JPH0434799U - - Google Patents
Info
- Publication number
- JPH0434799U JPH0434799U JP7698090U JP7698090U JPH0434799U JP H0434799 U JPH0434799 U JP H0434799U JP 7698090 U JP7698090 U JP 7698090U JP 7698090 U JP7698090 U JP 7698090U JP H0434799 U JPH0434799 U JP H0434799U
- Authority
- JP
- Japan
- Prior art keywords
- butt
- coating
- mark
- butt mark
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990076980U JP2530625Y2 (ja) | 1990-07-18 | 1990-07-18 | 塗布装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990076980U JP2530625Y2 (ja) | 1990-07-18 | 1990-07-18 | 塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0434799U true JPH0434799U (enrdf_load_stackoverflow) | 1992-03-23 |
JP2530625Y2 JP2530625Y2 (ja) | 1997-03-26 |
Family
ID=31618937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990076980U Expired - Lifetime JP2530625Y2 (ja) | 1990-07-18 | 1990-07-18 | 塗布装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2530625Y2 (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002299384A (ja) * | 2001-04-04 | 2002-10-11 | Toray Eng Co Ltd | チップボンディング方法およびその装置 |
JP2012028655A (ja) * | 2010-07-26 | 2012-02-09 | Hitachi High-Tech Instruments Co Ltd | 電子部品実装ラインの管理方法及びその管理システム |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6212200A (ja) * | 1985-07-10 | 1987-01-21 | 株式会社日立製作所 | チツプ部品搭載機のバツドマ−ク検出装置 |
JPS649700A (en) * | 1987-07-01 | 1989-01-12 | Hitachi Ltd | Assembly line of multi-item and multi-shape printed board |
-
1990
- 1990-07-18 JP JP1990076980U patent/JP2530625Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6212200A (ja) * | 1985-07-10 | 1987-01-21 | 株式会社日立製作所 | チツプ部品搭載機のバツドマ−ク検出装置 |
JPS649700A (en) * | 1987-07-01 | 1989-01-12 | Hitachi Ltd | Assembly line of multi-item and multi-shape printed board |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002299384A (ja) * | 2001-04-04 | 2002-10-11 | Toray Eng Co Ltd | チップボンディング方法およびその装置 |
JP2012028655A (ja) * | 2010-07-26 | 2012-02-09 | Hitachi High-Tech Instruments Co Ltd | 電子部品実装ラインの管理方法及びその管理システム |
Also Published As
Publication number | Publication date |
---|---|
JP2530625Y2 (ja) | 1997-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |