JPH0438079U - - Google Patents
Info
- Publication number
- JPH0438079U JPH0438079U JP8120990U JP8120990U JPH0438079U JP H0438079 U JPH0438079 U JP H0438079U JP 8120990 U JP8120990 U JP 8120990U JP 8120990 U JP8120990 U JP 8120990U JP H0438079 U JPH0438079 U JP H0438079U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- multilayer
- wiring conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Description
第１図は本考案実施例の断面構造を表す図、第
２図はその平面構造を表す図、第３図は従来例の
断面構造を表す図である。 １……外層銅箔、２……大径スルホール、３…
…内部銅箔、４……ガラスエポキシ樹脂、５……
メツキ部分、６……小径スルホール、７……ラン
ド、８……外層パターン。
２図はその平面構造を表す図、第３図は従来例の
断面構造を表す図である。 １……外層銅箔、２……大径スルホール、３…
…内部銅箔、４……ガラスエポキシ樹脂、５……
メツキ部分、６……小径スルホール、７……ラン
ド、８……外層パターン。
Claims (1)
- 多層の配線導体間を電気的に接続するスルホー
ルを有する多層プリント配線板において、上記ス
ルホールの近傍に、そのスルホールより小さい径
を有し、かつ、上記配線導体間を電気的に接続す
るスルホールを設けたことを特徴とするプリント
配線板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8120990U JPH0438079U (ja) | 1990-07-30 | 1990-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8120990U JPH0438079U (ja) | 1990-07-30 | 1990-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438079U true JPH0438079U (ja) | 1992-03-31 |
Family
ID=31626943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8120990U Pending JPH0438079U (ja) | 1990-07-30 | 1990-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438079U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000076281A1 (fr) * | 1999-06-02 | 2000-12-14 | Ibiden Co., Ltd. | Carte a circuit imprime multicouche et procede de fabrication d'une telle carte |
-
1990
- 1990-07-30 JP JP8120990U patent/JPH0438079U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000076281A1 (fr) * | 1999-06-02 | 2000-12-14 | Ibiden Co., Ltd. | Carte a circuit imprime multicouche et procede de fabrication d'une telle carte |
| US6828510B1 (en) | 1999-06-02 | 2004-12-07 | Ibiden Co., Ltd. | Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
| US7985930B2 (en) | 1999-06-02 | 2011-07-26 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| US8283573B2 (en) | 1999-06-02 | 2012-10-09 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board |
| US8288665B2 (en) | 1999-06-02 | 2012-10-16 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| US8288664B2 (en) | 1999-06-02 | 2012-10-16 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board |