JPH04329155A - Method for forming control grid - Google Patents

Abstract

PURPOSE:To substantially make gathering and bonding processing possible using a row or line direction as one unit by providing connection pin groups erected at a pitch interval of an integral multiple of loop electrodes in one row or a plurality of rows along the direction crossing an axial wire group extending direction at an almost right angle. CONSTITUTION:In a connection pin stand 20, pins 22 are vertically implanted in an insulating connector resin plate 21 in the number corresponding to the number of loop electrodes to be formed in two rows so as to be positionally shifted before and behind each other and the implanting interval of the pins 22 is set twice that of the loop electrodes at every row. The connection pin stand 20 is inserted from below in such a state that a flat cable 10 is provided under tension to be brought into contact with the loop surfaces of the pins 22 corresponding to axial wires 10a from which insulating coatings 10b are removed and heat is applied to the pins 22 in a degree melting solder and the solder only of the regions being in contact with the pins 22 is melted through the pins 22 to electrically connect the axial wires 10a and the pins 22.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to a method of forming a control grid consisting of a large number of loop electrodes by electrically connecting adjacent axes of a group of insulating coating axes extending parallel to a predetermined direction. In particular, the present invention relates to a method of forming a control grid used in an image forming apparatus in which a toner carrier and a back electrode are disposed facing each other with a control grid in which a group of electromagnetically openable and closable toner passage holes are arranged in a predetermined direction.

0002

[Prior Art] Conventionally, images are created in which toner carried on a toner carrier is directly transferred onto a recording material in a dot pattern corresponding to image information without using a photosensitive drum that functions as a latent image carrier. Forming devices are known. (Swedish Patent Application No. 8704883, etc.)

The configuration of such an apparatus will be briefly explained based on the basic configuration diagram shown in FIG. 5. The toner carrier 1 includes a sleeve-shaped developing roller that electromagnetically holds toner in a thin film, and the toner carrier 1. A matrix-like control grid 3 is disposed between the back electrode 2 and the back electrode 2 disposed opposite to the control grid 1, and the control grid 3 is energized in the X-Y axis direction.
The developing electric field acting on the toner passage hole 3a between the matrices is configured to be selectively cut off or conductive in accordance with image information, thereby causing the control grid 3 to appear on the recording paper 4 disposed on the surface of the back electrode 2. As shown in FIG. 6, each pair of control grids is arranged in a loop shape extending in the main scanning direction (X). A plurality of X-axis lines X1-X2... formed in
It is formed by a matrix-like conductor group consisting of axes Ya1-Ya2..., and the Y-axes Ya1-Ya2 and X of each pair are
A portion sandwiched between the axes X1 and X2 is formed to form a toner passage hole 3a.

[0004]The control grid 3 sequentially energizes the X1 to X2 lines with a time difference in accordance with the insertion speed of the recording paper 4, so that the dot-shaped printing pattern 30 passing through the passage hole 3a is made into one pattern as a result. form a row,
As a result, it is possible to form a dense dot pattern without making the width of the Y-axis loop line Ya1-Ya2, or in other words, the interval between the toner passage holes in the main scanning direction particularly dense.

[0005]

[Problems to be Solved by the Invention] In the above-mentioned device, the present applicant has investigated a method of manufacturing a control grid by arranging and fixing wire electrodes in a matrix, in which conductive wires are covered with an insulating layer. If a large number of wire electrodes are used, after extending them parallel to each other in the X-axis direction and the Y-axis direction and arranging them in a matrix, or before arranging and joining them, connect the ends of each adjacent pair of wire electrodes. They are electrically connected to each other to form a closed loop, and each connected portion is connected to a lead wire to form a control grid. In other words, the ends of the wire electrode pair are connected to each other and the lead wires. The processing must be performed twice the number of rows and columns of toner holes (on both ends). For example, to make a grid of 300 dots, the processing must be performed 300 x 2 times (row direction) + 8 x 2 times (column direction). Therefore, it is necessary to perform bonding processing with the lead wire, which makes the manufacturing process extremely complicated.

In order to eliminate such drawbacks, the present inventor first proposed a dummy wire 1 for maintaining a distance between a pair of wire electrodes 101 and 102 that are integrally extended in parallel, as shown in FIG.
After temporarily fixing the end sides of the group of cables 10 and the ends of the group of lead-out wires using a tape-like film 110 using the flat cables 10 formed with 00 interposed therebetween, the adjacent flat cables 10 are Opposing wire electrode 1
Electrical connection is made between the end sides of 01A and 101B and the end of the lead wire 111, and finally the dummy wire 100
A technique is proposed in which the electrical connection between the adjacent ends of the electrodes 101 and 102 in a closed loop is broken by tearing and removing the electrodes. (Patent Application No. 2-218155)

00
[07] However, even with the above configuration, the dummy wire 1
When tearing 00, it may not be possible to tear the tape-like film smoothly, and even if it is possible to tear it, the cut surface will not be clean after tearing, and the torn edges may not be close to each other. There is a risk of leakage due to re-bonding.

In view of the drawbacks of the prior art, the present invention makes it possible to substantially perform collective bonding processing in the column direction or row direction as one unit, without performing the bonding processing for each individual electrode pair. It is an object of the present invention to provide a method for forming a control grid that enables the above-mentioned processing simply and reliably without causing any problems.

[0009]

[Means for Solving the Problems] The present invention electrically connects the ends of the wire electrodes described above, but in this case, the above object cannot be achieved unless the following problems are solved.

The first is interval setting. That is, in order to realize a high-resolution and high-quality dot image in the image forming apparatus, it is necessary to accurately set the positional accuracy of the toner passage holes and the distance between the wire pairs forming the loop electrodes. For this reason, in the prior art, the ends of the wire electrodes 101A and 101B are temporarily fixed using a tape-like film, but it is difficult to accurately set the spacing using only this.

The second problem is the problem of integral electrical connection. That is, in the control grid, since the adjacent wire electrodes 101 and 102 forming the other side loop electrode are located extremely close to each other, the ends of the wire electrodes on the opposite side are connected to each other while ensuring insulation between the electrodes. Therefore, in the prior art, the problem was solved by a combination of a dummy electrode and a tape film, but even this alone causes the above-mentioned problems.

In order to solve the above problems, the present invention proposes a terminal processing method having the following features. That is, the first feature of the present invention is that a group of connection pins are provided in a row or in a plurality of rows along a direction substantially perpendicular to the direction in which the group of axes extends at intervals of an integer multiple of the pitch of the loop electrodes. . In this case, the pin width at the portion where the axes come into contact is preferably set to be approximately equal to the spacing between the axes constituting each loop electrode.

In this case, the number of pins corresponding to the number of loop electrodes is required on each end side, but since the pitch of the loop electrodes is extremely narrow, the pins are implanted in accordance with the narrow pitch interval. It can be difficult to do so. In such a case, the pins may be alternately shifted back and forth and arranged in two or three rows, and the pin pitch may be set to be twice or three times as large as the loop electrode. .

A second feature of the present invention is that the adjacent wire electrodes 101, 102 (hereinafter referred to as axis lines)
The purpose is to apply heat, high frequency, or laser energy to the contact portions of the pins while the two are in contact with their corresponding pins. This also makes it possible to perform electrical bonding while removing the insulating film on the surface of the axis, if necessary. Note that the energy may be applied from outside or may be applied via a pin.

[0015]

[Operation] According to this technical means, it is possible to accurately set the spacing between the axes using pins that are set up at pitches that are integral multiples of the loop electrodes. In this case, there is no provision for setting the distance between the axis of the other side loop, but as described in the prior art, it is necessary to maintain the distance between the adjacent axes forming the other side loop electrode. This can be easily solved by using a flat cable 10 that is integrally connected via one or more dummy wires 100.

[0016] Also, the present invention adopts a configuration in which energy that is converted into heat as a result, such as a laser or high frequency, or thermal energy is applied directly to the contact portion with the pin,
Even if the axes of the other side loops are close to each other, it is possible to electrically bond only the part that contacts the connecting pin, and especially when thermal energy is used, it is possible to electrically bond only the contact area as necessary. Insulating film removal can be performed at the same time. In this case, it is not necessary to perform the insulating film removal and electrical bonding at the same time, and the electrical bonding may be performed after removing the insulating film by some means.Also, the electrical bonding is generally performed by soldering, but this is not necessary. Not limited to only.

Furthermore, in order to ensure positional stability between the pin and the axis, the pin side corresponding to the contact area is recessed in a substantially L-shape so that the axis can be placed in the recess. It is better. This improves positional accuracy, and since there are two joint surfaces, the joint strength becomes stable and strong, and furthermore, L
Since it is a letter-shaped recess, it is also easier to irradiate with directional energy such as a laser.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail by way of example with reference to the drawings. However, unless otherwise specified, the dimensions, materials, shapes, and relative positions of the components described in this example are not intended to limit the scope of this invention, but are merely illustrative examples. Not too much. Figure 4
1 is a flat cable 10 according to an embodiment of the present invention, in which a dummy wire 100 for maintaining a distance is interposed between a pair of axes 101 and 102 extending integrally in parallel. In this case, the axes 101 and 102 have a two-layer structure in which a core wire 10a made of aluminum or copper wire is covered with an insulating coating 10b, while the dummy wire 100
The same material wire as 2 may be used, but preferably the axis 1
It is preferable to use a different type of insulating material that has a higher tensile strength than 01 and 102.

Further, the number of the dummy wires 100 is not limited to one, but a plurality of wires may be formed in parallel.
If the diameter is made larger than the diameter of the axes 101 and 102,
Since the plane joining shown in FIG. 1 becomes difficult, the diameter of the dummy wire 100 is preferably formed to be equal to or smaller than the diameter of the axes 101 and 102. The insulating coating around the axis is preferably made of polyurethane or other heat-sublimable resin or heat-melt resin.

FIG. 3 shows the configuration of a connecting pin stand 20 according to an embodiment of the present invention, in which a number of pins 22 corresponding to the number of loop electrodes to be formed on an insulating connector resin plate 21 are alternately positioned back and forth. The pins 22 are vertically planted in two rows while being shifted from each other, and the pitch between the pins 22 is set to be twice the pitch between the loop electrodes in each row. The resin plate 21 needs to be thick enough to withstand the tension of the loop electrode and have heat resistance to the extent that it will not deteriorate due to heat application during bonding, which will be described later.

Further, the width L of the pin 22 is set to be almost the same as the width between the loop electrodes to be formed, and the spacing M between adjacent pins 22 whose positions are shifted back and forth is the same as that of the flat cable 10. It is set to width.

Next, a joining method in this embodiment will be explained. First, in advance, the flat cable 10
The insulation coating 10b is removed. For example, the removal method is shown in Figure 8.
With the flat cable 10 stretched as shown in FIG.
This can be easily removed by applying heat to the extent that the insulation coating 10b is thermally sublimated. As shown in FIG. 3, with the flat cable 10 maintained in the stretched state,
The connecting pin stand 20 is inserted from below, and the axis 10a from which the insulating coating 10b has been removed is brought into contact with the ventral surface of the corresponding pin 22.

On the other hand, eutectic solder 23 is attached to the bottom surface of the pin 22 in advance, and in this state, heat is applied to the pin 22 to an extent that the solder 23 melts.
Solder 23 only on the part that is in contact with pin 22 via 2
is melted, and an electrical connection is made between the conductive wire 10a and the pin 22. Note that it is not necessary to remove the insulating coating 10b of the pin 22 in advance; for example, by applying heat to the extent that the insulating coating 10b is thermally sublimated together with solder, the insulating coating 10b is removed and the conductor 10a and the pin are removed. 22
The configuration may be such that electrical connection between the two can be made simultaneously.

FIG. 1 shows another embodiment in which both corners of the upper surface of the pin 22 are cut into an L-shape, and the axes 101A and 101B of the flat cable 10 can be placed on the L-shaped cut parts 22a. do. Note that the axes 101A and 10 are attached to the cut portion 22a.
One side is set to be larger than the axis radius and preferably slightly smaller than the diameter so that at least two surfaces of 1B can come into contact with each other. Further, the pin tip width dimension L of the cut portion 22a is set to be approximately the same as the width between the loop electrodes to be formed. In addition, the cut portion 2
The eutectic solder 26 is previously attached to 2a. It is preferable to use phosphor bronze plated with copper for the pins, and to dip the pins so that a large amount of solder adheres to the corner portions.

By irradiating the contact portion between the pin cut portion 22a and the axis 10a with the laser 25 in the direction of the arrow, the solder adhering to the cut portion 22a is melted, and the conductor 1
An electrical connection is made between Oa and pin 22. The laser mentioned above is a YAG laser (1064n) with an output of about 30 to 40W.
m) and if flux is used for the solder 26, there is a risk that the flux will burn due to the heat of the laser, so it is better to use no flux.

FIG. 4 shows a method of joining the control grid 3 shown in FIG. 6 formed by the terminal processing described above to the IC mounting board 30, in which a spring-shaped joining terminal 31 is attached to the IC mounting board 30 side.
are arranged corresponding to the spacing between the pins 22, and the free end side of the connecting terminal 31 is configured to be able to press against the head of the pin 22. At this time, the terminal 31 and the head of the pin 22 may be joined by soldering.

[0027]

As described above, according to the present invention, the axes can be substantially assembled in the column direction or the row direction as one unit without performing the joining process for each pair of axes to form a loop electrode. This makes it possible to perform a bonding process, and since electrical bonding is performed only at the part that contacts the pin, it is possible to easily and reliably process the terminal, and if necessary, the insulation coating 10b can be removed and the electrical bonding can be performed at the same time. The setup process is extremely simplified. It has various effects such as

[Brief explanation of drawings]

FIG. 1 is an operational diagram showing a method for forming a loop electrode according to an embodiment of the present invention.

FIG. 2 is a front view of a main part and a plan view thereof showing a method of forming a loop electrode according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a flat cable used in an embodiment of the present invention.

FIG. 4 shows a bonding diagram of the embodiment and an IC mounting board.

[Fig. 5] Overall configuration diagram showing the basic technology to which the present invention is applied

[Figure 6] Schematic diagram showing the arrangement of the Χ-Y axis loop lines of the control grid

FIG. 7 is an operational diagram showing a method for forming a loop electrode according to the prior art.

FIG. 8 shows a method for removing an insulation coating from a flat cable used in an embodiment of the present invention.

[Explanation of symbols]

101, 102 Axis line 22 pin 3 Control grid 23, 26 Solder

Claims (1)

[Scope of Claims] [Claim 1] A method for forming a control grid consisting of a large number of loop electrodes by electrically connecting adjacent axes of a group of axes having insulating coatings extending parallel to a predetermined direction. In this method, a group of connecting pins are provided in a row or in a plurality of rows along a direction substantially orthogonal to the direction in which the group of axes extends, and are arranged at pitches that are integral multiples of the distance between the loop electrodes, and the adjacent axes are connected to each other. A method for forming a control grid, characterized in that an electric connection is established between a pin and an axis at a contact site by applying heat, high frequency, or laser energy to the contact site while the control grid is in contact with a corresponding pin of the control grid. 2. The control grid according to claim 1, characterized in that a flat cable is used in which adjacent axes forming the other side loop electrode are integrally connected via one or more dummy wires for maintaining the distance. [Claim 3] A method for forming a bond between the pins and the axes while removing an insulating film on the surface of the axes by applying thermal energy while the adjacent axes are in contact with their corresponding pins via a solder film. 4. A method for forming a control grid according to claim 1, characterized in that a contact portion with the axis of the pin is recessed in a substantially L-shape, and the axis line is formed in the recessed portion. A method for forming a control grid according to claim 1, which is configured to be able to be placed on the control grid.