JPH04392B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vertical integrated circuit, and more particularly to a vertical integrated circuit with an improved input/output terminal structure.

Conventionally, integrated circuits have been housed in insulator packages, and have been led out to the outside using metal terminal plates or thin metal film terminals applied to the outer periphery of the package. FIG. 1 shows an example of the former, in which leg-shaped metal terminal rows 2 are drawn out from a package 1 housing a hybrid integrated circuit therein. However, in this example, not only the terminals must be made from metal plates, but also the space occupied by the terminals becomes large, resulting in insufficient integration. The example shown in Fig. 2 is a package containing a hybrid integrated circuit, or an integrated body 3 that is a single hybrid integrated circuit, with conductors drawn out to the sides and external terminal rows 4 made of conductive films formed thereon by baking. It is. In this example, the volume occupied by the terminals is of little concern, and the integrated circuit can be directly soldered to the printed wiring board, providing the advantage of increased integration and workability. However, even in this example, since the hybrid integrated circuit is horizontal, the area utilization rate of the printed wiring board on which it is mounted is still limited.

An object of the present invention is to provide a vertical integrated circuit that can be mounted more densely on a printed wiring board.

The present invention achieves the above object by devising the external terminal structure of an integrated circuit. Briefly, the present invention relates to a type of integrated circuit in which thin-film external terminals are formed on the sides of a flat integrated circuit, and the external terminals formed on one side of the circuit are connected above and below with an insulating gap between them. It is characterized in that it is formed in two rows spaced apart from each other. Thereby, the flat integrated circuit can be fixed to the printed wiring board by soldering or the like in a vertically erect state with this one side along the surface of the printed wiring board. This makes it possible to maximize the utilization efficiency of the printed wiring board surface.

Examples of the present invention will be described in detail below. Third
The figure shows a hybrid integrated circuit 5 having the characteristics of the present invention, in which the circuit 3 includes a flat body 6 with predetermined electronic components mounted inside and/or on the surface, and a thin film external conductor provided on the sides of the body. 10, 11, 12, 1
It consists of 3 and 14. The main body 6 can be composed of any conventionally known hybrid integrated circuit in which a coil L, a capacitor C, a transistor Tr, a diode, a wiring conductor, etc. are arranged on the surface, inside, or both. A three-layer sandwich structure including a capacitor network 7 based on a dielectric material and capacitor networks 8 and 9 based on a dielectric material having temperature compensation characteristics will be described. Required capacitor electrodes are arranged in each of these layers to face each other, and the ends are drawn out to the peripheral sides of the networks 7, 8, and 9. In addition, the upper and lower capacitor networks 8,
On the exposed surface of 9, passive elements such as a resistor R and a coil L, a transistor Tr, etc. are formed by printing, soldering, or other means, and wiring conductors are arranged.

A plurality of thin film-like connection conductors 1 are provided on three sides of the hybrid integrated circuit body 5, spanning three layers 7, 8, and 9.
1, 12, and 10 are provided for necessary interconnection of the lead conductors exposed from each layer and the wiring conductors on the surface of the main body. Two rows of membrane-like external terminals 13 and 14 are provided on the remaining side of the main body 5, vertically spaced apart with an insulating gap g, and these are pulled out from the main body 5 for connection to an external circuit. electrically connected to the lead-out conductor. External terminal 1
3 and 14 are preferably formed so as to cover the ridges of the upper and lower layers as shown, but may be formed on the upper and lower surfaces of the main body (as shown in FIG. 3) as the case may be.

With the above configuration, the integrated circuit of the present invention can be mounted on a printed wiring board with high packaging density. As shown in FIG. 4, an insertion slot is provided between the printed wiring conductors 16 and 17 of the printed wiring board 15, and the hybrid integrated circuit 5 of the present invention is inserted into this slot.
is inserted vertically with the external terminals 13 and 14 facing down, and solder 18 and 19 is applied to make a predetermined electrical connection. Or, as shown in FIG. 5, the printed wiring board 1
The external terminals 13 and 14 of the hybrid integrated circuit 5 are placed on the opposing portions of the printed wiring conductors 16 and 17 of No. 5 so as to be in contact with each other, and solders 18 and 19 are applied thereto. As described above, according to the present invention, a flat integrated circuit can be mounted vertically on a printed wiring board.
Similar integrated circuits can be mounted close together at high density.
The usage efficiency of printed wiring boards becomes extremely high.

[Brief explanation of drawings]

1 and 2 are perspective views of two examples of conventional hybrid integrated circuits, FIG. 3 is an enlarged perspective view of the hybrid integrated circuit of the present invention, and FIG. 4 is a side view showing the same state of use.
and FIG. 5 is a side view showing another state of use. The main parts in the figure are as follows. 5... Hybrid integrated circuit, 6... Flat circuit body, 7, 8, 9... Capacitor base, 10, 11, 12... Connection conductor, 1
3, 14...External terminal, g...Insulation gap.

Claims (1)

[Scope of Claims] 1. A plurality of film-like external terminals are arranged along the longitudinal direction of one side surface of an integrated circuit section having a flat plate shape, which is perpendicular to the parallel plate surface, at an insulating distance from each other. The film-like external terminals arranged in the two rows are arranged in two rows with the one side surface used as a mounting surface for direct attachment to the printed circuit board, and the film-like external terminals arranged in the two rows are arranged from the one side surface so that the side surface and the two plate surfaces intersect. A vertical integrated circuit, characterized in that the circuit is extended to the edges of the two plate surfaces so as to cover the edges of the two plates. 2. The integrated circuit section is formed by laminating at least one flat plate-shaped multilayer inductor section and at least one flat plate-shaped multilayer capacitor section.
Vertical integrated circuit as described in section. 3. The vertical integrated circuit according to item 2, wherein the integrated circuit section is formed by sandwiching one inductor section between two capacitor sections.