JPH04318450A - Electrostatic capacitance-type humidity sensor - Google Patents
Electrostatic capacitance-type humidity sensorInfo
- Publication number
- JPH04318450A JPH04318450A JP11092891A JP11092891A JPH04318450A JP H04318450 A JPH04318450 A JP H04318450A JP 11092891 A JP11092891 A JP 11092891A JP 11092891 A JP11092891 A JP 11092891A JP H04318450 A JPH04318450 A JP H04318450A
- Authority
- JP
- Japan
- Prior art keywords
- sensitive film
- humidity
- film
- humidity sensor
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 abstract description 4
- 238000004544 sputter deposition Methods 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 27
- 238000001514 detection method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- -1 ZnO and SnO2 Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、静電容量式湿度センサ
に関する。更に詳しくは、耐熱性などの耐環境性を改善
せしめた静電容量式湿度センサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitive humidity sensor. More specifically, the present invention relates to a capacitive humidity sensor with improved environmental resistance such as heat resistance.
【0002】0002
【従来の技術】従来、高分子膜を感湿膜とする湿度セン
サには、抵抗検出型と容量検出型のものがある。抵抗検
出型のものは、低温・低湿度域での測定値の信頼性が低
く、一方容量検出型のものは、高温・高湿度域での精度
が悪いが、現在用いられている湿度センサで、相対湿度
0〜100%の範囲を計測できるものは殆んど容量検出
型である。2. Description of the Related Art Hitherto, humidity sensors using a polymer film as a moisture-sensitive film include a resistance detection type and a capacitance detection type. Resistance detection types have low reliability of measurement values in low temperature and low humidity areas, while capacitance detection types have poor accuracy in high temperature and high humidity areas, but humidity sensors currently in use are Most of the devices that can measure relative humidity in the range of 0 to 100% are of the capacitive detection type.
【0003】この容量検出型のものは、一般に絶縁性基
板上に形成させた導電性電極の表面を高分子膜状体で被
覆し、この高分子感湿膜の上に透湿性上部電極を形成さ
せ、これと導電性電極よりなる下部電極とで高分子感湿
膜を挟んだ構造をとっている。そして、容量検出型湿度
センサの働きは、湿度によって感湿膜中の含水量が変化
するのに伴う誘電率の変化量が静電容量の変化量として
検出されるという原理に基いている。[0003] In this capacitive detection type, the surface of a conductive electrode formed on an insulating substrate is generally covered with a polymer film, and a moisture-permeable upper electrode is formed on the polymer moisture-sensitive film. A moisture-sensitive polymer film is sandwiched between this and a lower electrode made of a conductive electrode. The function of the capacitive humidity sensor is based on the principle that the amount of change in dielectric constant that accompanies changes in the water content in the moisture sensitive film due to humidity is detected as the amount of change in capacitance.
【0004】ところで容量検出型湿度センサの内、静電
容量式の湿度センサとしては、従来主として次の2種類
のものが一般に採用されている。
(1)図面の図1(a)〜(c)に示されるように、絶
縁性基板21上にスパッタリング法または蒸着法および
フォトリソグラフ法を適用して端子部22,22´を有
する一対の対向形状下部電極23,23´を形成させた
後、感湿膜24および蒸着膜よりなる上部電極25を順
次重ねて形成させたもの(2)図面の図2(a)〜(c
)に示されるように、絶縁性基板31上に端子部32を
有し、電極部33を大きく設けた下部電極34を形成さ
せた後、電極部上に感湿膜35を重ねて形成させ、更に
下部電極と対称的な形状を有する上部電極36(あるい
はくし形形状の上部電極)をその電極部37が感湿膜上
に位置し、端子部38が下部電極の端子部と対称位置に
なるように形成させたものAmong the capacitance detection type humidity sensors, the following two types of capacitance type humidity sensors have been generally employed. (1) As shown in FIGS. 1(a) to 1(c) of the drawings, a pair of opposing terminal portions 22, 22' are formed on an insulating substrate 21 by applying a sputtering method, a vapor deposition method, and a photolithography method. After forming the shaped lower electrodes 23, 23', the moisture-sensitive film 24 and the upper electrode 25 made of a vapor-deposited film are sequentially stacked and formed (2) Figures 2(a) to (c) of the drawings.
), a lower electrode 34 having a terminal portion 32 and a large electrode portion 33 is formed on an insulating substrate 31, and then a moisture sensitive film 35 is formed over the electrode portion, Further, an upper electrode 36 (or a comb-shaped upper electrode) having a shape symmetrical to that of the lower electrode is arranged so that its electrode portion 37 is located on the moisture sensitive membrane, and its terminal portion 38 is located symmetrically to the terminal portion of the lower electrode. formed like this
【0005】これらの静電容量式湿度センサの感湿膜は
、ZnO、SnO2などの金属酸化物あるいは酢酸セル
ロースなどの高分子物質などから形成されているが、こ
のような材料からの感湿膜の形成に際しては、フォトレ
ジストによるパターニングが行われている。The moisture-sensitive films of these capacitive humidity sensors are made of metal oxides such as ZnO and SnO2, or polymeric substances such as cellulose acetate. When forming, patterning is performed using photoresist.
【0006】[0006]
【発明が解決しようとする課題】本発明の目的は、絶縁
性基板上に下部電極、感湿膜および上部電極を順次形成
せしめた静電容量式湿度センサにおいて、感湿膜の形成
を容易化ならしめることにある。SUMMARY OF THE INVENTION An object of the present invention is to facilitate the formation of a moisture-sensitive film in a capacitive humidity sensor in which a lower electrode, a moisture-sensitive film, and an upper electrode are sequentially formed on an insulating substrate. It's about getting used to it.
【0007】[0007]
【課題を解決するための手段】かかる本発明の目的は、
上記構成の静電容量式湿度センサにおいて、感湿膜とし
てフォトレジスト硬化膜よりなる感湿膜を用いることに
より達成される。即ち、本発明においては、従来感湿膜
の形成時のパターニングのために用いられていたフォト
レジストそれ自体で感湿膜を形成させている。[Means for Solving the Problems] The purpose of the present invention is to
In the capacitive humidity sensor having the above configuration, this is achieved by using a humidity sensitive film made of a cured photoresist film as the humidity sensitive film. That is, in the present invention, the moisture-sensitive film is formed using the photoresist itself, which has conventionally been used for patterning when forming the moisture-sensitive film.
【0008】絶縁性基板としては、ガラス、アルミナ、
石英、表面が絶縁処理されたシリコンウェハなどが用い
られ、前記の如き構成を有する上部電極および下部電極
の電極材料としては、Au、Pt、Alなどの薄膜化し
得る導体が用いられ、薄膜化は蒸着法、スパッタリング
法などによって行われる。また、それのパターニングは
、フォトリソグラフィーによるレジストパターンの形成
およびエッチングにより行われる。[0008] As the insulating substrate, glass, alumina,
Quartz, a silicon wafer whose surface is insulated, etc. are used, and conductors that can be made into thin films, such as Au, Pt, and Al, are used as electrode materials for the upper and lower electrodes having the above-mentioned configuration. This is done by a vapor deposition method, a sputtering method, or the like. Further, the patterning thereof is performed by forming a resist pattern by photolithography and etching.
【0009】上部電極と下部電極との間に形成せしめる
感湿膜は、従来薄膜化し得る材料のコーティング剤のス
ピンコート後プリベークし、ポジ型のフォトレジストを
スピンコート、プリベーク、露光、現像後レジストを除
去し、熱処理することにより行われている。The moisture-sensitive film formed between the upper electrode and the lower electrode is conventionally formed by spin-coating a coating agent of a material that can be made into a thin film and then pre-baking, and then applying a positive photoresist to the resist after spin-coating, pre-baking, exposure and development. This is done by removing and heat-treating.
【0010】また、感湿膜上に上部電極を形成させなけ
ればならないので、端子部をマスキングしたり、あるい
は全面に電極形成材料を積層させた後不要部分を剥す必
要があり、これらのためにフォトレジストが使用されて
いる。[0010] Furthermore, since the upper electrode must be formed on the moisture-sensitive film, it is necessary to mask the terminal part, or to peel off unnecessary parts after laminating the electrode forming material over the entire surface. Photoresist is used.
【0011】本発明においては、このようなフォトレジ
スト、例えば東京応化製品であるOMRシリーズ(ネガ
型)またはOFPRシリーズ(ポジ型)を用い、それを
下部電極上にスピンコートし、パターニング、ポストベ
ークの後に、更に紫外線を照射して硬化させることによ
り、膜厚約1〜数μmの感湿膜を形成させている。In the present invention, such a photoresist, such as OMR series (negative type) or OFPR series (positive type) manufactured by Tokyo Ohka Chemical Co., Ltd., is used, and it is spin-coated onto the lower electrode, patterned, and post-baked. After that, the film is further cured by irradiation with ultraviolet rays, thereby forming a moisture-sensitive film with a thickness of about 1 to several μm.
【0012】0012
【発明の効果】絶縁性基板上に下部電極、感湿膜および
上部電極を順次形成させた静電容量式湿度センサにおい
て、感湿膜をフォトレジスト硬化膜により形成せしめる
ことにより、それの制作の容易化が達成されるばかりで
はなく、薄膜化(数μm以下)に伴う速い応答性も得ら
れ、またその膜厚の調節、換言すれば応答性の調節もコ
ーティング剤の濃度、スピナー回転数などの選択により
容易に行うことができる。[Effects of the Invention] In a capacitive humidity sensor in which a lower electrode, a moisture-sensitive film, and an upper electrode are sequentially formed on an insulating substrate, the humidity-sensitive film is formed from a cured photoresist film, making it easier to manufacture. Not only is it easier to achieve this, but it also provides faster response due to the thinner film (several μm or less), and the adjustment of the film thickness, or in other words, the response, can be controlled by changing the coating agent concentration, spinner rotation speed, etc. This can be easily done by selecting .
【0013】[0013]
【実施例】次に、実施例について本発明を説明する。EXAMPLES Next, the present invention will be explained with reference to examples.
【0014】実施例
ガラス基板上に、スパッタリング法によりMoを500
Å、Auを2000Åの膜厚で連続成膜した後、フォト
リソグラフィーによりレジストのパターンを形成させ、
その後エッチングして図1(a)に示される形状の下部
電極を形成させた。Example: 500% Mo was deposited on a glass substrate by sputtering.
After continuously forming a film of 2000 Å thick, a resist pattern was formed by photolithography.
Thereafter, etching was performed to form a lower electrode having the shape shown in FIG. 1(a).
【0015】このレジストを除去した後の下部電極上に
、ネガ型のフォトレジスト(OMR−85,粘度25c
ps)またはポジ型のフォトレジスト(OFPR−80
0,粘度25cps)をスピンコートし、ポストベーク
(140℃、30分間)後、紫外線照射による硬化処理
をして、図1(b)に示される形状の感湿膜を形成させ
た。After removing this resist, a negative photoresist (OMR-85, viscosity 25c) is applied on the lower electrode.
ps) or positive photoresist (OFPR-80
0, viscosity 25 cps), post-baked (140° C., 30 minutes), and then cured by ultraviolet irradiation to form a moisture-sensitive film having the shape shown in FIG. 1(b).
【0016】更に、Auを蒸着させ、膜厚100Åの上
部電極を、図1(c)に示される形状に形成させた。Furthermore, Au was deposited to form an upper electrode with a thickness of 100 Å in the shape shown in FIG. 1(c).
【0017】膜厚0.8μmの感湿膜を形成させた静電
容量式湿度センサについて、次の条件下で相対湿度に対
する静電容量の変化を測定すると、図3のグラフに示さ
れるような結果が得られ、そこに良好な相関関係が確認
された。
恒湿槽:神栄製分流式精密湿度発生器
測定器:YHP製LCRメータ
条 件:25℃、1V、1KHz印加When measuring the change in capacitance with respect to relative humidity under the following conditions for a capacitive humidity sensor formed with a moisture-sensitive film with a film thickness of 0.8 μm, the graph shown in FIG. 3 is obtained. The results showed a good correlation. Humidity tank: Separate flow precision humidity generator made by Shinei Measuring device: LCR meter made by YHP Conditions: 25°C, 1V, 1KHz applied
【図1】従来の静電容量式湿度センサの製造順序を示す
斜視図である。FIG. 1 is a perspective view showing the manufacturing sequence of a conventional capacitive humidity sensor.
【図2】従来の静電容量式湿度センサの製造順序を示す
斜視図である。FIG. 2 is a perspective view showing the manufacturing order of a conventional capacitive humidity sensor.
【図3】本発明に係る静電容量式湿度センサの相対湿度
と容量との関係を示すグラフである。FIG. 3 is a graph showing the relationship between relative humidity and capacitance of the capacitive humidity sensor according to the present invention.
21,31 導電性基板 23,34 下部電極 24,35 感湿膜 25,36 上部電極 21, 31 Conductive substrate 23, 34 Lower electrode 24, 35 Moisture sensitive membrane 25, 36 Upper electrode
Claims (1)
ジスト硬化膜よりなる感湿膜および上部電極を順次形成
せしめてなる静電容量式湿度センサ。1. A capacitive humidity sensor comprising a lower electrode, a moisture sensitive film made of a cured photoresist film, and an upper electrode formed in sequence on an insulating substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11092891A JPH04318450A (en) | 1991-04-16 | 1991-04-16 | Electrostatic capacitance-type humidity sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11092891A JPH04318450A (en) | 1991-04-16 | 1991-04-16 | Electrostatic capacitance-type humidity sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04318450A true JPH04318450A (en) | 1992-11-10 |
Family
ID=14548164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11092891A Pending JPH04318450A (en) | 1991-04-16 | 1991-04-16 | Electrostatic capacitance-type humidity sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04318450A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001272366A (en) * | 2000-03-24 | 2001-10-05 | Tdk Corp | Electronic component having humidity detecting function and its manufacturing method |
KR100817731B1 (en) * | 2006-10-09 | 2008-03-31 | 쌍신전자통신주식회사 | Capacitance type humidity sensor and method for fabricating the same |
CN102590291A (en) * | 2012-01-16 | 2012-07-18 | 中国科学院上海微系统与信息技术研究所 | Method for manufacturing improved humidity sensor |
-
1991
- 1991-04-16 JP JP11092891A patent/JPH04318450A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001272366A (en) * | 2000-03-24 | 2001-10-05 | Tdk Corp | Electronic component having humidity detecting function and its manufacturing method |
KR100817731B1 (en) * | 2006-10-09 | 2008-03-31 | 쌍신전자통신주식회사 | Capacitance type humidity sensor and method for fabricating the same |
CN102590291A (en) * | 2012-01-16 | 2012-07-18 | 中国科学院上海微系统与信息技术研究所 | Method for manufacturing improved humidity sensor |
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