JPH04325293A - Non-contact ic card - Google Patents

Abstract

PURPOSE:To prevent the cracking of a substrate and to enhance the reliability of a product by uniformizing the strength of the part of the coil wiring 11 of the substrate. CONSTITUTION:The coil wirings 11 provided to the surface and rear of a substrate 1 are arranged so as to be shifted each other so that they are not mutually opposed as a whole so as to hold the substrate 1 between them.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] This invention relates to a contactless IC card that transmits and receives data using radio waves, and particularly relates to a contactless IC card in which coil wiring of a resonant circuit for transmitting and receiving radio waves is provided on both sides of a substrate. It is something.

0002

2. Description of the Related Art FIG. 6 is a configuration diagram showing an example of a conventional IC card, and FIG. 7 is a sectional view taken along line VII-VII in FIG. In the figure, 1 is a substrate, and 2 is an IC provided on the substrate 1. This IC 2 has built-in circuits necessary for this non-contact IC card to achieve various purposes. 3 is a component such as a capacitor and a resistor provided on the substrate 1; 4 is a battery provided on the substrate 1 as a power source; 5 is an antenna for transmitting and receiving radio waves with an external device (not shown). This is the coil wiring of the resonant circuit used, and this coil wiring 5 is provided in a spiral shape on both sides of the substrate 1. 6 is a plastic sealing the substrate 1.

Next, the pattern of the coil wiring 5 will be explained with reference to FIGS. 8 to 10. In a conventional non-contact IC card, the coil wiring 5 on the front surface of the substrate 1 and the coil wiring 5 on the back surface are connected through a through hole 7 to form one coil. Further, as shown in FIG. 9, the coil wiring 5 on the front surface and the coil wiring 5 on the back surface are provided at positions where they are vertically overlapped with each other with the substrate 1 in between. In other words, on both sides of the substrate 1, the portions where the coil wiring 5 is present and the portions where the coil wiring 5 is absent are the same.

0004

[Problems to be Solved by the Invention] In the conventional non-contact IC card constructed as described above, the strength of the substrate 1 is extremely different between the part with the coil wiring 5 and the part without it. As shown, when the substrate 1 is deformed by the bending force in the direction of the arrow in the figure, there is a problem in that cracks 8 as shown in FIG. 12 may occur in portions of the substrate 1 where the coil wiring 5 is not provided.

[0005] The present invention was made to solve the above-mentioned problems, and aims to provide a non-contact IC card that can prevent cracks from occurring in the coil wiring portion of the board. purpose.

[0006]

[Means for solving the problem] Non-contact I according to the present invention
The C card has coil wiring on the front and back sides of the board shifted from each other.

[0007]

[Operation] In this invention, by shifting the coil wiring on the front and back sides of the substrate, they are prevented from facing each other as a whole with the substrate in between, and the strength of the coil wiring portion of the substrate is made uniform.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing a coil wiring pattern on the surface of a substrate of a non-contact IC card according to an embodiment of the present invention, and FIG.
is a sectional view taken along line II-II in FIG. 1, and FIG. 3 is a configuration diagram showing a coil wiring pattern on the back side of the board in FIG.
Other parts are similar to those in FIG.

In the figure, reference numeral 11 denotes a coil wiring of the resonant circuit, which is provided in a spiral shape on both sides of the substrate 1 as in the conventional case, and the coil wiring 11 on the front and back sides is connected to the through hole 7.
are connected to form one coil. Further, the positions of the coil wiring 11 on the front surface of the substrate 1 and the coil wiring 11 on the back surface are shifted from each other so that they do not overlap each other with the substrate 1 in between. Furthermore, as shown in FIG. 4, which is an enlarged version of FIG.
The coil wirings 11 on the front and back sides are shifted both in the vertical and horizontal directions so that the center of the coil wiring 11 on the back side is located in the center of the space where there is no 1. That is, in FIG.
A=B, C=D.

In the non-contact IC card configured as described above, when the substrate 1 is deformed by bending force in the direction of the arrow in the figure, for example, as shown in FIG. Even if it tries to bend, the coil wiring 11 on the back side suppresses it.Also, even if the part without the coil wiring 11 on the back side tries to bend, the coil wiring 11 on the front side suppresses it, so as a result, the board 1 Cracks are less likely to occur. In other words, the coil wiring 11 of the board 11
This area is uniformly reinforced and cracks are prevented from forming in this area.

[0011] In the above embodiment, since the width of the coil wiring 11 and the wiring pitch are almost the same, the coil wiring 11
For example, if the width of the coil wiring is larger than the wiring pitch, it may be effective to shift the coil wiring on the front and back sides to a certain extent, so that the coil wiring on the front and back sides are completely opposed to each other. If not, they may be partially facing each other.

0012

[Effects of the Invention] As explained above, in the contactless IC card of the present invention, the coil wirings on the front and back sides of the board are arranged so as to be shifted from each other, so that they are prevented from facing each other as a whole with the board in between. Therefore, the strength of the coil wiring portion of the board can be made uniform, thereby preventing cracks from occurring in the board, and achieving the effect that the reliability of the product can be increased.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing a coil wiring pattern on the surface of a substrate of a non-contact IC card according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG. 1;

FIG. 3 is a configuration diagram showing a coil wiring pattern on the back side of the board in FIG. 1;

FIG. 4 is an enlarged cross-sectional view of the dashed circle portion in FIG. 2;

FIG. 5 is a cross-sectional view showing a state in which the substrate in FIG. 1 is deformed by bending force.

FIG. 6 is a configuration diagram showing an example of a conventional IC card.

7 is a sectional view taken along line VII-VII in FIG. 6; FIG.

8 is a configuration diagram showing a coil wiring pattern on the surface of the substrate in FIG. 6; FIG.

9 is a sectional view taken along line IX-IX in FIG. 8; FIG.

10 is a configuration diagram showing a coil wiring pattern on the back side of the board in FIG. 6; FIG.

FIG. 11 is a cross-sectional view showing a state in which the substrate in FIG. 6 is deformed by bending force.

12 is a cross-sectional view showing a state in which a crack has occurred in the substrate of FIG. 6. FIG.

[Explanation of symbols]

1 Board 11 Coil wiring

Claims (1)

[Claims] 1. In a contactless IC card in which coil wiring of a resonant circuit is provided on both sides of a substrate, the coil wiring on the front surface of the substrate and the coil wiring on the back surface of the substrate are such that they sandwich the substrate. A non-contact IC card characterized in that the cards are arranged offset from each other so as to avoid facing each other entirely.