JPH0437286Y2 - - Google Patents
Info
- Publication number
- JPH0437286Y2 JPH0437286Y2 JP1985144635U JP14463585U JPH0437286Y2 JP H0437286 Y2 JPH0437286 Y2 JP H0437286Y2 JP 1985144635 U JP1985144635 U JP 1985144635U JP 14463585 U JP14463585 U JP 14463585U JP H0437286 Y2 JPH0437286 Y2 JP H0437286Y2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- head
- magnetic
- highly conductive
- buffer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 25
- 230000035699 permeability Effects 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims 1
- 229920003055 poly(ester-imide) Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 description 16
- 238000007747 plating Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000889 permalloy Inorganic materials 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical group [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Description
【考案の詳細な説明】
(イ) 産業上の利用分野
本考案は電子スチルカメラ装置等に用いられる
ダブルトラツク磁気ヘツドに関する。[Detailed Description of the Invention] (a) Industrial Application Field The present invention relates to a double-track magnetic head used in electronic still camera devices and the like.
(ロ) 従来の技術
現在電子スチルカメラ装置にはフレーム記録方
式のため２チヤンネルインライン型のダブルトラ
ツク磁気ヘツドが用いられている。その一例とし
てバルクタイプのダブルトラツク磁気ヘツドの基
本的構成（それは例えば特開昭60−147912号公報
に示されているが）を第２図に示す。それは中央
部にシールド用スペーサ１３を挾み、両側に同一
形状の一対のヘツドコアを持つ構造となつてい
る。尚ヘツドコアはセンダスト等金属磁性材料よ
りなる主コア１１と酸化物磁性材料よりなる下方
部８と非磁性材料よりなる上方部７からなり中央
にコイルを巻くための貫通孔５を持つ補強コア１
２とによつて構成されている。(b) Prior Art Currently, electronic still camera devices use a two-channel in-line type double-track magnetic head for the frame recording method. As an example, the basic structure of a bulk type double track magnetic head (which is shown in, for example, Japanese Patent Application Laid-open No. 147912/1982) is shown in FIG. It has a structure with a shielding spacer 13 sandwiched in the center and a pair of head cores of the same shape on both sides. The head core consists of a main core 11 made of a metal magnetic material such as Sendust, a lower part 8 made of an oxide magnetic material, and an upper part 7 made of a non-magnetic material, and a reinforcing core 1 having a through hole 5 in the center for winding a coil.
It is composed of 2.
ダブルトラツクヘツドの特性にかかわる問題と
して、両チヤンネル間のクロストークがある。ク
ロストークを低減するためスペーサにシールド材
が用いられている。一般にシールド材としては、
パーマロイ等高透磁率材料、銀等高導電材料が用
いられる。従来ダブルトラツク磁気ヘツドでは、
硬度についての考慮からチタニウム銅等の高導電
材料がシールド材として用いられていた。しかし
ヘツドコア間40μmというシールド板厚みの制限
があるため、充分なシールド効果が得られなかつ
た。そのため、高透磁率材料を高導電材料で挾む
という三層構造のシールド板が考えられている。
三層構造のシールド板において充分なシールド特
性を得るためには、中央の高透磁率材料の良好な
軟磁気特性を必要とする。しかも、この磁気特性
は三層構造のシールド板の構造及び作成法によつ
て大きく影響を受けることが知られている。 A problem related to the characteristics of a double track head is crosstalk between both channels. A shielding material is used in the spacer to reduce crosstalk. Generally, as a shielding material,
A high magnetic permeability material such as permalloy or a highly conductive material such as silver is used. In conventional double track magnetic heads,
Due to hardness considerations, highly conductive materials such as titanium copper were used as shielding materials. However, due to the limited shield plate thickness of 40 μm between the head cores, a sufficient shielding effect could not be obtained. Therefore, a shield plate with a three-layer structure in which a high magnetic permeability material is sandwiched between highly conductive materials has been considered.
In order to obtain sufficient shielding properties in a three-layer shield plate, the high magnetic permeability material in the center requires good soft magnetic properties. Moreover, it is known that the magnetic properties are greatly affected by the structure and manufacturing method of the three-layer shield plate.
