JPH04340746A - Adhesive tape sticking device - Google Patents

Abstract

PURPOSE:To obtain an inexpensive adhesive tape sticking device which has such a simple constitution that a semiconductor wafer can be manually set to a ring frame and no special apparatus is required for giving tension to an adhesive tape. CONSTITUTION:A peel plate 7 which peels an adhesive tape from a release frame 5 and a press roller 43 which is provided near the plate 7 and makes free rotation when the roller 43 is moved at its upper position and driven rotation when the roller 43 is moved at its lower position are provided and a table 56 mounted with a semiconductor wafer and ring frame is provided in such a state that the table 56 can freely make reciprocating motions between a position below the roller 43 and another position separated from the position and the table 56 can be brought into contact and separated from the roller 43. The release film 5 is driven by means of a torque motor and a tension roller 6 which works in conjunction with a pinch roller and a drive roller 8 give tension to the film.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for attaching a tension adhesive tape to a semiconductor wafer.

0002

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, for example, a dicing process in which a semiconductor wafer is divided into chips, an adhesive tape is attached to the back surface of the semiconductor wafer in order to prevent the divided chips from scattering. is being carried out. Several devices are known for use in this purpose, and the operation of one example is shown in FIG. To explain the adhesion operation based on the same figure, the approximately circular adhesive tape a having the necessary area is
A large number of release films B, which are layered with adhesive layer i, are circulated and moved to peel plate c, and a piece of adhesive tape a is peeled off in front of it with adhesive layer i still attached. The surface on which the agent is not applied is adsorbed to a tape expansion ring d that can be expanded in the outer circumferential direction, and tension is applied to the adhesive tape a by expanding the tape expansion ring d in the outer circumferential direction, and then the adhesive tape is bonded. Glue the ring frame e to the surface (state A). Next, a semiconductor wafer f is attached to the adhesive surface of the adhesive tape a attached to the ring frame e, and the attachment is completed by pressing with a roll g so that no air layer is present on the attachment surface. As a release film b used for this purpose, there is a known release film b, as shown in FIG. Due to the presence of , it can be easily peeled off from the peel plate c.

0003

[Problems to be Solved by the Invention] The above-mentioned conventional bonding device uses a tape expansion ring d equipped with a vacuum hole j in order to bond the wafer f to the adhesive tape a without any gaps. Since the tape a is attached to the ring frame e and then the wafer f is attached, it is difficult to attach it manually, and the device requires a complicated configuration to move the workpiece, making it difficult to attach a large number of wafers. Although it is suitable as an automatic machine installed in the middle of a semiconductor production line that requires mounting work, it is too expensive and inappropriate as a device for dicing a small number of wafers.

SUMMARY OF THE INVENTION An object of the present invention is to provide a simple and inexpensive device that allows the setting of a semiconductor wafer and a ring frame manually and does not require any special equipment for applying tension to the adhesive tape. That is.

[0005]

[Means for Solving the Problems] The present invention includes a peel plate that peels off an adhesive tape having an adhesive layer on the lower surface from a release film that moves intermittently in one direction, and a peel plate that is close to and away from the peel plate. A press roller is provided above the peeled adhesive tape and is movable up and down, and a semiconductor wafer is placed on the table. The above object is achieved by providing a device that can freely reciprocate between a position below the press roller and a position away from the press roller, and can be press-contacted and separated from the press roller via an adhesive tape, a semiconductor wafer, and a ring. did.

[0006]

[Operation] The ring frame and the semiconductor wafer are manually set on the table, and the table is moved laterally to be positioned below the press roller. After the table is raised to a position where the upper press roller is pushed up a little, the table is moved laterally, that is, in the direction in which the adhesive tape is peeled off from the peel plate. Above the table, the adhesive tape that has been peeled off slightly below the press roller by the peel plate is waiting.
When the table rises to the position where it pushes up the press roller, the press roller becomes free-rotating, and the adhesive-applied side of the peeled-off adhesive tape is pressed by the press roller to the ring frame on the table and pasted. It will be worn. At the same time as the table moves in the horizontal direction, the release film moves while maintaining an appropriate tension, but since the tip of the adhesive tape is attached to the ring frame, the adhesive tape that peels off from the release film will not touch the table. is moved and tension is applied by a tension roller, and the adhesive tape is adhered to the ring frame and semiconductor wafer by a press roller while maintaining the tension. When the table moves completely away from the position below the press roller, the adhesion of the adhesive tape is completed, and the table lowers to release the pressure contact with the press roller, and the ring attached to the adhesive tape is removed from the table. The frame and semiconductor wafer are removed manually.

[0007]

[Example] An example of the present invention will be explained based on the drawings.
3 and 4, reference numeral 1 indicates a frame of the pasting device, and the frame 1 is provided with an unwinder shaft 2 and a winder shaft 3. A coil 4 of a long release film to which a large number of circular adhesive tapes as shown are attached via an adhesive layer is attached. The release film 5 pulled out from the coil 4 is sequentially circulated through a rubber-covered tension roller 6, a plate-shaped peel plate 7 having an edge, and a rubber-covered drive roller 8, and then passed through a winder shaft 3.
The tape detection device 9 provided between the tension roller 6 and the peel plate 7 detects the position of the adhesive tape affixed to the release film 5 . Reference numeral 10 indicates an arrow 1 at a position below the peel plate 7.
This table shows a table that is movable in the horizontal direction indicated by 1 and in the vertical direction indicated by arrow 12, and a circular SUS ring frame 13 and a semiconductor wafer 14 as shown in FIG. 11 are installed on the table 10. .

As shown in FIGS. 5 and 6, the unwinder shaft 2 is rotatably held by an extension 15 at one end passing through a bearing 16 provided on the frame 1.
A friction plate 20 is mounted which is urged toward the plate 17 fixed to the bearing 16 by a spring 19. An air circulation hole 21 is formed from the end of the extension part 15 to the inside of the unwinder shaft 2, and the deep part of the air circulation hole 21 extends into the inside of a lock cylinder 22 provided at the middle part of the unwinder shaft 2. When the air is communicated and air pressure is applied to the air circulation hole 21, the piston 23 of the lock cylinder 22 projects outward and fixes the coil 4 inserted into the unwinder shaft 2. Further, as shown in FIGS. 7 and 8, like the unwinder shaft 2, the winder shaft 3 is rotatably held by an extension part 24 that passes through a bearing 18 provided on the frame 1. A pulley 26 is attached to 24 via a bearing 25, and a friction plate 28 is provided which is urged toward the pulley 26 by a spring 27. A groove 29 extending in the axial direction is formed on the circumferential surface of the winder shaft 3, and a J-shaped presser 31 whose end is inserted into a hole 30 in the end surface of the winder shaft 3 is installed therein. . The presser 31 fixes the end of the release film 5 wound around the winder shaft 3 so that it does not come off during winding. The belt 26a circulating around the pulley 26 of the winder shaft 3 is also wound around the rotating shaft of the drive roller 8, and as the diameter of the release film 5 wound around the winder shaft 3 increases,
The friction plate 28 and the pulley 26 slip, and the release film 5 is wound up at a predetermined speed.

The tension roller 6 and drive roller 8 are rotated by belts 34 and 35 driven by separate torque motors 32 and 33, respectively, as shown in FIG. Pinch rollers 38 and 39 attached to the clamp arm 37 that is being pulled are brought into pressure contact with the tension roller 6 and drive roller 8 via the release film 5, so that the release film 5 can be moved while maintaining a predetermined tension. .

[0010] The release film 5 is attached to the peel plate 7.
When circulating the adhesive tape 41 attached to the release film 5 via the adhesive layer 40, as shown in FIG.
is peeled off, and the peeled off portion 42 is fed out below the press roller 43 in front of it. The press roller 4
3 is covered with rubber, and its both ends are supported by arms 46 that are movable up and down along guide shafts 44 and 45 fixed to the frame 1. The arm 46 is urged downward by the spring 47 on the guide shafts 44 and 45, and when located at its lower end, the circumferential surface of the press roller 43 slightly touches the peel plate 7.
, the lower end surface of the press roller 43 is positioned so as to protrude downward by a distance D from the cutting edge of the peel plate 7,
When the table 10 rises, the press roller 43 is pushed by the table 10 and the spring 4 is pressed together with the arm 46.
It rises against 7. A gear 48 is attached to one end of the press roller 43, as shown in FIG. 4, and the gear 48 is attached to the table 10, as shown in FIG.
When the table 10 is in the lowered position, it engages with a drive gear 51 connected to a motor 50 via a belt 49 and is rotationally driven by the motor 50, but as shown in FIG. 14, the table 10 is raised. When the press roller 43 is pushed up, the gear 48 and the drive gear 51 are disengaged, and the press roller 43 can rotate freely. The peel plate 7 is heated by a heater 7a, and an air blowing pipe 52 extending in the width direction of the release film 5 is provided below the peel plate 7. The tape 41 can be positioned below the press roller 43 without hanging down.

Details of the table 10 are shown in FIGS. 11 and 12.
1, there is an annular ring table 54 on the outer periphery on which the annular SUS ring frame 13 as shown in FIG. have On the upper surface of the ring table 54 on which the ring frame 13 is placed, pins 59 for positioning the ring frame 13 are provided at three locations.
Magnets 57 and vacuum holes 58 for fixing the ring frame 13 are provided at four locations, respectively, and the vacuum holes 58 are connected to a suction pump via piping (not shown). Further, the circular wafer table 56 inside the ring table 54 is provided with a raised edge 60 made of urethane rubber and has an annular narrow width approximately the diameter of the semiconductor wafer 14 around it, and is surrounded by the raised edge 60. An air supply port 62 for supplying pressurized air is provided in the recessed circular portion 61 on the inner side, and a vacuum hole 63 is provided in the upper surface of the raised edge 60 for sucking the semiconductor wafer 14 placed thereon. provided. The ring table 54 and the wafer table 5
The connecting members 64,
65 and 66, of which the connecting member 6
4 is provided with a protrusion that engages with a vertical groove 70 of a guide member 69 attached to a column 68 extending upward from the movable base 67, and a rod 72 of an air cylinder 71 fixed to the movable base 67. was attached to the connecting member 65. With this configuration, when the rod 72 moves up and down, the ring table 54 and wafer table 56 also move up and down. The movable base 67 is connected to an electric motor 73 as shown in FIGS. 3 and 4.
Two protruding members 7 are attached to a reciprocating belt 74 and move while being guided by a groove member 75 fixed to the frame 1.
6, and when the electric motor 73 rotates, the movable base 67 moves as shown in FIG.
It was designed to move back and forth between the position shown in and the movement position shown by the dashed line to the left. The movement position of the movable base 67 is controlled by a plate 77 attached to a belt 74 and a sensor 78 fixed to the frame 1.

The tape detection device 9 detects the release film 5.
It consists of a limit switch 9a that is activated when the adhesive tape 41 affixed to it is located at a predetermined position.A square wheel 9b as shown in FIG. 15 is attached to the limit switch 9a, When the wheel 9b rotates against the end surface of the thin adhesive tape 41, the lever 9c of the limit switch 9a moves greatly from the release film 5, and an electric signal is generated to stop the motor 50.

To explain the operation of the illustrated embodiment, first,
The table 10 is positioned at a position where it is pulled out from the frame 1 shown by the chain line in FIG. 3, and the prepared ring frame 13 and semiconductor wafer 14 are placed on the ring table 54 and the wafer table 56, respectively. At this time, vacuum operation is automatically performed from the vacuum holes 58 and 63, and the ring frame 13 and semiconductor wafer 14 are moved to the table 10.
fixed on top. Subsequently, the table 10 is moved to the movable base 67.
, it moves below the press roller 43. At this time, as shown in FIG. 13, the tip of the adhesive tape 41, which has been peeled off to some extent from the release film 5, is located below the press roller 43, and the air cylinder 71 of the movable base 67 When the table 10 rises and a part of the ring frame 13 pushes up the press roller 43 via the adhesive tape 41 as shown in FIG. The press roller 43 becomes free to rotate. The movable base 67 is connected to the belt 7.
4 moves in the feeding direction of the adhesive tape 41, as shown in FIG. While doing so, the release film 5 is circulated through the peel plate 7 so as to peel off the adhesive tape 41. By synchronizing the moving speed of the release film 5 and the moving speed of the table 10, the adhesive tape 41 peeled off from the peel plate 7 is sequentially maintained at a predetermined tension and transferred to the press roller 43.
The ring frame 13 and the semiconductor wafer 14 are affixed to the ring frame 13 and the semiconductor wafer 14. If the center of the semiconductor wafer 14 is dented due to the force applied from the press roller 43, the wafer 14 may be damaged or air bubbles may be mixed into the surface of the adhesive tape 41. 4
At the same time that the adhesion of the semiconductor wafer 14 was started, pressurized air was supplied from the air supply port 62 to the recessed circular portion 61 of the wafer table 56 to prevent the semiconductor wafer 14 from being dented. table 1
0 moves the ring frame 13 and the semiconductor wafer 1 after moving a length corresponding to approximately the diameter of the ring frame 13.
At the same time, the air cylinder 71 of the movable base 67 is lowered to its original position, and then manually removed from the table 10 as shown in FIG. 17.
A product with an adhesive tape 41 attached to the back surface of the ring frame 13 and the semiconductor wafer 14 as shown in FIG. 1 is taken out.

The apparatus of the present invention can be used not only for dicing semiconductor wafers, but also for attaching adhesive tapes to protect semiconductor wafers. Also,
Any adhesive tape that can be peeled off from the release film by the peel plate can be used in the apparatus of the present invention, and adhesive tapes other than those shown in FIG. 2 can also be used.

[0015]

As described above, according to the present invention, a press roller is provided which is close to the peel plate for peeling the adhesive tape from the release film and which rotates freely when moving upward and rotates drivenly when moving downward, and the press roller is attached to the peel plate for peeling the adhesive tape from the release film. A table on which the ring frame was placed on approximately the same plane was provided so that it could reciprocate between a position below the press roller and a position away from it, and was also able to press against and release from the press roller, so that the adhesive tape could be applied manually. It can be attached to a prepared ring frame and a semiconductor wafer, and is convenient for attaching adhesive tape to a small number of semiconductor wafers.By providing a tension roller and a drive roller that cooperate with a pinch roller, tension can be easily applied. Since the adhesive tape can be attached, there are advantages such as the ability to manufacture the attaching device at low cost.

[Brief explanation of the drawing]

[Figure 1] Explanatory diagram of a device that applies adhesive tape for conventional dicing

[Figure 2] Perspective view of release film with adhesive tape attached

[Figure 3] Overall front view of the embodiment of the present invention

[Figure 4]
Side view of Figure 3

[Figure 5] Partially cut-out enlarged view of the unwinder shaft

[Figure 6
] Plan view of the main part of Figure 5

[Figure 7] Partially cut-out enlarged view of the winder shaft

[Figure 8]
Plan view of main parts in Figure 7

[Figure 9] Enlarged view of the tension roller and drive roller

[Figure 10] Enlarged view of peel plate part

[Figure 11] Enlarged plan view of the table

[Figure 12] Cutaway view of Figure 11

[Figure 13] Explanatory diagram of the operation of the press roller

[Fig. 14] Explanatory diagram of the operation of the press roller

[Figure 15] Enlarged view of tape detection device

[Fig. 16] Explanatory diagram of the operating state of the table

[Figure 17] Perspective view of the state in which adhesive tape has been attached

[Explanation of symbols]

5 Release film
6 Tension roller 7 Peel plate
8 Drive roller 9 Tape detection device 1
0 table 13 ring frame
14 semiconductor wafer 32, 33 torque motor 38,
39 Pinch roller 40 Adhesive layer
41 Adhesive tape 43 Press roller
47 Spring 48 Gear
51
Drive gear 54 Ring table
56 Wafer table 57 Magnet
58 Vacuum hole 60 Raised edge
61 Concave circular part 62 Air supply port
63 Vacuum hole 67 Moving base
71 Air cylinder

Claims (8)

[Claims] Claim 1: A peel plate for peeling off an adhesive tape having an adhesive layer on the lower surface from a release film that moves intermittently in one direction; A press roller is provided, which is positioned so that it can move up and down, rotates freely when moving upward, and rotates drivenly when moving downward. The table on which the frame is mounted is provided so as to be able to reciprocate between a position below the press roller and a position away from the press roller, and to be able to press the press roller, the adhesive tape, the semiconductor wafer, and the ring frame to separate from each other. Features of adhesive tape application device. 2. A circular adhesive tape having a diameter approximately equal to the outer diameter of the ring frame is layered on the release film with an adhesive layer interposed therebetween. 2. The adhesive tape application device according to claim 1, wherein an adhesive tape application device having an exposed portion is used. 3. The release film in which the adhesive tape is layered is wound into a coil and set, and the release film pulled out from this is driven by a torque motor to apply tension to the release film in cooperation with a pinch roller. A tension roller that moves the release film, a peel plate, and a drive roller that is driven by a torque motor and moves the release film in cooperation with a pinch roller are sequentially circulated, and the winder shaft whose winding speed is synchronized with the drive roller is rotated. The adhesive tape application device according to claim 1, wherein the adhesive tape application device is wound up. 4. The adhesive tape adhesion device according to claim 3, wherein the tension of the adhesive tape applied to the semiconductor wafer is adjusted by controlling the torque of a torque motor that drives the tension roller. . 5. The vertically movable press roller is pressed downward by a spring, and when in the downward position, a part of the circumferential surface of the press roller protrudes below the peel plate. is rotated by a motor while being pressed against the press roller of the table through the release film, and the press roller is moved to an upper position against the spring by being pressed against the press roller of the table, and its rotation is caused by the drive rotation. Claim 1 characterized by switching to free rotation.
The adhesive tape application device described in . 6. The pinch rollers that cooperate with the tension roller and the drive roller are synchronously pressed against or separated from the tension roller and the drive roller via a release film. Adhesive tape pasting device. 7. The table according to claim 1, wherein the table is placed on a movable base attached to a belt that is reciprocated by an electric motor, and is raised and lowered by an air cylinder attached to the movable base. The adhesive tape application device described above. 8. The table is composed of an outer ring table on which the ring frame is placed, and a circular wafer table inside the ring table, and the ring table has a magnet for fixing the ring frame and a vacuum hole. The circular wafer table includes an annular raised edge having vacuum holes around the periphery for supporting and fixing the wafer, and an inner recess surrounded by the annular raised edge for supplying pressurized air. 2. The adhesive tape application device according to claim 1, further comprising an air supply port.