JPH043109B2 - - Google Patents

Info

Publication number
JPH043109B2
JPH043109B2 JP60134571A JP13457185A JPH043109B2 JP H043109 B2 JPH043109 B2 JP H043109B2 JP 60134571 A JP60134571 A JP 60134571A JP 13457185 A JP13457185 A JP 13457185A JP H043109 B2 JPH043109 B2 JP H043109B2
Authority
JP
Japan
Prior art keywords
wafer
wafer ring
ring
storage
storage portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60134571A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61292336A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60134571A priority Critical patent/JPS61292336A/ja
Publication of JPS61292336A publication Critical patent/JPS61292336A/ja
Publication of JPH043109B2 publication Critical patent/JPH043109B2/ja
Granted legal-status Critical Current

Links

JP60134571A 1985-06-20 1985-06-20 ウエハ−保持装置 Granted JPS61292336A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60134571A JPS61292336A (ja) 1985-06-20 1985-06-20 ウエハ−保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60134571A JPS61292336A (ja) 1985-06-20 1985-06-20 ウエハ−保持装置

Publications (2)

Publication Number Publication Date
JPS61292336A JPS61292336A (ja) 1986-12-23
JPH043109B2 true JPH043109B2 (enEXAMPLES) 1992-01-22

Family

ID=15131453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60134571A Granted JPS61292336A (ja) 1985-06-20 1985-06-20 ウエハ−保持装置

Country Status (1)

Country Link
JP (1) JPS61292336A (enEXAMPLES)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108872260A (zh) * 2017-05-11 2018-11-23 无锡华润安盛科技有限公司 晶圆检测治具及晶圆检测装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169453A (en) * 1989-03-20 1992-12-08 Toyoko Kagaku Co., Ltd. Wafer supporting jig and a decompressed gas phase growth method using such a jig

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3976288A (en) * 1975-11-24 1976-08-24 Ibm Corporation Semiconductor wafer dicing fixture
JPS569976Y2 (enEXAMPLES) * 1976-12-13 1981-03-05
JPS5956742U (ja) * 1982-10-06 1984-04-13 ソニー株式会社 半導体素子取扱いリング

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108872260A (zh) * 2017-05-11 2018-11-23 无锡华润安盛科技有限公司 晶圆检测治具及晶圆检测装置
CN108872260B (zh) * 2017-05-11 2021-12-24 无锡华润安盛科技有限公司 晶圆检测治具及晶圆检测装置

Also Published As

Publication number Publication date
JPS61292336A (ja) 1986-12-23

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