JPH0432563U - - Google Patents
Info
- Publication number
- JPH0432563U JPH0432563U JP7453890U JP7453890U JPH0432563U JP H0432563 U JPH0432563 U JP H0432563U JP 7453890 U JP7453890 U JP 7453890U JP 7453890 U JP7453890 U JP 7453890U JP H0432563 U JPH0432563 U JP H0432563U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- land
- tip
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は従来技術の、第２図は本考案の実施例
の縦断面図である。
１……片面プリント配線板、１ｂ……孔、１ｃ
……裏面、２……絶縁基板、３……導体パターン
、３ａ……ランド、４……リード線、４ａ……端
部、５……ハンダ、６……ピン、６ａ……かさ部
、６ｂ……先端部。
FIG. 1 is a longitudinal sectional view of the prior art, and FIG. 2 is a longitudinal sectional view of an embodiment of the present invention. 1... Single-sided printed wiring board, 1b... Hole, 1c
... Back surface, 2 ... Insulating board, 3 ... Conductor pattern, 3a ... Land, 4 ... Lead wire, 4a ... End, 5 ... Solder, 6 ... Pin, 6a ... Umbrella, 6b ...Tip.
Claims (1)
片面プリント配線板１に、導体パターン３のラン
ド３ａを貫通する孔１ｂを明け、かさ部６ａを有
するピン６をその先端部６ｂが孔１ｂを貫通して
プリント配線板１の表面に突出すると共にかさ部
６ａをプリント配線板１の裏面１ｃに引つ掛け、
ランド３ａにリード線４の端部４ａと前記先端部
６ｂとをハンダ付けしたことを特徴とするプリン
ト回路板。 A hole 1b penetrating the land 3a of the conductor pattern 3 is formed in a single-sided printed wiring board 1 having a conductor pattern 3 formed on the surface of an insulating substrate 2, and a pin 6 having an umbrella portion 6a is inserted so that its tip 6b passes through the hole 1b. and protrudes from the front surface of the printed wiring board 1, and hooks the bulk part 6a onto the back surface 1c of the printed wiring board 1,
A printed circuit board characterized in that an end 4a of a lead wire 4 and the tip 6b are soldered to a land 3a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7453890U JPH0432563U (en) | 1990-07-12 | 1990-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7453890U JPH0432563U (en) | 1990-07-12 | 1990-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0432563U true JPH0432563U (en) | 1992-03-17 |
Family
ID=31614316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7453890U Pending JPH0432563U (en) | 1990-07-12 | 1990-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432563U (en) |
-
1990
- 1990-07-12 JP JP7453890U patent/JPH0432563U/ja active Pending