JPH0434017U - - Google Patents
Info
- Publication number
- JPH0434017U JPH0434017U JP7586590U JP7586590U JPH0434017U JP H0434017 U JPH0434017 U JP H0434017U JP 7586590 U JP7586590 U JP 7586590U JP 7586590 U JP7586590 U JP 7586590U JP H0434017 U JPH0434017 U JP H0434017U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- vibrating
- lead
- chip
- type piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第1図は本願考案の一実施例にかかるチツプ型
圧電部品の封止基板を示す斜視図、第2図はその
振動素子を示す図、第3図は本願考案の実施例に
かかるチツプ型圧電部品を示す断面図、第4図は
封止基板用マザーボードを示す平面図、第5図は
本願考案の他の実施例にかかる封止基板を示す図
、第6図は従来のチツプ型圧電部品を示す斜視図
、第7図はその要部を示す断面図、第8図は前記
従来例の封止基板を示す図、第9図はその製造工
程を説明するための封止基板用マザーボードを示
す図である。
6……凹部、7a……上部封止基板、7b……
下部封止基板、9……外部電極、21……圧電基
板、22……振動電極、23……引出し電極、2
4……振動素子。
FIG. 1 is a perspective view showing a sealing substrate of a chip-type piezoelectric component according to an embodiment of the invention, FIG. 2 is a diagram showing a vibrating element thereof, and FIG. 4 is a plan view showing a motherboard for a sealing substrate, FIG. 5 is a view showing a sealing substrate according to another embodiment of the present invention, and FIG. 6 is a conventional chip-type piezoelectric component. 7 is a sectional view showing the main parts thereof, FIG. 8 is a view showing the conventional sealing board, and FIG. 9 is a motherboard for the sealing board for explaining the manufacturing process. FIG. 6... Concavity, 7a... Upper sealing substrate, 7b...
Lower sealing substrate, 9... External electrode, 21... Piezoelectric substrate, 22... Vibration electrode, 23... Extraction electrode, 2
4... Vibration element.
Claims (1)
た引出し電極とを備えてなる振動素子と、 前記振動素子を挾持して保護する上部及び下部
封止基板と、 前記振動素子の、前記引出し電極を設けた方の
端面側に形成された、前記振動素子の引出し電極
と接続する外部電極と、 を備えてなるチツプ型圧電部品であつて、 前記上部及び下部封止基板の、前記引出し電極
と対向する部分に、前記外部電極が形成される側
の端面から所定の距離だけ平行部分を有する形状
の凹部または切り欠き部を形成して、該凹部また
は切り欠き部と前記引出し電極との間に所定の間
隙を形成したこと を特徴とするチツプ型圧電部品。[Claims for Utility Model Registration] A vibrating element including a vibrating electrode on a piezoelectric substrate and a lead-out electrode extending from the vibrating electrode; upper and lower sealing substrates that sandwich and protect the vibrating element; a chip-type piezoelectric component comprising: an external electrode formed on the end surface side of the vibration element on which the extraction electrode is provided and connected to the extraction electrode of the vibration element; forming a recess or notch having a parallel portion a predetermined distance from the end face on the side where the external electrode is formed in a portion of the stop substrate facing the extraction electrode; A chip-type piezoelectric component, characterized in that a predetermined gap is formed between the lead electrode and the lead electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7586590U JPH0434017U (en) | 1990-07-16 | 1990-07-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7586590U JPH0434017U (en) | 1990-07-16 | 1990-07-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0434017U true JPH0434017U (en) | 1992-03-19 |
Family
ID=31616824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7586590U Pending JPH0434017U (en) | 1990-07-16 | 1990-07-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0434017U (en) |
-
1990
- 1990-07-16 JP JP7586590U patent/JPH0434017U/ja active Pending
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