JPH04357801A - Manufacture of chip type resistor string - Google Patents

Abstract

PURPOSE:To eliminate short circuit across terminals caused when an electrode paste, used when an end face electrode is formed, flows into through-holes between adjacent electrodes or to eliminate solder bridge formed at the time of soldering when a chip type resistor train is manufactured. CONSTITUTION:An upper side electrode 4a and a back side electrode 4b are formed on an insulation substrate 1, and a resistor 5 is formed so as to contact with the upper side electrode 4a, and a preventive coat glass 6 is formed after the resistor is laser trimmed, and then the insulation substrate 1 is divided by a lateral dividing slit 2 to form end face electrodes 8 at the cut edge and then both the end face electrodes formed among resistors 5 and a part of the cut edge of the insulation substrate are removed followed by drilling of through- holes 9, thus the insulation substrate is divided into a separate chip type resistor string 10 by longitudinal dividing slits 3.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a series of chip resistors commonly used in electronic circuits.

0002

2. Description of the Related Art An example of a conventional method of manufacturing a series of chip-type resistors will be explained with reference to FIG. FIG. 2 is a process diagram showing a conventional method of manufacturing a series of chip-type resistors. First, an insulating substrate is prepared which has vertical and horizontal dividing slits provided at regular intervals on its surface so as to configure a plurality of resistance elements, and a through hole provided above the horizontal dividing slits. Perform accepting process A. Next, step B is performed in which an upper surface electrode is formed on the upper surface of the insulating substrate by inserting a through hole across the horizontal dividing slit. Next, step C of forming a back electrode on the back surface of the insulating substrate in correspondence with the top electrode.
I do. Next, step D is performed in which a resistor is formed on the insulating substrate so as to be connected to the upper surface electrode. Next, a laser trimming step E is performed to adjust the resistance value of the resistor to a predetermined resistance value. Next, step F is performed to form a protective glass that completely covers the resistor that has been corrected by laser trimming. Next, step G is performed in which the insulating substrate is divided by horizontal slits. Next, a step H is performed in which end electrodes are formed on the divided surfaces of the divided insulating substrate. Next, step I is performed in which the insulating substrate on which the end surface electrodes have been formed is divided into individual pieces by vertical slits. Finally, step J is performed in which the exposed electrodes are plated. Conventional chip-type resistor series were manufactured through the process described above.

FIG. 3 is a perspective view of a conventional chip type resistor series. In FIG. 3, 21 is a series of chip resistors;
22 is a protective coat glass, 23 is a top electrode, and 24 is an end electrode.

0004

However, in this method of manufacturing a chip type resistor series, when applying the electrode paste 25 to form the end face electrode 24, as shown in FIG. There is a problem in that the electrode paste 25 flows into the holes, causing a short circuit between the terminals, or easily causing solder bridging during reflow soldering during mounting.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a series of chip resistors that does not cause short-circuits between terminals and does not cause solder bridges during reflow soldering during mounting.

[0006]

[Means for Solving the Problems] In order to achieve this object, the method for manufacturing a series of chip resistors of the present invention provides a method for manufacturing a series of chip-type resistors, in which the surface is divided vertically and horizontally so that a plurality of resistance elements are formed. forming a top electrode on the top surface of the large insulating substrate with the slit formed therein so as to span the lateral slit, and forming a back electrode on the back surface of the insulating substrate in correspondence with the top electrode; A step of forming a resistor on an insulating substrate so as to be connected to the top electrode, and after dividing the insulating substrate with horizontal slits, forming an end electrode on the cut end surface to connect the top electrode and the back electrode. a step of cutting out an end surface electrode formed between adjacent resistors of the insulating substrate and a part of the cut end surface of the insulating substrate; It consists of a step of dividing the resistor into individual resistor series by dividing it with vertical slits.

[0007]

[Operation] According to the present invention, after the step of forming the end electrodes, the end electrodes formed between the resistors and a part of the insulating substrate are removed to form the through holes. It is possible to prevent short circuits between terminals and solder bridges during soldering due to electrode paste flowing into the terminals.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a series of chip resistors according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a process diagram showing a method of manufacturing a series of chip-type resistors according to an embodiment of the present invention. First, vertical dividing slits 3 and horizontal dividing slits 2 are provided at regular intervals on the surface so that a plurality of resistance elements are formed.
Step A of receiving the insulating substrate 1 having the following steps is performed. Next, step B is performed in which the upper surface electrode 4a is formed on the upper surface of the insulating substrate 1 so as to straddle the horizontal dividing slit 2. Then, step C is performed in which a back electrode 4b is formed on the back surface of the insulating substrate in correspondence with the top electrode 4a. Next, step D is performed in which a resistor 5 is formed on the insulating substrate 1 so as to be connected to the upper surface electrode 4a. Furthermore, a laser trimming step E is performed to adjust the resistance value of the resistor 5 to a predetermined resistance value.
I do. Next, step F is performed to form a protective coat glass 6 that completely covers the resistor 5a that has been corrected by laser trimming. Then, step G is performed in which the insulating substrate 1 is divided by the horizontal dividing slits 2 to form strip-shaped insulating substrates 7. Thereafter, a step H is performed in which end electrodes 8 are formed on the cut end surfaces of the divided insulating substrate 7 to form an insulating substrate 7a with end electrodes formed thereon. Next, step I is performed in which the end electrode formed between the adjacent resistors of the insulating substrate 7a on which the end electrode has been formed and a part of the cut end surface of the insulating substrate are removed by a dicing method to process and form a through hole 9. . Furthermore, a step J is performed in which the insulating substrate is divided into individual chip-shaped resistor arrays 10 using vertical dividing slits 3. Finally, step K is performed in which the exposed electrodes are plated. Through the above steps, a series of chip resistors according to this example was manufactured.

In the chip type resistor series of this embodiment, since the electrode paste did not adhere to the through hole 9 portion, no short circuit occurred between the terminals, and therefore no solder bridging occurred during soldering.

[0011]

[Effects of the Invention] As is clear from the above description, according to the manufacturing method of the present invention, it is possible to prevent short circuits between terminals and solder bridging during soldering due to electrode paste flowing into through holes. Moreover, the dimensional accuracy of the through hole can be improved. Further, since it is not necessary to provide a through hole in the insulating substrate in advance, the structure of the substrate mold for manufacturing the insulating substrate is simple, and the insulating substrate can be manufactured at low cost.

[Brief explanation of drawings]

FIG. 1 is a process diagram showing a method of manufacturing a series of chip resistors according to an embodiment of the present invention.

[Figure 2] Process diagram showing the manufacturing method of a conventional chip type resistor series

[Figure 3] Perspective view of a conventional chip type resistor series

[Explanation of symbols]

1 Insulating substrate 2 Horizontal dividing slit 3 Vertical dividing slit 4a Top electrode 4b Back electrode 5 Resistor 5a Laser trimming corrected resistor 6 Protective coat glass 7 Strip-shaped insulating substrate 7a Insulating substrate with end electrodes formed 8 End electrode 9 Through hole 10 Chip type resistor series

Claims (1)

[Claims] 1. A large insulating substrate having vertical and horizontal dividing slits formed on its surface so as to form a plurality of resistance elements, and a top electrode extending across the horizontal slits. and forming a back electrode on the back surface of the insulating substrate in correspondence with the top electrode;
forming a resistor on an insulating substrate so as to be connected to the top electrode; and after dividing the insulating substrate with horizontal slits, an end electrode is formed on the cut end surface of the insulating substrate to connect the top electrode and the back electrode. a step of cutting out an end face electrode formed between adjacent resistors of the insulating substrate and a part of the cut end surface of the insulating substrate; A method of manufacturing a chip-type resistor series, which comprises the steps of: dividing the series with vertical slits and separating it into individual series of resistors.