JPH04340727A - Conveying equipment of semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a conveying equipment which is used for an automatic assembling equipment or the like of a semiconductor element. CONSTITUTION:The following are provided; a conveying rail 4 wherein recessed parts or nicked parts 7 accommodating a semiconductor device 1 mounting semiconductor element 1a are arranged at constant intervals, outer terminals 1b composed of ferromagnetic material protrude on both sides, and the semicondutor device 1 is mounted in the above state, and a conveying mechanism 8 installed under the conveying rail 4 in which mechanism magnets 6 are buried at constant intervals and which mechanism moves up and down and transfers parallel to the conveying rail 4. The conveying mechanism 8 ascends, retains the outer terminals 1b with a magnet 6, levitates the semiconductor device 1 from the conveying rail 4, and carries the semiconductor device to the next recessed part or nicked part 7. By using the above conveying equipment, the generation of dust is restrained and the precise positioning of a semiconductor device is enabled.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device transport device used in automatic assembly equipment and the like in semiconductor device assembly processes where dust is a problem.

0002

2. Description of the Related Art A conventional semiconductor device transport device will be described below. FIG. 2 is a perspective view of a main part of a conventional semiconductor device transport device, and shows an example in which the device is used in an assembly process of a solid-state imaging device. As shown in the figure, the solid-state imaging device 1 is equipped with a solid-state imaging element 1a, and from the side it can be seen that
An external terminal 1b made of a ferromagnetic metal material such as a nickel alloy is led out. This conventional example is a dual in-line package (hereinafter referred to as DIP), in which a solid-state imaging device 1 straddles a transport rail 2. In such a conventional semiconductor device transport device, the solid-state imaging device 1 on the transport rail 2 is held by a feed pawl 3 installed on the side of the transport device so as to be movable back and forth and left and right, while the top surface of the transport rail 2 is slid. and was being transported to the next location.

0003

[Problems to be Solved by the Invention] However, with the above conventional configuration, the positioning accuracy after the semiconductor device is transported to the next position is poor, and dust is generated due to friction between the back surface of the semiconductor device and the top surface of the transport rail. However, this dust has the problem of deteriorating the quality and performance of semiconductor devices. Particularly in solid-state imaging devices, if this dust lands on the pixel surface, it causes point defects on the image, which is a big problem.

[0004] The present invention solves the above-mentioned conventional problems, and provides a method to ensure highly accurate positioning after transporting a semiconductor device to the next position in the semiconductor device assembly process, and to suppress the generation of dust. The purpose of the present invention is to provide a transport device for semiconductor devices that is capable of transporting semiconductor devices.

[0005]

[Means for Solving the Problem] In order to achieve this object, the semiconductor device transport device of the present invention is provided with recesses or cutouts for accommodating the semiconductor devices, and in which recesses or cutouts for accommodating the semiconductor devices are provided at regular intervals, and the semiconductor devices are guided out from the semiconductor devices. A transport rail on which a semiconductor device is placed with external terminals protruding from both sides, and a transport mechanism in which magnets are embedded at regular intervals at the bottom of the transport rail and move vertically and parallel to the transport rail. The semiconductor device has a structure in which the transport mechanism moves up, holds the external terminal with a magnet, lifts the semiconductor device from the transport rail, and transports it to the next recess or cutout.

[0006]

[Operation] With this configuration, the external terminals protruding from both sides of the semiconductor device are held by the magnetic force of the magnet while being lifted up and transported from the transport rail, so the semiconductor device does not rub against the transport rail and the generation of dust is prevented. In addition to being able to hold down the position, highly accurate positioning is also possible.

[0007]

Embodiment An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a perspective view of a main part of a semiconductor device transport device according to an embodiment of the present invention, and shows an example in which the device is used in an assembly process of a solid-state imaging device. In Figure 1,
1 is a solid-state imaging device, 1a is a solid-state imaging device, 1b is an external terminal made of a ferromagnetic metal material, 4 is a transport rail, 5 is a feed claw, 6 is a magnet, and 7 is a notch provided in the transport rail 4. 8 is a transport mechanism.

[0008] Regarding the semiconductor device transporting device made up of the above-mentioned components, the relationship and operation of each component will be explained below. The solid-state image sensor 1a is mounted on the DIP, and the solid-state image sensor 1 with the external terminal 1b led out from the side thereof is placed in a cutout 7 slightly wider than the solid-state image sensor 1 provided at a predetermined position on the transport rail 4. It is placed in place. Note that the upper part of the notch 7 is chamfered so that the solid-state imaging device 1 can slide into it.

On the other hand, the conveyance mechanism 8 is installed at the lower part of the conveyance rail 4, and has on its upper surface a feed claw 5 made of a resin material and in which a plurality of magnets 6 are embedded. The magnets 6 are embedded in two rows, and the spacing between the rows is equal to the spacing between the rows of external terminals 1b led out from both sides of the solid-state imaging device 1. The transport mechanism 8 is a mechanism that lifts the solid-state imaging device 1 from the transport rail 4 and transports it to the next notch 7 while holding the external terminal 1b using the magnetic force of the magnet 6. The solid-state imaging device 1 transported in this manner is dropped into the notch 7 provided in the transport rail 4, so that it is reliably positioned. Note that in this embodiment, the semiconductor device 1 is D.
Although IP has been described as an example, if the external terminals 1b protrude from both sides or one side of the transport rail 4, flat packages, chip carriers, etc. can also be transported in the same way. Furthermore, although the assembly process of a solid-state imaging device has been described in this embodiment, dust is a problem in all semiconductor device assembly processes, and this problem can be solved by using the semiconductor device transport device according to the present invention. be able to.

0010

As described above, the present invention utilizes the magnetic force of a magnet to hold the external terminals led out from both sides of a semiconductor device, and transports the semiconductor device floating on a transport rail, thereby reducing the generation of dust. Accordingly, it is possible to realize an excellent semiconductor device transport device that can suppress the noise and perform highly accurate positioning.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a main part of a semiconductor device transport device according to an embodiment of the present invention.

[Fig. 2] A perspective view of the main parts of a conventional semiconductor device transport device.

[Explanation of symbols]

1 Solid-state imaging device (semiconductor device) 1a Solid-state imaging device (semiconductor element) 1b External terminal 4 Transport rail 6 Magnet 7 Notch (recess or notch) 8 Transport mechanism

Claims (1)

[Claims] 1. Recesses or cutouts for accommodating semiconductor devices mounted with semiconductor elements are provided at regular intervals, and external terminals made of a ferromagnetic material derived from the semiconductor devices protrude from both sides. a transport rail on which the semiconductor device is placed; and a lower part of the transport rail,
It has a transport mechanism in which magnets are embedded at regular intervals and moves vertically and parallel to the transport rail, and the transport mechanism rises and holds the external terminals with the magnets to lift the semiconductor device off the transport rail, and then A semiconductor device transport device configured to transport a semiconductor device to a recess or notch.