従来、三層構造のシールド板作成法として、ク
ラツド法、樹脂接着、メツキ等の方法が知られて
いる。クラツド法は加工による機械的ひずみが発
生し、磁気特性が大巾に劣下していた。樹脂接着
法も、接着時の加圧による機械的ひずみのため、
磁気特性が劣下する問題があり、また接着面が脆
弱なため、加工中に三層が分離するという問題も
あつた。メツキ法は高透磁率材料の磁性板両面に
電気メツキ法あるいは真空メツキ法によつて高導
電材料膜を付着させる方法である。この方法は作
成時磁性板に直接機械的損傷を与えることがな
く、量産に適し、最も有望な方法と考えられるが
膜作成時、磁性板と導電膜との界面で両者の物理
機械的特性の違いから局所的なひずみが発生し、
他の方法と同様磁気特性の劣下が生じクロストー
ク低減の障害となつていた。 Conventionally, methods such as a cladding method, resin adhesion, and plating are known as methods for producing a shield plate having a three-layer structure. In the cladding method, mechanical strain was generated due to processing, and the magnetic properties were significantly degraded. The resin bonding method also suffers from mechanical strain due to pressure during bonding.
There was a problem that the magnetic properties deteriorated, and because the adhesive surface was weak, there was also a problem that the three layers separated during processing. The plating method is a method in which a highly conductive material film is attached to both surfaces of a magnetic plate made of a high magnetic permeability material by electroplating or vacuum plating. This method does not cause direct mechanical damage to the magnetic plate during production, is suitable for mass production, and is considered the most promising method. Local distortion occurs due to differences,
As with other methods, deterioration of magnetic properties occurred, which was an obstacle to crosstalk reduction.
(ハ) 考案が解決しようとする問題点
本考案は従来の三層構造のシールド板の欠点、
すなわちクロストーク低減の障害となつていた加
工（メツキ法）による磁気特性の劣下を解決しよ
うとするものである。(c) Problems to be solved by the invention This invention solves the drawbacks of the conventional three-layer shield plate.
In other words, this is an attempt to solve the problem of deterioration in magnetic properties due to processing (plating method), which has been an obstacle to crosstalk reduction.
(ニ) 問題点を解決するための手段
本考案によるシールド板の構造を第１図に示
す。適当な厚み（t1＝10〜30μm程度）のパーマ
ロイ等高透磁率材料板１の両面に有機樹脂あるい
は金属等の薄い（t2≒1μm程度）緩衝層２を設け
る。その両面の緩衝層の上に、銀、銅等高導電材
料を両面均一に総厚ｔが規格によるヘツドコア間
の幅40μmとなるようメツキ３（t3＝５〜15μm程
度）する。結果として構造上は五層、シールド効
果としては三層の厚さ40μmのシールド板となる。(d) Means for solving the problem The structure of the shield plate according to the present invention is shown in Fig. 1. A thin (t 2 =about 1 μm) buffer layer 2 made of organic resin or metal is provided on both sides of a plate 1 of a high magnetic permeability material such as permalloy having an appropriate thickness (t 1 =about 10 to 30 μm). On the buffer layers on both sides, a highly conductive material such as silver or copper is plated 3 (t 3 =about 5 to 15 μm) uniformly on both sides so that the total thickness t is 40 μm according to the standard width between the head cores. As a result, the structure is five layers, and the shielding effect is three layers, 40 μm thick.
(ホ) 作用
高透磁率材料板の両面に施した緩衝層により、
高導電材料をメツキする際に生ずる磁性板と導電
膜の界面に生ずるひずみが吸収される。そのため
シールド板として、その磁気特性が劣下せず、同
形状で従来のものより高いシールド効果を持たせ
ること、すなわちクロストークを大巾に低減させ
ることができる。(e) Effect: Due to the buffer layer applied to both sides of the high magnetic permeability material plate,
The strain that occurs at the interface between the magnetic plate and the conductive film when plating a highly conductive material is absorbed. Therefore, it can be used as a shield plate without deteriorating its magnetic properties and has a higher shielding effect than conventional ones with the same shape, that is, it can significantly reduce crosstalk.
(ヘ) 実施例
第３図に高導電材料をメツキする前後の高透磁
率材料板のヒステリシスループの変化を示す。こ
こでａが直接メツキする従来の方法によるもの、
ｂが本考案による緩衝層の上にメツキする方法に
よるものをそれぞれ示している。一般に軟磁性材
料では抗磁力Hcが高くなる程、その材料の磁気
特性（透磁率等）が、劣下していると考えられる
ので、磁気特性の変化は材料のHcの測定によつ
て調べている。(f) Example FIG. 3 shows changes in the hysteresis loop of a high magnetic permeability material plate before and after plating with a high conductivity material. Here, a is directly plated by the conventional method,
b shows the method of plating on the buffer layer according to the present invention. In general, for soft magnetic materials, the higher the coercive force Hc, the worse the magnetic properties (magnetic permeability, etc.) of the material are considered to be, so changes in magnetic properties can be investigated by measuring the Hc of the material. There is.
サンプルとしては厚さ15〔μm〕でHcが0.05
〔Oe〕程度の高透磁率材料板を用い、それにピロ
リン酸銅メツキ、シアン化銀メツキ等の総厚
40μmとなる高導電材料のメツキを行なつた場合、
従来の方法ではａに示すようにそのHcが約３倍
の0.15〔Oe〕程度となつた。またこのシールド板
で第２図の構造のヘツドを作成した場合、そのク
ロストークハ−35dB程度であつた。ところが同
じ高透磁率材料板に、例えばポリイミト系、ポリ
エステル系等の有機樹脂材を両面に薄く（1μm程
度）塗布し緩衝層を作成する。引き続き所定の表
面処理を行い無電解メツキ法等で銅あるいは銀等
の高導電材料を総厚40μmになるようメツキを行
なつた場合、そのHcはｂに示すように殆んど変
化がない。また有機樹脂層のかわりに、高透磁率
材料板と物理機械的特性の類似した例えば、パー
マロイ（Ni−Fe）材に対してはニツケルや金等
の金属材料の薄い緩衝層（厚さ1μm程度）を作成
し、その後所定の方法で、銅あるいは銀等の高導
電材料膜を作成してもｂと同様な結果となつた。
また以上の緩衝層をもつたシールド材を用いて従
来と同様なヘツドを作成した場合そのクロストー
クは−45dB程度となつた。 The sample is 15 [μm] thick and Hc is 0.05.
A high permeability material plate of about [Oe] is used, and the total thickness of the plate is copper pyrophosphate plating, silver cyanide plating, etc.
When plating a highly conductive material with a thickness of 40μm,
In the conventional method, the Hc was approximately three times as high as 0.15 [Oe], as shown in a. Furthermore, when a head having the structure shown in FIG. 2 was made using this shield plate, the crosstalk was about 35 dB. However, a buffer layer is created by applying a thin layer (approximately 1 μm) of an organic resin material such as polyimide or polyester to both sides of the same high magnetic permeability material plate. Subsequently, when a predetermined surface treatment is performed and a highly conductive material such as copper or silver is plated using an electroless plating method to a total thickness of 40 μm, there is almost no change in Hc as shown in b. In addition, instead of an organic resin layer, for example, a permalloy (Ni-Fe) material that has similar physical and mechanical properties to a high magnetic permeability material plate, a thin buffer layer (about 1 μm thick) of a metal material such as nickel or gold can be used. ), and then using a predetermined method to form a film of a highly conductive material such as copper or silver, the same results as b were obtained.
Furthermore, when a head similar to the conventional head was made using a shielding material having the above-mentioned buffer layer, the crosstalk was about -45 dB.
(ト) 考案の効果
ダブルトラツクヘツドにおいて、両チヤンネル
間のクロストーク低減のため、高透磁率材料板を
高導電材料板で挾む三層構造のシールド板が考え
られた。その作成法として、高透磁率材料板両面
に薄い緩衝層を施した上に高導電材料をメツキす
る本考案による方法を用いる場合、加工によつて
磁気特性を劣下させることなく、シールド効果と
して三層のシールド板を作成しうる効果がある。
すなわち、よりシールド効果の高い三層シールド
板を作成しうる効果がある。(g) Effects of the invention In order to reduce crosstalk between both channels in a double track head, a three-layer shield plate was devised in which a high permeability material plate is sandwiched between high conductivity material plates. When using the method proposed in this invention, in which a thin buffer layer is applied to both sides of a high magnetic permeability material plate and then a highly conductive material is plated on both sides of the plate, the shielding effect can be achieved without deteriorating the magnetic properties due to processing. It has the effect of creating a three-layer shield plate.
In other words, it is possible to create a three-layer shield plate with a higher shielding effect.
第１図は本考案において使用するシールド板を
示す図である。第２図ａは一般的なバルクタイプ
のダブルトラツク磁気ヘツドの外観斜視図であ
り、第２図ｂはそれに用いられている三層シール
ド板の一部を示す側面図である。第３図ａは従来
例における高導電材料をメツキする前後の高透磁
率材料板のヒステリシスループ特性図であり、第
３図ｂは本考案の磁気ヘツドにおける同様な特性
図である。
１……高透磁率材料板、２……緩衝層、３……
高導電材料板、（t1）（t2）（t3）……厚み、ｔ……
総厚、１１……ヘツドチツプ（主コア）、１２…
…補給コア、１３……シールド用スペーサ（シー
ルド板）、４……ヘツドギヤツプ。
FIG. 1 is a diagram showing a shield plate used in the present invention. FIG. 2a is an external perspective view of a general bulk type double track magnetic head, and FIG. 2b is a side view showing part of a three-layer shield plate used therein. FIG. 3a is a hysteresis loop characteristic diagram of a high magnetic permeability material plate before and after plating with a highly conductive material in a conventional example, and FIG. 3b is a similar characteristic diagram of a magnetic head of the present invention. 1... High magnetic permeability material plate, 2... Buffer layer, 3...
Highly conductive material plate, (t 1 ) (t 2 ) (t 3 )...thickness, t...
Total thickness, 11... Head chip (main core), 12...
... Supply core, 13... Shield spacer (shield plate), 4... Head gap.
Claims (1)
に同一形状の一対のヘツドチツプを持つたダブル
トラツク型の磁気ヘツドにおいて、前記シールド
用スペーサは中央の高透磁率材料板の両面にポリ
エステル又はポリイミド系の有機樹脂あるいは
金、ニツケル等の金属膜よりなる緩衝層を有し、
該緩衝層の外側面に高導電材料をメツキしている
ことを特徴とする磁気ヘツド。 In a double-track magnetic head that has a shielding spacer sandwiched in the center and a pair of head chips of the same shape on both sides, the shielding spacer is made of polyester or polyimide-based organic material on both sides of the central high magnetic permeability material plate. It has a buffer layer made of resin or metal film such as gold or nickel,
A magnetic head characterized in that the outer surface of the buffer layer is plated with a highly conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144635U JPH0437286Y2 (en) | 1985-09-20 | 1985-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144635U JPH0437286Y2 (en) | 1985-09-20 | 1985-09-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6255209U JPS6255209U (en) | 1987-04-06 |
| JPH0437286Y2 true JPH0437286Y2 (en) | 1992-09-02 |
Family
ID=31055420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985144635U Expired JPH0437286Y2 (en) | 1985-09-20 | 1985-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0437286Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5228308A (en) * | 1975-08-29 | 1977-03-03 | Ngk Insulators Ltd | Magnetic head for multi-tracks |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5747946Y2 (en) * | 1973-04-26 | 1982-10-21 |
-
1985
- 1985-09-20 JP JP1985144635U patent/JPH0437286Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5228308A (en) * | 1975-08-29 | 1977-03-03 | Ngk Insulators Ltd | Magnetic head for multi-tracks |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6255209U (en) | 1987-04-06 |
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