JPH0434799U - - Google Patents
Info
- Publication number
- JPH0434799U JPH0434799U JP7698090U JP7698090U JPH0434799U JP H0434799 U JPH0434799 U JP H0434799U JP 7698090 U JP7698090 U JP 7698090U JP 7698090 U JP7698090 U JP 7698090U JP H0434799 U JPH0434799 U JP H0434799U
- Authority
- JP
- Japan
- Prior art keywords
- butt
- coating
- mark
- butt mark
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Description
第１図及び第２図は本考案の基板組立装置の構
成回路図及び斜視図、第３図はバツドマークメモ
リの内容を示す図、第４図は塗布装置と電子部品
自動装着装置間の信号ラインを示す図、第５図は
動作を示すフローチヤートである。
１……基板組立装置、２……バツドマーク、６
……バツドマーク検出センサ（バツドマーク検出
装置）、１４，２９……ＲＡＭ、１６，３２……
ＣＰＵ、３０……シフトレジスタ。
1 and 2 are a configuration circuit diagram and a perspective view of the board assembly device of the present invention, FIG. 3 is a diagram showing the contents of the butt mark memory, and FIG. 4 is a diagram showing the connection between the coating device and the automatic electronic component mounting device. FIG. 5, which is a diagram showing signal lines, is a flowchart showing the operation. 1... Board assembly device, 2... Bad mark, 6
...Bud mark detection sensor (buck mark detection device), 14, 29...RAM, 16, 32...
CPU, 30...shift register.
Claims (1)
部品を仮固定するために塗布部より吐出された塗
布剤を夫々が独立した基板として使用される複数
の基板部より成る多面取り基板に塗布する塗布装
置に於いて、前記基板部毎にバツドマークの有無
を検出するバツドマーク検出装置と、該バツドマ
ーク検出装置で検出されたバツドマークデータを
記憶する記憶装置と、該記憶装置に記憶されたバ
ツドマークデータを基にバツドマークの付された
基板部には前記部品を装着しないように前記電子
部品自動装着装置側に信号を送る送信装置とを設
けたことを特徴とする塗布装置。 A coating device that applies a coating material discharged from a coating section to a multi-sided board consisting of a plurality of board sections, each of which is used as an independent board, in order to temporarily fix chip-shaped electronic components mounted by an automatic electronic component mounting device. a butt mark detection device for detecting the presence or absence of a butt mark on each of the substrate parts; a storage device for storing the butt mark data detected by the butt mark detection device; and the butt mark data stored in the storage device. 1. A coating apparatus comprising: a transmitting device for sending a signal to the electronic component automatic mounting apparatus so as not to mount the component on a substrate portion to which a cross mark is attached based on the .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990076980U JP2530625Y2 (en) | 1990-07-18 | 1990-07-18 | Coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990076980U JP2530625Y2 (en) | 1990-07-18 | 1990-07-18 | Coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0434799U true JPH0434799U (en) | 1992-03-23 |
| JP2530625Y2 JP2530625Y2 (en) | 1997-03-26 |
Family
ID=31618937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990076980U Expired - Lifetime JP2530625Y2 (en) | 1990-07-18 | 1990-07-18 | Coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2530625Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299384A (en) * | 2001-04-04 | 2002-10-11 | Toray Eng Co Ltd | Method and apparatus for bonding chip |
| JP2012028655A (en) * | 2010-07-26 | 2012-02-09 | Hitachi High-Tech Instruments Co Ltd | Management method for electronic component mounting line and management system therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6212200A (en) * | 1985-07-10 | 1987-01-21 | 株式会社日立製作所 | Bad mark detector for chip part carrier |
| JPS649700A (en) * | 1987-07-01 | 1989-01-12 | Hitachi Ltd | Assembly line of multi-item and multi-shape printed board |
-
1990
- 1990-07-18 JP JP1990076980U patent/JP2530625Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6212200A (en) * | 1985-07-10 | 1987-01-21 | 株式会社日立製作所 | Bad mark detector for chip part carrier |
| JPS649700A (en) * | 1987-07-01 | 1989-01-12 | Hitachi Ltd | Assembly line of multi-item and multi-shape printed board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299384A (en) * | 2001-04-04 | 2002-10-11 | Toray Eng Co Ltd | Method and apparatus for bonding chip |
| JP4523732B2 (en) * | 2001-04-04 | 2010-08-11 | 東レエンジニアリング株式会社 | Chip bonding equipment |
| JP2012028655A (en) * | 2010-07-26 | 2012-02-09 | Hitachi High-Tech Instruments Co Ltd | Management method for electronic component mounting line and management system therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2530625Y2 (en) | 1997-03-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |