JPH04310851A - Device for inspecting soldering appearance - Google Patents

Abstract

PURPOSE:To enable an inspection window generation position for packaging deviation to be compensated for and further a judgment error to be reduced by generating the inspection windows at both sides of the leads for allowing judgment to be made easily. CONSTITUTION:A lighting portion 4 emits an irradiation light 5 to a dimple 3 on a surface of parts, its reflection light 6 is picked up by a camera 7, and position coordinates are compensated for. Inspection windows are generated on the side surfaces of both sides of a lead, the reflection light by the lighting light from a lighting 15 is picked up by side cameras 18-21, and then a defect judgment is performed according to characteristics of light and shade within the window by a judging circuit 23.

Description

[Detailed description of the invention]

0001

[Industrial Field of Application] The present invention relates to a soldering appearance inspection device, in particular, a device for recognizing the mounting position of surface mount components mounted on a printed circuit board and generating an inspection window at an accurate position.
The present invention relates to a soldering appearance inspection device characterized by inspecting the appearance.

0002

[Prior Art] As a conventional technique, for example,
There is an inspection device as shown in Publication No.-10251. As shown in FIG. 5, this inspection device includes a printed circuit board 1
A ring-shaped illumination device 28 that illuminates the component 2 mounted above, a camera 29 that captures an image of reflected light,
It has a binarization circuit 30 that binarizes the output data of the camera 29, an area extraction circuit 31 that extracts a bright area of reflected light, and a determination circuit 32 that makes a pass/fail judgment from the output data of the area extraction circuit 31. ing.

The camera 29 captures the reflected light when the illumination device 28 irradiates the component 2 and converts the image data into a binarization circuit 3.
Output to 0. The binarization circuit 30 binarizes the image data. Here, if the soldered part is good, there are a few large and bright areas in the binarized image data, and if the soldered part is defective, the binarized image data is complicated and complicated. It is characterized by containing many small bright regions. Based on the above, the determination circuit 32 determines that the product is defective when the number of bright areas is large, and determines that the product is non-defective when the number of bright areas is small.

0004

[Problems to be Solved by the Invention] The above-mentioned conventional technology is based on SOP (Small Online Package).
When inspecting the soldering condition of a component whose leads extend in two directions, such as a component with leads extending in two directions, there is a drawback that if there is a mounting deviation in the lead direction within the acceptable quality standard, the inspection location will be shifted by that amount. Further, even when the soldered portion at the tip of the lead is a good product, the fillet shape is complex and the number of bright areas in the image data is sometimes greater than when it is a defective product, so there is a drawback that there are many errors in determining the quality.

[0005]

[Means for Solving the Problems] The soldering appearance inspection device of the present invention includes a memory section that stores coordinate data of surface-mounted components mounted on a printed circuit board, and a light that illuminates dimples on the body of the mounted component. , a camera that captures reflected light from the illumination, an A/D conversion circuit that converts analog grayscale signals of images captured by the camera into digital values, and data obtained from the A/D conversion circuit and the memory section. an arithmetic circuit that calculates the amount of mounting deviation from data; a mounting deviation judgment circuit that judges the quality of the mounting deviation; lighting that illuminates both sides of the lead; a side camera that captures light reflected by the lighting; - An A/D conversion circuit that converts the analog grayscale signal of the image captured by the camera into a digital value, and a pass/fail judgment circuit that compares the data obtained from the A/D conversion circuit with a pass/fail judgment standard to judge whether it is good or bad. It consists of:

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained in detail with reference to the drawings. FIG. 1 is a block diagram showing one embodiment of the present invention.

The soldering appearance inspection apparatus shown in FIG. 1 includes a position recognition illumination section 4 that illuminates the dimples 3 on the body of the mounted component 2, and a camera 7 that takes in reflected light 6 obtained from the illumination light 5 of the illumination section 4. and an A/D conversion circuit 8 that converts image data b, which is the output of the camera 7, into digital values.
The mounting position data memory 9 stores the output data of the A/D conversion circuit 8, and the mounting position data c stored in the position data memory 9 and the coordinate data a stored in the coordinate data storage memory 10 are compared. The amount of deviation dx of the mounting position,
A mounting deviation calculation circuit 11 that calculates dy, a mounting deviation quality determination circuit 12 that compares the deviation amount dx, dy with the maximum allowable deviation amount for a non-defective product, and an illumination unit that irradiates illumination light to both sides of the lead. 15, side cameras 18 to 21 that capture reflected light obtained by the illumination light, an A/D conversion circuit 22 that converts image data e to h output from the cameras 18 to 21 into digital values, and mounted components. generates inspection windows on both sides of the leads of the A/D conversion circuit 22.
The soldering part quality determination circuit 23 performs quality determination based on the output data i and ii of the soldering part.

[0008] Position recognition illumination unit 4 installed almost directly above
irradiates the dimple 3 with illumination light 5, and the camera 7 captures an image of the reflected light 8. An A/D conversion circuit 8 converts image data b, which is the output of the camera 7, into digital data and stores it in a mounting position data memory 9. Next, as shown in FIG. 2, the mounting deviation calculation circuit 11 compares the mounting position data c stored in the position data memory 9 with the coordinate data a stored in the coordinate data storage memory 10 to determine the mounting position. Calculate the amount of deviation dx, dy. The mounting deviation quality determination circuit 12 compares the deviation amounts dx and dy with the maximum value of the deviation amount that can be accepted as a non-defective product.
Determine whether or not there is any mounting misalignment.

If the determination circuit 12 determines that the product is good, the results shown in FIGS.
Generate inspection windows on both sides of the lead as in A ring-shaped illumination section 15 having the same height and the same axis as the position recognition illumination section 4 and having a large diameter irradiates oblique illumination lights 13 and 14 on both sides of the lead as shown in FIG. 3(a). Here, if the soldered part is good, the strong reflected light 16,1
7 returns to the side cameras 18 and 19, but if the soldered part is defective, the reflected light 1 will return as shown in FIGS. 4(a) and 4(b).
6 and 17 are diffusely reflected and only weak light returns to the side cameras 18 and 19. Therefore, if the soldered parts are in good condition, the A/D conversion circuit 22 is connected to the side camera 18,
The output data i, ii after converting the image data e, f, which is the output of step 19, into digital values becomes a relatively large value, and in the case of a defective product, it becomes a relatively small value.

For example, the soldered part quality determination circuit 23 determines that if the sum of the digital output data i and ii within the inspection window is larger than a preset threshold value, it is a "good product"; If so, it is determined that the product is “defective”.

[0011]

[Effects of the Invention] The soldering appearance inspection device of the present invention includes a function of recognizing the amount of mounting deviation based on the coordinate data of the dimples on the body of the mounted component, and therefore generates an inspection window at an accurate position. have an effect. Furthermore, since inspection windows are generated on the side surfaces on both sides of the lead instead of the fillet portion at the tip of the lead, it is possible to easily judge whether the soldering condition is good or bad and improve the defect detection rate.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing one embodiment of the present invention.

FIG. 2 is a top view showing the principle of mounting deviation recognition.

FIGS. 3(a) and 3(b) are a front view and a side view showing the state of reflected light when the soldered part is non-defective.

FIGS. 4(a) and 4(b) are a front view and a side view showing the state of reflected light when the soldered part is a defective product.

FIG. 5 is a block diagram showing a conventional example.

[Explanation of symbols]

1 Board 2 Mounted component 3 Dimple 4 Position recognition illumination section 5, 13, 14 Illumination light 6, 16, 17 Reflected light 7, 29 Camera 8, 22 A/D conversion circuit 9 Mounting position data memory 10 Coordinate data storage memory 11 Mounting deviation amount calculation circuit 12 Mounting deviation quality judgment circuit 15 Soldering section illumination section 18, 19, 20, 21 Side camera 23
Soldered part quality judgment circuit 24 Lead 25 Pad 26 Inspection window 27 Solder 28 Ring-shaped illumination device 30 Binarization circuit 31 Area extraction circuit 32 Judgment circuit a Coordinate data b, e, f, g, h Image data c Mounting position data dx, dy Mounting position deviation amount i, ii Digital data

Claims (3)

[Claims] 1. A memory unit that stores coordinate data of a surface mount component mounted on a printed circuit board, a light that illuminates a dimple on a body of the mounted component, a camera that captures light reflected by the light, and a camera that captures light reflected from the light. An A/D conversion circuit that converts the analog grayscale signal of the captured image into a digital value, an arithmetic circuit that calculates the mounting deviation amount from the data obtained from the A/D conversion circuit and the data in the memory section, and the mounting deviation. a mounting deviation pass/fail judgment circuit for judging the pass/fail of the
a side camera that captures light reflected by the illumination; an A/D conversion circuit that converts analog grayscale signals of images captured by the side camera into digital values; 1. A soldering appearance inspection device comprising a pass/fail judgment circuit that compares data obtained from a D conversion circuit with a pass/fail judgment standard to judge pass/fail. [Claim 2] IC mounted on a printed circuit board
An illumination device that irradiates illumination light onto the dimples of the body, a camera that captures the reflected light, a recognition device that recognizes a mounting position based on image data from the camera, and an inspection window that is generated at an accurate position by the recognition device. 1. A soldering appearance inspection device comprising a generating means. 3. An illumination device that irradiates the side surface of a lead of a surface-mounted component on a printed circuit board, a camera that captures an image of the reflected light, and an inspection window that generates an inspection window on the side surface of the lead and an image within the window. 1. A soldering appearance inspection apparatus comprising: a quality determination means for determining quality based on data.