JPH04312909A - Production of laminate - Google Patents

Abstract

PURPOSE:To provide manufacturing method without forming nonuniformity in the shape of a conductive material film. CONSTITUTION:The plurality of insulating sheets 1 and 2 on which many certain shaped conductive material films 3 are provided in parallel are piled. Pressure is applied on the one plane of the sheet and the sheets 1 and 2 are press-bonded one another. The production of the laminate which cuts the sheets after the press-bonding allows the conductive material film 3 positioned close to the pressurizing plane of the piled sheet to be smaller than the conductive material film 3 on the other plane. Thus, even when the top layer conductive material film 3 close to the pressurizing plane is much rolled, the conductive material films 3 are permitted to be almost in the same shape after the press-bonding.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminate in which a plurality of conductive material films are laminated with insulating layers interposed therebetween.

0002

2. Description of the Related Art This type of laminate is suitably used in multilayer capacitors, piezoelectric actuators, and the like. A conventional manufacturing method will be described below, taking as an example a laminate used in a multilayer capacitor.

First, on one surface of a sheet of unfired ceramic several tens of micrometers thick, metal powder paste, which will become an internal electrode, is deposited in a predetermined pattern, for example, a rectangular thin film several micrometers thick. Print so that they are arranged in a matrix at intervals. Next, as shown in FIG. 9, a plurality of printed sheets 2 are stacked so that the top layer is covered with the unprinted sheet 1. Next, as shown in FIG. 10, pressure is applied to the upper surfaces of the stacked sheets to press the sheets 1 and 2 together. During this press-bonding, each sheet 1, 2 and thin film 3 are rolled in a planar direction. Next, the crimped sheet is cut into a grid pattern to obtain a rectangular laminate (unfired laminate chip). In the obtained green multilayer chip, a plurality of thin films serving as internal electrodes are laminated with green ceramic layers interposed therebetween.

When manufacturing a multilayer capacitor using the above-mentioned unfired multilayer chip, a metal powder paste for external electrodes is applied to the opposing wall of the chip and then fired at an appropriate temperature, or External electrodes are formed after firing the laminated chip.

[0005]

By the way, in the conventional manufacturing method, since the thin film 3 formed on each sheet has the same shape, it is difficult to apply pressure to the top surface of the stacked sheets. The upper thin film 3 close to the pressure surface is rolled to a large extent,
There is a drawback that the shape of the thin film 3 of each layer varies greatly.

That is, in the central part of the sheet, as shown in FIG. 11, the thin films 3 closer to the pressurizing surface extend in all directions, and the cross-sectional width of each thin film 3 increases upward. The width WH is considerably larger than the cross-sectional width WL of the lowest layer. In addition, in the part away from the center of the seat,
As shown in the figure, the thin film 3 closer to the pressurizing surface extends in the peripheral direction, and each thin film 3 is biased to one side, and the cross-sectional width WH of the uppermost thin film 3 becomes considerably larger than the cross-sectional width WL of the lowermost layer.

That is, when cutting the sheet after pressure bonding as shown in FIGS. 11 and 12 to obtain an unfired laminated chip, there is If an attempt is made to secure a predetermined cut margin, a gap greater than the above is created between the thin film 3 near the bottom layer and the cut end surface, resulting in a large dead space.

Therefore, even if a multilayer capacitor is fabricated using the above unfired multilayer chip, the opposing area of the internal electrodes, which is closely related to the capacitance of the multilayer capacitor, will be smaller than the cross-sectional width WL of the lowermost thin film 3. Due to this restriction, it becomes difficult to obtain the desired capacitance, and other problems arise, such as the obtained capacitance becoming smaller.

The present invention has been made in view of the above problems, and its purpose is to provide a method for manufacturing a laminate that does not cause variations in the shape of conductive material films such as thin films. be.

