JPH043513Y2 - - Google Patents
Info
- Publication number
- JPH043513Y2 JPH043513Y2 JP1985198054U JP19805485U JPH043513Y2 JP H043513 Y2 JPH043513 Y2 JP H043513Y2 JP 1985198054 U JP1985198054 U JP 1985198054U JP 19805485 U JP19805485 U JP 19805485U JP H043513 Y2 JPH043513 Y2 JP H043513Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lead wire
- conductive pattern
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 18
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985198054U JPH043513Y2 (US20100268047A1-20101021-C00003.png) | 1985-12-23 | 1985-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985198054U JPH043513Y2 (US20100268047A1-20101021-C00003.png) | 1985-12-23 | 1985-12-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62104471U JPS62104471U (US20100268047A1-20101021-C00003.png) | 1987-07-03 |
| JPH043513Y2 true JPH043513Y2 (US20100268047A1-20101021-C00003.png) | 1992-02-04 |
Family
ID=31158389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985198054U Expired JPH043513Y2 (US20100268047A1-20101021-C00003.png) | 1985-12-23 | 1985-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH043513Y2 (US20100268047A1-20101021-C00003.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5965495A (ja) * | 1982-10-06 | 1984-04-13 | 共信商事株式会社 | プリント配線板裏面の追加配線等の固着法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56126882U (US20100268047A1-20101021-C00003.png) * | 1980-02-26 | 1981-09-26 |
-
1985
- 1985-12-23 JP JP1985198054U patent/JPH043513Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5965495A (ja) * | 1982-10-06 | 1984-04-13 | 共信商事株式会社 | プリント配線板裏面の追加配線等の固着法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62104471U (US20100268047A1-20101021-C00003.png) | 1987-07-03 |
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