JPH0434799U - - Google Patents

Info

Publication number
JPH0434799U
JPH0434799U JP7698090U JP7698090U JPH0434799U JP H0434799 U JPH0434799 U JP H0434799U JP 7698090 U JP7698090 U JP 7698090U JP 7698090 U JP7698090 U JP 7698090U JP H0434799 U JPH0434799 U JP H0434799U
Authority
JP
Japan
Prior art keywords
butt
coating
mark
butt mark
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7698090U
Other languages
Japanese (ja)
Other versions
JP2530625Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990076980U priority Critical patent/JP2530625Y2/en
Publication of JPH0434799U publication Critical patent/JPH0434799U/ja
Application granted granted Critical
Publication of JP2530625Y2 publication Critical patent/JP2530625Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は本考案の基板組立装置の構
成回路図及び斜視図、第３図はバツドマークメモ
リの内容を示す図、第４図は塗布装置と電子部品
自動装着装置間の信号ラインを示す図、第５図は
動作を示すフローチヤートである。 １……基板組立装置、２……バツドマーク、６
……バツドマーク検出センサ（バツドマーク検出
装置）、１４，２９……ＲＡＭ、１６，３２……
ＣＰＵ、３０……シフトレジスタ。 1 and 2 are a configuration circuit diagram and a perspective view of the board assembly device of the present invention, FIG. 3 is a diagram showing the contents of the butt mark memory, and FIG. 4 is a diagram showing the connection between the coating device and the automatic electronic component mounting device. FIG. 5, which is a diagram showing signal lines, is a flowchart showing the operation. 1... Board assembly device, 2... Bad mark, 6
...Bud mark detection sensor (buck mark detection device), 14, 29...RAM, 16, 32...
CPU, 30...shift register.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品自動装着装置が装着するチツプ状電子
部品を仮固定するために塗布部より吐出された塗
布剤を夫々が独立した基板として使用される複数
の基板部より成る多面取り基板に塗布する塗布装
置に於いて、前記基板部毎にバツドマークの有無
を検出するバツドマーク検出装置と、該バツドマ
ーク検出装置で検出されたバツドマークデータを
記憶する記憶装置と、該記憶装置に記憶されたバ
ツドマークデータを基にバツドマークの付された
基板部には前記部品を装着しないように前記電子
部品自動装着装置側に信号を送る送信装置とを設
けたことを特徴とする塗布装置。 A coating device that applies a coating material discharged from a coating section to a multi-sided board consisting of a plurality of board sections, each of which is used as an independent board, in order to temporarily fix chip-shaped electronic components mounted by an automatic electronic component mounting device. a butt mark detection device for detecting the presence or absence of a butt mark on each of the substrate parts; a storage device for storing the butt mark data detected by the butt mark detection device; and the butt mark data stored in the storage device. 1. A coating apparatus comprising: a transmitting device for sending a signal to the electronic component automatic mounting apparatus so as not to mount the component on a substrate portion to which a cross mark is attached based on the .
JP1990076980U 1990-07-18 1990-07-18 Coating device Expired - Lifetime JP2530625Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990076980U JP2530625Y2 (en) 1990-07-18 1990-07-18 Coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990076980U JP2530625Y2 (en) 1990-07-18 1990-07-18 Coating device

Publications (2)

Publication Number Publication Date
JPH0434799U true JPH0434799U (en) 1992-03-23
JP2530625Y2 JP2530625Y2 (en) 1997-03-26

Family

ID=31618937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990076980U Expired - Lifetime JP2530625Y2 (en) 1990-07-18 1990-07-18 Coating device

Country Status (1)

Country Link
JP (1) JP2530625Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299384A (en) * 2001-04-04 2002-10-11 Toray Eng Co Ltd Method and apparatus for bonding chip
JP2012028655A (en) * 2010-07-26 2012-02-09 Hitachi High-Tech Instruments Co Ltd Management method for electronic component mounting line and management system therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6212200A (en) * 1985-07-10 1987-01-21 株式会社日立製作所 Bad mark detector for chip part carrier
JPS649700A (en) * 1987-07-01 1989-01-12 Hitachi Ltd Assembly line of multi-item and multi-shape printed board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6212200A (en) * 1985-07-10 1987-01-21 株式会社日立製作所 Bad mark detector for chip part carrier
JPS649700A (en) * 1987-07-01 1989-01-12 Hitachi Ltd Assembly line of multi-item and multi-shape printed board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299384A (en) * 2001-04-04 2002-10-11 Toray Eng Co Ltd Method and apparatus for bonding chip
JP4523732B2 (en) * 2001-04-04 2010-08-11 東レエンジニアリング株式会社 Chip bonding equipment
JP2012028655A (en) * 2010-07-26 2012-02-09 Hitachi High-Tech Instruments Co Ltd Management method for electronic component mounting line and management system therefor

Also Published As

Publication number Publication date
JP2530625Y2 (en) 1997-03-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term