0010

[Means for Solving the Problems] In order to achieve the above object, in claim 1, after stacking a plurality of insulating sheets each having a plurality of conductive material films of a predetermined shape arranged in parallel, In a method for manufacturing a laminate in which sheets are crimped together by applying pressure to one side, and the sheets are cut after being crimped, the conductive material located near the pressure side of the stacked sheets is The conductive material film is made smaller than the conductive material film on the other side.

Further, in claim 2, after stacking a plurality of insulating sheets in which a large number of conductive material films of a predetermined shape are arranged in parallel, pressure is applied to one surface of the sheets to separate each sheet. In a method for manufacturing a laminate in which sheets are crimped together and the sheets are cut after crimping, a conductive material film located on the pressure side of the stacked sheets is attached to a conductive material film on the other side. It is shifted toward the center of the sheet from the material film.

Furthermore, in claim 3, after stacking a plurality of insulating sheets in which a large number of conductive material films of a predetermined shape are arranged in parallel, pressure is applied to one surface of the sheets to separate each sheet. In a method for manufacturing a laminate in which sheets are crimped together and the sheets are cut after crimping, a conductive material film located on the pressure side of the stacked sheets is attached to a conductive material film on the other side. It is made smaller than the material film and is shifted toward the center of the sheet from the conductive material film on the other side.

[0013]

The manufacturing method according to claim 1 is useful when the number of conductive material films formed on a sheet is small. That is,
Since the conductive material film located near the pressure surface of the stacked sheets is smaller than the conductive material film on the other side, the upper conductive material film near the pressure surface is rolled significantly during crimping. Even if it extends in all directions, the conductive material film after pressure bonding has almost the same shape.

Furthermore, the manufacturing method according to claim 2 is useful when a conductive material film is formed in a region other than the center of the sheet. In other words, since the conductive material film located near the pressure surface of the stacked sheets is shifted toward the center of the sheet from the conductive material film on the other surface, the upper layer near the pressure surface during crimping is Even if the conductive material film is rolled to a large extent and extends in the direction of the sheet periphery, the conductive material film after crimping will have substantially the same shape without deviation.

Furthermore, the manufacturing method according to claim 3 is useful when a large number of conductive material films are formed on a sheet. That is, the conductive material film located closer to the pressure surface of the stacked sheets is smaller than the conductive material film on the other side, and furthermore, it is shifted toward the center of the sheet than the conductive material film on the other side. Therefore, even if the upper conductive material film near the pressurized surface is greatly rolled during crimping and extends in all directions and in the direction of the sheet periphery, the conductive material film after crimping will have almost the same shape without deviation. Become.

[0016]

[Embodiment 1] Figures 1 and 2 show a first embodiment of the present invention, in which the thin film located closer to the pressure side of the stacked sheets is made smaller than the thin film on the other side. .

FIG. 1 shows a partial sectional view of stacked sheets, and FIG. 2 shows a partial sectional view of crimped sheets. The same symbols are used.

In the figure, 1 is an unprinted sheet, 2 is a printed sheet, 3 is a thin film, and the thin film 3 formed on the sheet 2 is as follows:
The one on the bottom layer is the largest and gradually gets smaller as it gets closer to the pressure surface. Further, the centers of each thin film 3 are aligned in the vertical direction.

The sheets 1 and 2 are stacked as shown in FIG. 1, and the stacked sheets are pressurized on their upper surfaces to be pressed together.

The above manufacturing method is useful when the number of thin films formed on the sheet 2 is small. That is, even if the upper thin film 3 near the pressure surface is rolled significantly and extends in all directions during crimping, the thin film 3 located closer to the pressure surface of the stacked sheets is smaller than the thin film 3 on the other side. Therefore, as shown in FIG. 4, the cross-sectional widths W of the thin films 3 after pressure bonding are all the same, and the shapes are the same.

In other words, even when a laminate is obtained by cutting the sheet after pressure bonding as shown in FIG. 2, the thin film 3 of each layer and the cutting position (
Since the distance from the cut line to the dotted line position in the figure becomes equal, there is no part where the cut margin becomes excessive as in the conventional case, and the dead space can be reduced as much as possible.

[0022]

[Embodiment 2] FIGS. 3 and 4 show a second embodiment of the present invention. Similar to the first embodiment, the thin film located near the pressure side of the stacked sheets is removed from the other side. It is smaller than a thin film.

FIG. 3 shows a partial sectional view of the stacked sheets, and FIG. 4 shows a partial sectional view of the crimped sheets. The same symbols are used.

In the figure, 1 is an unprinted sheet, 2 is a printed sheet, 3 is a thin film, and the thin film 3 formed on the sheet 2 is as follows:
The two lower layers are larger and the two upper layers closer to the pressure surface are one size smaller than the lower layers. In other words, the thin film 3 gradually becomes smaller as it approaches the pressurizing surface. Further, the centers of each thin film 3 are aligned in the vertical direction.

The sheets 1 and 2 are stacked as shown in FIG. 1, and the stacked sheets are pressed together by applying pressure to their upper surfaces.

[0026] The above manufacturing method is similar to that in Example 1.
This is useful when the number of thin films formed on the sheet 2 is small. That is, even if the upper thin film 3 near the pressure surface is rolled significantly and extends in all directions during crimping, the thin film 3 located closer to the pressure surface of the stacked sheets is smaller than the thin film 3 on the other side. Therefore, as shown in FIG. 4, although two types of cross-sectional widths W1 and W2 are generated in the thin film 3 after pressure bonding, the shapes thereof are almost the same.

In other words, even when a laminate is obtained by cutting the sheet after pressure bonding as shown in FIG. 4, the thin film 3 of each layer and the cutting position (
Since the distances from the dotted line position in the figure are approximately equal, there is no excessive cut margin as in the conventional case, and the dead space can be reduced as much as possible.

[0028]

[Embodiment 3] FIGS. 5 and 6 show a third embodiment of the present invention, in which the thin film located closer to the pressure side of the stacked sheets is moved toward the center of the sheet than the thin film on the other side. It has been shifted to

FIG. 5 shows a partial sectional view of the stacked sheets, and FIG. 6 shows a partial sectional view of the crimped sheets. The same symbols are used.

In the figure, 1 is an unprinted sheet, 2 is a printed sheet, and 3 is a thin film. The two upper layers that are close together are slightly offset toward the center of the sheet than the lower layer. Further, the above-mentioned shift dimension is gradually increased as the distance from the center of the sheet increases, taking into consideration that the elongation during crimping is maximum at the peripheral edge portion.

The sheets 1 and 2 are stacked as shown in FIG. 1, and the stacked sheets are pressurized on their upper surfaces to be pressed together.

The above manufacturing method is useful when a thin film is formed in areas other than the center of the sheet. In other words, even if the upper thin film 3 near the pressure surface is rolled significantly and extends toward the periphery of the sheet during crimping, the thin film 3 located closer to the pressure surface of the stacked sheets is smaller than the thin film 3 on the other side. Since the thin film 3 is also shifted toward the center of the sheet, as shown in FIG. 6, although some variation occurs in the cross-sectional width of the thin film 3 after pressure bonding, deviation of the thin film 3 can be prevented compared to the conventional method.

That is, even when cutting the crimped sheet shown in FIG. 8 to obtain a laminate, the thin film 3 of each layer and the cutting position (
Since the left and right distances from the dotted line position in the figure are approximately equal, there is no part where the cut margin is excessive as in the conventional case.

[0034]

[Embodiment 4] FIGS. 7 and 8 show a fourth embodiment of the present invention, in which the thin film located near the pressure side of the stacked sheets is made smaller than the thin film on the other side. It is shifted toward the center of the sheet from the thin film on the front side.

FIG. 7 shows a partial sectional view of the stacked sheets, and FIG. 8 shows a partial sectional view of the crimped sheets. The same symbols are used.

In the figure, 1 is an unprinted sheet, 2 is a printed sheet, 3 is a thin film, and the thin film 3 formed on the sheet 2 is as follows:
The one on the bottom layer is the largest, and as it gets closer to the pressure surface, it gradually becomes smaller, and its center position is slightly shifted toward the center of the sheet as it gets closer to the pressure surface. Further, the above-mentioned shift dimension is gradually increased as the distance from the center of the sheet increases, taking into consideration that the elongation during crimping is maximum at the peripheral edge portion.

The sheets 1 and 2 are stacked as shown in FIG. 1, and the stacked sheets are pressed together by applying pressure to their upper surfaces.

The above manufacturing method is useful when a large number of thin films are formed on the sheet 2. That is, even if the upper thin film 3 near the pressure surface is rolled and extended in all directions during crimping, and also extends in the direction of the periphery of the sheet, the thin film 3 located closer to the pressure surface of the stacked sheets will be Since it is smaller than the thin film 3 on one side and is shifted toward the center of the sheet than the thin film 3 on the other side, each thin film 3 after pressure bonding has no bias as shown in FIG. 8, and its cross-sectional width W all match and the shapes are the same.

In other words, even when a laminate is obtained by cutting the sheet after pressure bonding as shown in FIG. 8, the thin film 3 of each layer and the cutting position (
Since the left and right distances from the dotted line position in the figure are equal, there is no part where the cut margin is excessive as in the conventional case, and the dead space can be reduced as much as possible.

[0040]

As described in detail above, according to the manufacturing method according to claims 1 and 3, even if the upper conductive material film near the pressing surface is rolled significantly during crimping, the conductive material after crimping is The membranes can be made into approximately similar shapes. Therefore,
By producing a multilayer capacitor using the above-mentioned multilayer body, it becomes possible to supply a multilayer capacitor that has a larger capacitance than conventional capacitors and has no variation in capacitance.

[Brief explanation of drawings]

FIG. 1 is a partial sectional view of stacked sheets showing a first embodiment.

[Figure 2] Partial cross-sectional view of the crimped sheet

FIG. 3 is a partial cross-sectional view of stacked sheets showing a second embodiment.

[Figure 4] Partial cross-sectional view of the crimped sheet

FIG. 5 is a partial cross-sectional view of stacked sheets showing the third embodiment.

[Figure 6] Partial sectional view of crimped sheet

FIG. 7 is a partial cross-sectional view of stacked sheets showing the fourth embodiment.

[Figure 8] Partial sectional view of crimped sheet

[Fig. 9] Side view of sheets before stacking, showing a conventional example

[Fig. 10] Partial cross-sectional view of stacked sheets

[Fig. 11] Partial cross-sectional view of the crimped sheet

[Figure 12] Partial sectional view of crimped sheet

[Explanation of symbols]

1, 2... Sheet, 3... Thin film.

Claims (3)

[Claims] Claim 1: After stacking a plurality of insulating sheets in which a large number of conductive material films of a predetermined shape are arranged side by side, pressure is applied to one side of the sheets to press the sheets together. , Seat after crimping
A method for producing a laminate in which sheets are cut, characterized in that the conductive material film located near the pressure side of the stacked sheets is made smaller than the conductive material film on the other side. A method for manufacturing a laminate. 2. After stacking a plurality of insulating sheets in which a large number of conductive material films of a predetermined shape are arranged side by side, pressure is applied to one side of the sheets to press the sheets together. , Seat after crimping
In a method for manufacturing a laminate in which sheets are cut, a conductive material film located closer to the pressure side of the stacked sheets is shifted toward the center of the sheet relative to a conductive material film on the other side. A method for manufacturing a laminate, characterized by the following. 3. After stacking a plurality of insulating sheets in which a large number of conductive material films of a predetermined shape are arranged side by side, pressure is applied to one side of the sheets to press the sheets together. , Seat after crimping
In a method for manufacturing a laminate in which sheets are cut, the conductive material film located near the pressure side of the stacked sheets is made smaller than the conductive material film on the other side. Shifted toward the center of the sheet from the conductive material film,
A method for manufacturing a laminate, characterized by: