L of the light 7. Further, the direction X1 facing the first adhesive surface 41a and the direction Y4 facing the second adhesive surface 42b are different by 180 ° from each other. Thus, in the optical module 400 according to the third embodiment, as in the optical modules 100 and 300, it is possible to suppress a change in coupling efficiency between the semiconductor laser 31 and the optical modulator element 32.

Further, in the optical module 400, since the shape of the post 62 and the thickness of the submount substrate 22 and the optical modulator element 32 can be formed with high accuracy, the thickness of the adhesive resin 52 can be controlled with high accuracy. By designing the thicknesses 51 and 52 uniformly, it is possible to equalize the variation amounts of the first lens 41 and the second lens 42 due to the curing shrinkage amount of the adhesive resin 51 or 52 or the change with time.
The hanging structure by the post and the lens support portion is not limited to the case where the second lens 42 on the second substrate 12 side is bonded, and the first lens 41 on the first substrate 11 side is bonded to the lens support portion It is also good.

Fourth Embodiment
FIG. 10 is a schematic view of a configuration of an optical module 500 according to Embodiment 4 of the present invention.
As shown in FIG. 10, a plate-shaped post 562 is fixed to the second substrate 12 of the optical module 500. The post 562 is disposed on the optical axis of the light 7. The post 562 is provided between the first lens 41 and the second lens 42 along the optical axis direction L of the light 7. Further, the post 562 is formed with a circular opening 562 a through which the light 7 can pass. In addition, a lens support portion 562 b is attached to the upper end of the post 562. The second adhesive surface 42 b on the upper surface side of the second lens 42 is adhesively fixed to the lens support portion 562 b directly via the adhesive resin 52. The lens support portion 562 b is a part of the post 562.
The post 562 and the lens support portion 562 b constitute a part of the base member.

  As described above, in the optical module 500 according to the fourth embodiment, like the optical module 400, the first adhesion direction M1 facing the first adhesive surface 41a of the first lens 41 and the second adhesion of the second lens 42 The second bonding direction M5 facing the surface 42b indicates the vertical direction. That is, the first bonding direction M1 and the second bonding direction M5 are directions perpendicular to the optical axis direction L of the light 7. Further, the direction X1 facing the first adhesive surface 41a and the direction Y4 facing the second adhesive surface 42b are different by 180 ° from each other. Thus, in the optical module 500 according to the fourth embodiment, as in the optical modules 100, 300, and 400, it is possible to suppress a change in coupling efficiency between the semiconductor laser 31 and the optical modulator element 32.

Further, the post 562 is disposed between the first lens 41 and the second lens 42 along the optical axis direction L of the light 7 by forming the opening 562 a through which the light 7 can pass through the post 562. can do. Therefore, the space on the upper surface of the second substrate 12 can be made wider with respect to the lateral direction V perpendicular to the optical axis direction L of the light 7. Therefore, since the plurality of lenses and semiconductor elements can be arranged more closely along the lateral direction V, the configuration of the optical module 500 is also applied to a parallel integration type optical module, for example, a multi-lane integration optical module Can.
In the same manner as the optical module 400, the hanging structure by the post and the lens supporting portion is not limited to the case where the second lens 42 on the second substrate 12 side is adhered, and the first lens 41 on the first substrate 11 side It may be adhered to the lens support.

Embodiment 5
FIG. 11 is a schematic view of a configuration of an optical module 600 according to Embodiment 5 of the present invention.
As shown in FIG. 11, a rectangular solid post 662 is provided on the second substrate 12 of the optical module 600. The post 662 is disposed between the first lens 41 and the second lens 42 along the optical axis direction L of the light 7. The height of the post 662 is lower than the path of the light 7. Thus, the post 662 does not impede the travel of the light 7.

  An adhesive resin 651 is applied to the lower end of the first lens 41, and the first lens 41 is adhesively fixed to the submount substrate 21 via the adhesive resin 651. That is, the first lens 41 is fixed to the first substrate 11 via the adhesive resin 651 and the submount substrate 21. Here, the side surface of the first lens 41 on the side where the adhesive resin 651 is provided is referred to as a first adhesive surface 41 c. The first bonding direction M6 in which the first bonding surface 41c is bonded and fixed is the same as the optical axis direction L of the light 7. The direction X5 facing the first adhesive surface 41c is the direction facing the semiconductor laser 31 from which the light 7 is emitted.

  An adhesive resin 652 is applied to the lower end of the second lens 42, and the second lens 42 is adhesively fixed to the post 662 via the adhesive resin 652. That is, the second lens 42 is fixed to the second substrate 12 via the adhesive resin 652 and the post 662. Here, the side surface of the second lens 42 on the side where the adhesive resin 652 is provided is referred to as a second adhesive surface 42 c. The second bonding direction M7 to which the second bonding surface 42c is bonded is the same as the optical axis direction L of the light 7. In addition, the direction Y5 facing the second adhesive surface 42c of the second lens 42 is the direction facing the first lens 41. That is, the direction X5 facing the first adhesive surface 41c of the first lens 41 and the direction Y5 facing the second adhesive surface 42c of the second lens 42 are the same.

  As described above, in the optical module 600 according to the fifth embodiment, the first bonding direction M6 of the first bonding surface 41c of the first lens 41 and the second bonding direction M7 of the second bonding surface 42c of the second lens 42 are Both are in the same direction as the optical axis direction L of the light 7. Thereby, even if the adhesive resins 651 and 652 change in volume due to shrinkage and aging with curing of the adhesive resins 651 and 652 and the positions of the first lens 41 and the second lens 42 change, the incident light intensity You can reduce the loss of Therefore, it is possible to suppress a change in coupling efficiency between the semiconductor laser 31 and the light modulator element 32. This is because the change of the coupling efficiency with respect to the positional fluctuation of the first lens 41 and the second lens 42 is minimized when the positional fluctuation of the first lens 41 and the second lens 42 in the optical axis direction L of the light 7 is made. to cause.

Sixth Embodiment
FIG. 12 is a schematic view showing a configuration of an optical module 700 according to Embodiment 6 of the present invention.
As shown in FIG. 12, a plate-shaped post 762 is provided on the second substrate 12 of the optical module 700. The post 762 is provided on one side of the upper surface of the second substrate 12 along the optical axis direction L of the light 7. The post 762 is extended to the vicinity of the area where the light modulator element 32 is mounted. The second lens 42 is adhered to the post 762 via an adhesive resin 52 applied to the second adhesive surface 42 a. The submount substrate 22 is in contact with the post 762.

  As described above, in the optical module 700 according to the sixth embodiment, the first adhesion direction M1 of the first adhesive surface 41a of the first lens 41 and the second adhesive surface 42a of the second lens 42 are the same as the optical module 100. The second bonding direction M2 is a direction perpendicular to the optical axis direction L of the light 7. Further, the direction X1 facing the first adhesive surface 41a and the direction Y2 facing the second adhesive surface 42a differ from each other by 90 °. Thereby, in the optical module 700 according to the sixth embodiment, as in the optical module 100 according to the first embodiment, it is possible to suppress a change in coupling efficiency between the semiconductor laser 31 and the optical modulator element 32. Become.

  The post 762 is extended along the optical axis direction L of the light 7 and provided on one side of the upper surface of the second substrate 12. Therefore, the position of the light modulator element 32 relative to the second substrate 12 can be determined by pressing the light modulator element 32 indirectly against the post 762 via the submount substrate 22 and making contact with the post 762. Therefore, the position of the second lens 42 relative to the post 762 can be reliably determined because the light modulator element 32 can be accurately positioned relative to the post 762. Therefore, the thickness of the adhesive resin 52 for fixing the second lens 42 can also be uniquely determined. On the other hand, since the thickness of the adhesive resin 51 is uniquely determined by the thicknesses of the semiconductor laser 31 and the submount substrate 21, the members are mounted such that the adhesive resins 51 and 52 have the same thickness by a simple method of pressing. It becomes possible.

The semiconductor laser 31 may be positioned by providing a post on the first substrate 11 and pressing the submount substrate 21 against the post.
When the post is provided on both the first substrate 11 and the second substrate 12, the post for pressing the submount substrate 21 on which the semiconductor laser 31 is placed and the submount substrate 22 on which the optical modulator element 32 is placed The pressing posts 762 may be disposed on opposite sides of the optical axis of the light 7. As a result, the direction of adhesion of the first lens 41 and the direction of adhesion of the second lens 42 become 180 ° different from each other, and it is possible to more reliably suppress a change in coupling efficiency.

  Further, FIG. 13 is a schematic view showing a modification of the optical module 700 shown in FIG. As shown in FIG. 13, a post auxiliary member 762 a can be attached to the post 762 of the optical module 700. As a result, the light modulator element 32 can be brought into direct contact with the post assisting member 762 a of the post 762, which enables more accurate position adjustment.

  7 light 11 first substrate (base member) 12 second substrate (base member) 21 and 22 submount substrate (base member) 31 semiconductor laser (light emitting portion) 32 light modulator element (light receiving portion) 41 first lens, 41a, 41b, 41c first adhesive surface, 42 second lens, 42a, 42b, 42c second adhesive surface, 51, 52, 651, 652 adhesive resin, 62, 562 post (base member), 562a Opening, 100, 300, 400, 500, 600, 700 Optical module, L Optical light axis direction, M1, M3, M6 first bonding direction, M2, M5 second bonding direction, X1, X3, X5 first bonding surface Facing, Y1, Y4, Y5 Direction facing the second adhesive surface.

Claims (6)

A light emitting unit that emits light;
A light receiving unit that receives light emitted from the light emitting unit;
A first lens and a second lens which are provided between the light emitting unit and the light receiving unit and arranged in the optical axis direction of the light emitted from the light emitting unit;
A base member on which the light emitting unit and the light receiving unit are mounted, and the first lens and the second lens are fixed via a layer of adhesive resin having a predetermined thickness;
The first lens has a first adhesive surface, and only the first adhesive surface is adhered to the base member via the layer of the adhesive resin, whereby the first lens is fixed to the base member. ,
The second lens has a second adhesive surface, and only the second adhesive surface is bonded to the base member via the layer of the adhesive resin, whereby the second lens is fixed to the base member. ,
The first adhesion direction, which is the lamination direction of the first adhesive surface of the first lens and the layer of the adhesive resin, and the lamination direction of the second adhesive surface of the second lens, and the layer of the adhesive resin The second bonding direction is a direction perpendicular to the optical axis direction of the light.
The direction in which the first adhesive surface faces and the direction in which the second adhesive surface faces are different from each other.   The light module according to claim 1, wherein the direction in which the first adhesive surface faces and the direction in which the second adhesive surface face are different by 180 °. The base member has a post provided between the first lens and the second lens,
At least one of the first adhesive surface of the first lens or the second adhesive surface of the second lens is fixed to the post via the layer of the adhesive resin.
The post is formed with an opening through which the light can pass.
The optical module according to claim 1. The base member has a post,
At least one of the first adhesive surface of the first lens or the second adhesive surface of the second lens is fixed to the post via the layer of the adhesive resin.
The light emitting unit or the light receiving unit is positioned by being in contact with the post.
The optical module according to any one of claims 1 to 3 . The light module according to any one of claims 1 to 4 , wherein the base member has a temperature control function. The optical module according to any one of claims 1 to 5 , wherein the base member has a thermal conductivity of 100 W / m / K or more.

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