JPH0434811B2 - - Google Patents

Info

Publication number
JPH0434811B2
JPH0434811B2 JP59088003A JP8800384A JPH0434811B2 JP H0434811 B2 JPH0434811 B2 JP H0434811B2 JP 59088003 A JP59088003 A JP 59088003A JP 8800384 A JP8800384 A JP 8800384A JP H0434811 B2 JPH0434811 B2 JP H0434811B2
Authority
JP
Japan
Prior art keywords
pattern
wafer
edge type
edge
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59088003A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59224127A (ja
Inventor
Wai Uu Furederitsuku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ESU BUI JII RITOGURAFUII SHISUTEMUZU Inc
Original Assignee
ESU BUI JII RITOGURAFUII SHISUTEMUZU Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ESU BUI JII RITOGURAFUII SHISUTEMUZU Inc filed Critical ESU BUI JII RITOGURAFUII SHISUTEMUZU Inc
Publication of JPS59224127A publication Critical patent/JPS59224127A/ja
Publication of JPH0434811B2 publication Critical patent/JPH0434811B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP59088003A 1983-05-02 1984-05-02 走査マスク整合器のための整合装置 Granted JPS59224127A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US490614 1983-05-02
US06/490,614 US4578590A (en) 1983-05-02 1983-05-02 Continuous alignment target pattern and signal processing

Publications (2)

Publication Number Publication Date
JPS59224127A JPS59224127A (ja) 1984-12-17
JPH0434811B2 true JPH0434811B2 (en, 2012) 1992-06-09

Family

ID=23948792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59088003A Granted JPS59224127A (ja) 1983-05-02 1984-05-02 走査マスク整合器のための整合装置

Country Status (5)

Country Link
US (1) US4578590A (en, 2012)
EP (1) EP0123982B1 (en, 2012)
JP (1) JPS59224127A (en, 2012)
CA (1) CA1211869A (en, 2012)
DE (1) DE3485485D1 (en, 2012)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703434A (en) * 1984-04-24 1987-10-27 The Perkin-Elmer Corporation Apparatus for measuring overlay error
US4669866A (en) * 1985-01-28 1987-06-02 Phillips Edward H Step-and-repeat alignment and exposure system and method therefore
US4654517A (en) * 1985-04-16 1987-03-31 Protocad, Inc. Optical sight for computer controlled plotter with improved locating capability
US4887530A (en) * 1986-04-07 1989-12-19 Quad/Tech, Inc. Web registration control system
EP0311624A1 (en) * 1986-06-24 1989-04-19 Lothian Microfabrication Limited Improved registration method in photolithography and equipment for carrying out this method
US5412577A (en) * 1992-10-28 1995-05-02 Quad/Tech International Color registration system for a printing press
US5477057A (en) * 1994-08-17 1995-12-19 Svg Lithography Systems, Inc. Off axis alignment system for scanning photolithography
US5767523A (en) * 1997-04-09 1998-06-16 Svg Lithography Systems, Inc. Multiple detector alignment system for photolithography
US6628406B1 (en) * 2000-04-20 2003-09-30 Justin L. Kreuzer Self referencing mark independent alignment sensor
US7209235B2 (en) * 2002-07-11 2007-04-24 Hymite A/S Accurate positioning of components of a optical assembly
US7459247B2 (en) * 2004-12-27 2008-12-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7511826B2 (en) * 2006-02-27 2009-03-31 Asml Holding N.V. Symmetrical illumination forming system and method
US20080036984A1 (en) * 2006-08-08 2008-02-14 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4259019A (en) * 1971-03-22 1981-03-31 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects, for example a semiconductor wafer and a transparent mask
US4408885A (en) * 1971-03-22 1983-10-11 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects, e.g. a semiconductor wafer and mask
CH629000A5 (de) * 1978-05-22 1982-03-31 Bbc Brown Boveri & Cie Verfahren zum optischen justieren von bauelementen.
JPS5534490A (en) * 1978-09-01 1980-03-11 Canon Inc Alignment device
FR2450468A1 (fr) * 1979-02-27 1980-09-26 Thomson Csf Systeme optique d'alignement de deux motifs et photorepeteur mettant en oeuvre un tel systeme
US4353087A (en) * 1979-03-12 1982-10-05 The Perkin-Elmer Corporation Automatic mask alignment

Also Published As

Publication number Publication date
JPS59224127A (ja) 1984-12-17
DE3485485D1 (de) 1992-03-12
US4578590A (en) 1986-03-25
CA1211869A (en) 1986-09-23
EP0123982A2 (en) 1984-11-07
EP0123982B1 (en) 1992-01-29
EP0123982A3 (en) 1987-10-14

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