JPH04317389A - Forming method for wiring pattern - Google Patents
Forming method for wiring patternInfo
- Publication number
- JPH04317389A JPH04317389A JP11105191A JP11105191A JPH04317389A JP H04317389 A JPH04317389 A JP H04317389A JP 11105191 A JP11105191 A JP 11105191A JP 11105191 A JP11105191 A JP 11105191A JP H04317389 A JPH04317389 A JP H04317389A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- polyimide
- wiring pattern
- forming
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 20
- 239000002245 particle Substances 0.000 claims abstract description 39
- 229920001721 polyimide Polymers 0.000 claims abstract description 24
- 239000004020 conductor Substances 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052737 gold Inorganic materials 0.000 claims abstract description 20
- 239000010931 gold Substances 0.000 claims abstract description 20
- 239000004642 Polyimide Substances 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 239000002075 main ingredient Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は導体配線パターンの形成
方法に関し、厚膜多層基板のパターン形成方法に関する
。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a conductor wiring pattern, and more particularly to a method for forming a pattern on a thick film multilayer substrate.
【0002】0002
【従来の技術】従来、この種の厚膜パターンの形成方法
は、アルミナセラミックやガラスセラミック基板上に、
金属粉末,有機溶剤,有機溶媒を原料とした導体ペース
トを厚膜印刷法により塗布形成し、乾燥工程を経たのち
焼結しパターンを形成している。また、ポリイミドフィ
ルム上へのパターン形成においては、メッキ法やスパッ
タ法,CVD法をはじめとする薄膜法により実施してい
る。これらのパターン形成方法にはそれぞれ特徴があり
、厚膜印刷法においては、製造工程が単純であると同時
に比較的容易に微細パターンが形成できる特徴があり、
広く一般に使用されている。メッキ法や薄膜法において
は、有機フィルム上に微細パターンを形成できることが
特徴であり、コンピュータをはじめとする高密度実装基
板に使用されている。[Prior Art] Conventionally, this type of thick film pattern formation method has been carried out on an alumina ceramic or glass ceramic substrate.
A conductive paste made of metal powder, organic solvent, and organic solvent is applied and formed using a thick film printing method, and after a drying process, it is sintered to form a pattern. Furthermore, pattern formation on polyimide films is carried out by thin film methods such as plating, sputtering, and CVD. Each of these pattern forming methods has its own characteristics, and the thick film printing method is characterized by a simple manufacturing process and the ability to form fine patterns relatively easily.
Widely and commonly used. The plating method and thin film method are characterized by the ability to form fine patterns on organic films, and are used for high-density mounting boards such as computers.
【0003】また最近注目されている技術として、エポ
キシ、及びポリイミド樹脂に導体粒子を添加した材料が
あり、厚膜印刷用導体ペーストに比べ導体形成温度が低
いことと、ポリイミド樹脂上に形成できること等により
、最近半導体のダイボンディングに広く用いられている
。有機樹脂への導体金属の添加については、熱伝導性,
導電性の要求により、銀,金といった貴金属が多く用い
られている。[0003] Also, as a technology that has recently attracted attention, there is a material in which conductor particles are added to epoxy or polyimide resin, which has a lower temperature for forming conductors than conductor paste for thick film printing, and can be formed on polyimide resin. Due to this, it has recently been widely used in semiconductor die bonding. Regarding the addition of conductive metals to organic resins, thermal conductivity,
Due to the requirement for electrical conductivity, noble metals such as silver and gold are often used.
【0004】0004
【発明が解決しようとする課題】しかし、上述した従来
の技術においては以下の問題点が発生する。すなわち、
導体ペーストによる厚膜印刷法においては、印刷後一般
的には約600℃〜920℃程度の温度で焼結し導体化
する必要があり、ポリイミド多層基板やガラスエポキシ
プリント基板上へのパターン形成においては、処理温度
を約350℃以下で実施する必要がある。このため、有
機フィルム上へのパターンの形成が困難である。SUMMARY OF THE INVENTION However, the following problems occur in the above-mentioned conventional technology. That is,
In the thick film printing method using conductive paste, it is generally necessary to sinter it at a temperature of about 600°C to 920°C after printing to make it conductive, which is difficult to do when forming patterns on polyimide multilayer boards or glass epoxy printed boards. It is necessary to carry out the treatment at a temperature of about 350°C or less. For this reason, it is difficult to form a pattern on an organic film.
【0005】またメッキ法や薄膜法においては、ホトリ
ソグラフィー技術やエッチング技術といった技術が必要
になり、製造工程が複雑になると同時に、高額な製造設
備が必要となり、生産のリードタイム及び製造コストが
高価になるという問題がある。[0005] Furthermore, plating and thin film methods require technologies such as photolithography and etching, which complicate the manufacturing process and require expensive manufacturing equipment, resulting in high production lead times and manufacturing costs. There is a problem with becoming.
【0006】有機樹脂に導体粒子を添加したものについ
ては、基本樹脂と導体粒子の分散において導体粒子のま
わりに低熱伝導性で高絶縁性を有する基本樹脂が皮膜を
形成する状態で分散するために、加熱硬化後のパターン
の熱伝導性が悪く、また導体抵抗が高くなってしまう。[0006] Regarding organic resins with conductor particles added, when the base resin and conductor particles are dispersed, the base resin having low thermal conductivity and high insulation properties is dispersed to form a film around the conductor particles. The thermal conductivity of the pattern after heating and curing is poor, and the conductor resistance becomes high.
【0007】本発明の目的は、前記課題を解決した配線
パターンの形成方法を提供することにある。An object of the present invention is to provide a method for forming a wiring pattern that solves the above problems.
【0008】[0008]
【課題を解決するための手段】前記目的を達成するため
、本発明に係る配線パターンの形成方法においては、配
線パターンの形成用ペーストとして、有機樹脂と導体粒
子とを主体とするペーストを用い、該ペーストを基板上
に塗布して配線パターンを形成し、これを加熱硬化させ
、該配線パターン上に、加圧力、又は加圧力とともに超
音波エネルギー、又は超音波エネルギー及び熱エネルギ
ーを作用させることにより、有機樹脂中の導体粒子の表
面に形成されている有機樹脂皮膜を破壊し、導体粒子相
互間を密に接合して互いに導通させるものである。[Means for Solving the Problems] In order to achieve the above object, in the method for forming a wiring pattern according to the present invention, a paste mainly composed of an organic resin and conductor particles is used as a paste for forming a wiring pattern, By applying the paste onto a substrate to form a wiring pattern, curing it by heating, and applying pressure, or ultrasonic energy together with pressure, or ultrasonic energy and thermal energy to the wiring pattern. , the organic resin film formed on the surface of the conductor particles in the organic resin is destroyed, and the conductor particles are closely bonded to each other to make them conductive to each other.
【0009】また、前記有機樹脂は、ポリイミドを主成
分とし、前記導体粒子は、金粒子からなるものである。[0009] Furthermore, the organic resin has polyimide as a main component, and the conductor particles are made of gold particles.
【0010】0010
【作用】ポリイミド樹脂と導体粒子を主体とするペース
トを基板上に形成し加熱硬化させたのち、ポリイミド中
の導体粒子表面に形成したポリイミド膜を破壊すること
により導体粒子相互間を密にして導通させたものである
。[Operation] After forming a paste mainly composed of polyimide resin and conductor particles on a substrate and curing it by heating, the polyimide film formed on the surface of the conductor particles in the polyimide is destroyed, thereby making the conductor particles denser and conductive. This is what I did.
【0011】[0011]
【実施例】次に図面を参照して本発明について詳細に説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained in detail with reference to the drawings.
【0012】図1〜図3は本発明の実施例を説明するた
めの断面図であり、図1はローラによる加圧方式、図2
は超音波振動子と加圧力による方式、図3は超音波振動
子と加圧力と加熱装置による方式を示す図である。図4
は本発明の原理を説明するための断面図である。1 to 3 are cross-sectional views for explaining embodiments of the present invention, in which FIG. 1 shows a pressure method using a roller, and FIG.
3 is a diagram showing a method using an ultrasonic vibrator and a pressure force, and FIG. 3 is a diagram showing a method using an ultrasonic transducer, a pressure force, and a heating device. Figure 4
FIG. 2 is a sectional view for explaining the principle of the present invention.
【0013】図4において基板3上には、有機樹脂がポ
リイミド、導体粒子が金粒子を主成分とする配線パター
ン形成用のペーストが塗布されている。この状態におい
ては、金粒子1の表面には、ポリイミド2の皮膜が形成
されている。このため、電気抵抗は高抵抗を示している
。次に塗布されたペーストに対してオーブンにより約3
50〜420℃,30〜60分の条件で硬化させる(硬
化状態図示せず)。今回使用したポリイミド金はポリイ
ミドの前駆体が10wt%,金粒子が90wt%の比率
で混練されており、体積比にして約68:32の割合で
あるが、加熱硬化によりイミド化することにより、最終
的にはポリイミドと金の体積比は約30:70の割合に
なる。この状態では、金粒子間の接続は不完全な状態で
ある。このため、温度変化に対して電気的には不安定な
状態となっている。In FIG. 4, a paste for forming a wiring pattern is coated on a substrate 3, the organic resin being polyimide and the conductor particles being gold particles as main components. In this state, a film of polyimide 2 is formed on the surface of gold particle 1. Therefore, the electrical resistance shows high resistance. The applied paste is then heated in an oven for approx.
It is cured under conditions of 50 to 420° C. and 30 to 60 minutes (cured state not shown). The polyimide gold used this time is a mixture of 10 wt% of polyimide precursor and 90 wt% of gold particles, which is a volume ratio of about 68:32, but by imidization by heat curing, The final volume ratio of polyimide to gold is about 30:70. In this state, the connections between gold particles are incomplete. Therefore, it is in an electrically unstable state with respect to temperature changes.
【0014】そこで、図1に示す実施例では、基板3の
ポリイミド金1,2に加圧ローラ4により機械的な圧力
を加えることにより、金粒子1の表面に形成したポリイ
ミド2の皮膜を破壊する。これにより、金粒子1,1間
が圧着され良好な電気的な接続が得られる。金粒子1,
1間の接合力は、金粒子間に対する加圧力,温度,摩擦
力により依存するために、これらのエネルギーを加えた
方法が考えられる。Therefore, in the embodiment shown in FIG. 1, by applying mechanical pressure to the polyimide gold 1 and 2 on the substrate 3 using a pressure roller 4, the film of the polyimide 2 formed on the surface of the gold particles 1 is destroyed. do. Thereby, the gold particles 1 and 1 are crimped and a good electrical connection is obtained. gold particles 1,
Since the bonding force between gold particles depends on the pressing force, temperature, and frictional force between the gold particles, a method in which these energies are added is considered.
【0015】図2の実施例は、エネルギーとして超音波
振動と、加圧力とを加えた実施例であり、ポリイミド2
,金粒子1の表面に、超音波振動素子5により超音波エ
ネルギーをキャピラリー6を介して加えるとともにキャ
ピラリー6により加圧する。本実施例によれば、金粒子
間の接合が密になり安定な電気接続が得られる。The embodiment shown in FIG. 2 is an embodiment in which ultrasonic vibration and pressing force are applied as energy, and polyimide 2
, ultrasonic energy is applied to the surface of the gold particles 1 by the ultrasonic vibrating element 5 via the capillary 6, and the capillary 6 pressurizes the surface. According to this example, the bond between the gold particles becomes dense, and a stable electrical connection can be obtained.
【0016】図3の実施例は、図2の実施例に対してさ
らに基板3の裏面より加熱装置7により加熱されること
により、さらに効果的な金粒子間の接合を達成するよう
にしたものである。The embodiment shown in FIG. 3 is different from the embodiment shown in FIG. 2 in that the substrate 3 is heated from the back side by a heating device 7, thereby achieving even more effective bonding between gold particles. It is.
【0017】[0017]
【発明の効果】以上説明したように本発明は、配線パタ
ーン形成用の導体ペーストで形成されたパターン上に、
機械的エネルギー,熱的エネルギーを加えることにより
、ペースト中の導体粒子同士間に電気的に安定した接続
が得られることにより、高信頼性な配線パターンが形成
できるという効果がある。[Effects of the Invention] As explained above, the present invention provides the following advantages:
By applying mechanical energy and thermal energy, electrically stable connections can be obtained between the conductor particles in the paste, resulting in the formation of highly reliable wiring patterns.
【図1】本発明の実施例1を示す断面図である。FIG. 1 is a sectional view showing Example 1 of the present invention.
【図2】本発明の実施例2を示す断面図である。FIG. 2 is a sectional view showing a second embodiment of the present invention.
【図3】本発明の実施例3を示す断面図である。FIG. 3 is a sectional view showing a third embodiment of the present invention.
【図4】本発明の原理を説明する断面図である。FIG. 4 is a sectional view illustrating the principle of the present invention.
1 金粒子 2 ポリイミド 3 基板 4 加圧ローラ 5 超音波振動子 6 キャピラリー 7 加熱装置 1 Gold particles 2 Polyimide 3 Board 4 Pressure roller 5 Ultrasonic transducer 6 Capillary 7 Heating device
Claims (2)
、有機樹脂と導体粒子とを主体とするペーストを用い、
該ペーストを基板上に塗布して配線パターンを形成し、
これを加熱硬化させ、該配線パターン上に、加圧力、又
は加圧力とともに超音波エネルギー、又は超音波エネル
ギー及び熱エネルギーを作用させることにより、有機樹
脂中の導体粒子の表面に形成されている有機樹脂皮膜を
破壊し、導体粒子相互間を密に接合して互いに導通させ
ることを特徴とする配線パターンの形成方法。[Claim 1] A paste mainly composed of an organic resin and conductor particles is used as a paste for forming a wiring pattern,
Applying the paste on the board to form a wiring pattern,
The organic resin formed on the surface of the conductor particles in the organic resin is cured by heating, and by applying pressure, or ultrasonic energy and heat energy together with the pressure, to the wiring pattern. A method for forming a wiring pattern characterized by destroying a resin film and closely bonding conductor particles to each other to make them conductive to each other.
とし、前記導体粒子は、金粒子からなることを特徴とす
る請求項1に記載の配線パターンの形成方法。2. The method of forming a wiring pattern according to claim 1, wherein the organic resin contains polyimide as a main component, and the conductor particles are made of gold particles.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11105191A JPH04317389A (en) | 1991-04-16 | 1991-04-16 | Forming method for wiring pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11105191A JPH04317389A (en) | 1991-04-16 | 1991-04-16 | Forming method for wiring pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04317389A true JPH04317389A (en) | 1992-11-09 |
Family
ID=14551168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11105191A Pending JPH04317389A (en) | 1991-04-16 | 1991-04-16 | Forming method for wiring pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04317389A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016012652A (en) * | 2014-06-28 | 2016-01-21 | コニカミノルタ株式会社 | Burning method |
US20170044382A1 (en) * | 2015-08-12 | 2017-02-16 | E I Du Pont De Nemours And Company | Process for forming a solderable polyimide-based polymer thick film conductor |
-
1991
- 1991-04-16 JP JP11105191A patent/JPH04317389A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016012652A (en) * | 2014-06-28 | 2016-01-21 | コニカミノルタ株式会社 | Burning method |
US20170044382A1 (en) * | 2015-08-12 | 2017-02-16 | E I Du Pont De Nemours And Company | Process for forming a solderable polyimide-based polymer thick film conductor |
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