JPH043098B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing metallized film capacitors used in electronic and electrical equipment.

BACKGROUND ART In recent years, with the development of electronic and electrical equipment, electronic parts have come to be used in large quantities, and there is a strong market demand for lower unit prices of passive parts, such as capacitors and resistors.

Metalized film capacitors use ultra-thin films to increase capacitance and reduce size. Since an ultra-thin film is used, care must be taken during manufacturing and precision work is required.
Also, in the manufacturing process of metallized film capacitors, there is a step in which metal is vapor-deposited onto the film (vapor deposition includes sputtering, ion plating, etc.) while forming a non-evaporation area (hereinafter referred to as vapor deposition margin). , cutting the metallized film, winding the metallized film, or laminating it in the case of a multilayer metallized film capacitor, and providing a dielectric on the surface of the metallized film when using a composite film. The process requires great precision, especially in the film width direction, and requires film position control.

Hereinafter, conventional techniques will be explained using drawings.

FIG. 8 is a sectional view showing the structure of a conventional example in which a double-sided metallized film is used. Reference numeral 11 is a double-sided metallized film in which a vapor deposition margin portion 14 is provided and both sides are metallized, and 12 is a non-metalized film (referred to as a laminated film). In this conventional example, the width of the laminated film 12 must be smaller than the width of the double-sided metallized film 11 in order to allow the sprayed metal to enter the gap between the films and connect it to the vapor deposition electrode 13. In addition, the invading sprayed metal
In order to avoid contact with the opposing vapor deposition electrode 13, it must be larger than the facing width A of the vapor deposition electrode 13. Therefore, in this conventional example, it is necessary to control the amount of protrusion of the double-sided metallized film 11 from the laminated film 12. If the winding speed is increased, it is difficult to control the film position, the film meanderes, and it is difficult to maintain stable running. As a result, short circuits and non-connections between the sprayed metal and the vapor deposition electrode occur, resulting in a decrease in yield. Therefore, it can be said that this conventional example is not suitable for mass production.

Next, FIG. 9 is a sectional view showing the structure of a conventional example in which a single-sided metallized film 15 is used. 9th
In the figure, one-sided metallized film 1 is used as well as the example in Figure 8.
It is necessary to control the amount of 5. Therefore, it can be said that it is not suitable for mass production.

Next, a conventional example of a type in which a composite film in which a dielectric material is formed on both sides of a double-sided metallized film 11 is laminated will be described. FIG. 10 is a sectional view showing this type of configuration. 16 is a dielectric film formed by a coating method. In this example, the sprayed metal is infiltrated into the gap between the films to form the vapor deposited electrode 13.
A non-coated portion 17 is formed on the dielectric film 16 in order to connect with the dielectric film 16.
(hereinafter referred to as coat margin) is required. If coating is performed at high speed to increase mass production, the coating margin will easily shift and the connection between the sprayed metal and the vapor deposited electrode 13 will be lost, causing the risk of losing its function as a capacitor or short-circuiting. This is a serious problem. In the metallized film capacitor of this example type, a dielectric film 16 is formed by a coating method on a double-sided metallized film 11 on which a large number of vapor deposition margins are formed as shown in FIG. It is a manufacturing method with high mass productivity because it can be manufactured by cutting, and many pieces can be produced at the same time. but,
Regarding the position control of the coat margin, the same accuracy as the film position control in the examples shown in Figures 8 and 9 is required, and in the case of meandering, the yield will be extremely low due to simultaneous production of many pieces. Contains the risk of

Problems to be Solved by the Invention As described above, metallized film capacitors cannot be wound at high speeds or coated at high speeds due to problems in film position control or coat margin position control. As a result, mass production efficiency is low, and labor costs account for a high proportion of costs, resulting in higher unit prices than ceramic capacitors and aluminum electrolytic capacitors.Therefore, a manufacturing method with high mass productivity is desired. Ta.

In view of the above problems, it is an object of the present invention to provide a method for manufacturing a small, low-cost metallized film capacitor that can be wound or coated at a higher speed than before, has high mass productivity, and is low in cost. .

Means for Solving the Problems In order to achieve the above object, the method for manufacturing a metallized film capacitor of the present invention includes a method of manufacturing a metallized film capacitor in which a metallized film and a dielectric film or a non-metalized film are overlapped and wound or laminated. After that, the end portion where the electrode lead layer is formed is etched to expose the vapor-deposited electrode at the edge of the film.

Effect: A wound type metallized film capacitor produced by the method of manufacturing a metallized film capacitor of the present invention can be produced by:
Since high precision is no longer required for film position control, it is possible to wind the film at high speed and increase mass productivity. In addition, for laminated or wound type metallized film capacitors that require a coating margin during coating, the coating margin is not required and the entire surface can be coated.
Coat margin position control is no longer necessary, coating can be performed at high speed, and mass productivity can be increased.

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Embodiment 1 FIGS. 1a and 1b are cross-sectional views showing an example of the main steps of a wound type double-sided metallized film capacitor of the present invention. 1 is a double-sided metallized film in which aluminum is vapor-deposited on both sides on a polyethylene terephthalate film, 2 is a polycarbonate laminated film, 3 is an electrode formed by aluminum vapor deposition, 4 is a vapor deposition margin, and 5 is an electrode lead-out layer formed by metal spraying. This is the end of the FIG. 2a shows a cross-sectional view of the main part after being rolled up and heated and pressed into a flat shape. After flattening, the end portion 5 to be metal sprayed was immersed in trichlorethylene and etched to a depth necessary to obtain the amount of protrusion of the double-sided metallized film 1. The state after etching is shown in FIGS. 1b and 2b. The amount of protrusion of the double-sided metallized film 1 formed by etching is not so large that the invading sprayed metal comes into contact with the opposing electrode when metal is sprayed on the edge of the film, and the adhesion strength between the sprayed metal and the film is low. It was large enough to hold. After etching,
A capacitor element was made by spraying zinc.

The element characteristics and reliability of the double-sided metalized film capacitor obtained as described above are not inferior to those of the double-sided metalized film capacitor shown in FIG. 8 described in the conventional example. , showed excellent properties. The materials used in this embodiment are as described above, but the materials are not limited thereto.
For example, the manufacturing method of the present invention can be carried out and the effect obtained by using a polypropylene film with zinc vapor-deposited on both sides as the material for the double-sided metallized film, a polystyrene film as the laminated film, and toluene as the etching solvent. be able to. In the case of this example, the base film of the double-sided metallized film is insoluble in the etching solvent;
In addition, it is only necessary that the laminated film is soluble in the etching solvent. Further, the same effect can be obtained even if the laminated film is a composite film in which a material soluble in the solvent used for etching is formed on at least one side.

Embodiment 2 FIGS. 3a and 3b are cross-sectional views showing an example of the main steps of a metallized film capacitor of the present invention of a type in which double-sided metallized films with dielectric films provided on both sides are laminated, and FIG. a and b are perspective views. 6 is a polycarbonate film as a dielectric film formed by a coating method. First, as shown in FIG. 5, a polycarbonate film 6 is applied all over the entire surface of a wide double-sided metallized film 1 having a large number of vapor deposition margins, and the film is laminated with the wide width maintained. Cut with. After cutting, the end portion 5 to be metal sprayed is immersed in trichlorethylene to a depth necessary to obtain the amount of protrusion of the double-sided metal film 1, and the state after etching is shown in FIGS. 3b and 4b. .
The amount of protrusion of the double-sided metallized film 1 formed by etching is not so large that the invading sprayed metal comes into contact with the opposing electrode when metal spraying is applied to the edge of the film, and the adhesion strength between the sprayed metal and the film is low. It was large enough to hold. After etching, zinc was sprayed to form a capacitor element.

The element characteristics and reliability of the double-sided metallized film capacitor obtained as described above show no inferiority in comparison with those of the double-sided metalized film capacitor shown in FIG. 10 described in the conventional example. ,
It showed excellent properties. In the case of this embodiment as well, the materials are not limited to those mentioned above; the base film of the double-sided metalized film is insoluble in the etching solvent, and the dielectric films formed on both sides of the double-sided metalized film are etched. It is sufficient if it is soluble in the solvent used. Further, the dielectric film may be formed only on one side of the double-sided metallized film.

Example 3 In both Examples 1 and 2, a double-sided metallized film capacitor was described, but the present invention can also be practiced with a single-sided metalized film. As shown in FIG. 6, the film 2 may be sandwiched between two metalized films 7 on one side. In the case of this embodiment, the material of the base film of the single-sided metalized film 7 is insoluble in the solvent used for etching, and the material of the base film of the single-sided metalized film 7 is insoluble in the solvent used for etching, and
It is sufficient if it is soluble in the solvent used for etching.
Further, the present invention can also be practiced with a structure in which a dielectric layer 6 is provided on at least one side of the single-sided metallized film 7 as shown in FIGS. 7a and 7b. In the example of FIG. 7 as well, it is sufficient that the material of the base film of the single-sided metallized film 7 is insoluble in the solvent used for etching, and the material of the dielectric layer provided on at least one side is soluble in the solvent used for etching.

Effects of the Invention As described above, the present invention is characterized in that by etching the edge of the dielectric or non-metalized film formed on at least one side of the metalized film, the deposited electrode is exposed and brought into contact with the electrode lead layer. Therefore, in the case of wound type metallized film capacitors, particularly high precision is not required for position control of the film to be wound, so high-speed winding is possible, improving yield and increasing mass production. become. In addition, for laminated or wound type metallized film capacitors that require a coating margin on a wide film, a coating margin is no longer required and the entire surface can be coated, eliminating the need for precise coating margin positioning and allowing high-speed processing. Can be coated,
Mass productivity can be increased. As described above, the present invention makes it possible to improve the yield of metallized film capacitors and increase mass productivity, which brings great industrial and social effects.

[Brief explanation of drawings]

1A and 1B are cross-sectional views showing the main steps in the manufacturing method of a metallized film capacitor according to the first embodiment of the present invention, FIGS. 2A and 2B are perspective views of the same, and FIGS. 3A and 3B are A sectional view showing the main steps in a method for manufacturing a laminated metallized film capacitor according to a second embodiment of the present invention, FIGS. 4a and 4b are perspective views, and FIG. 5 is a metallization used in the embodiment 6a, b and 7a, b are respectively sectional views showing main steps in the third embodiment of the present invention, and FIGS. 8 to 10 are perspective views showing the conventional metal film. FIG. 11 is a cross-sectional view showing the structure of a metallized film capacitor, and FIG. 11 is a perspective view showing an example of a composite film used in a conventional laminated metallized film capacitor. 1... Double-sided metallized film, 2... Laminated film, 3... Vapor deposition electrode, 4... Vapor deposition margin part,
5... End portion of film to be metal sprayed, 6... Dielectric film, 7... One side metallized film.

Claims (1)

[Scope of Claims] 1. A metallized film and a dielectric film or a non-metalized film disposed on at least one side of this film are overlapped and wound or laminated, and an electrode extraction layer is provided at the end thereof. The device is constructed by etching a portion of the dielectric film or the non-metalized film where the electrode extraction layer is formed to expose the vapor-deposited electrode of the metalized film at the edge of the metalized film. A method for manufacturing a metallized film capacitor. 2. The metallized film capacitor according to claim 1, wherein the films to be wound or laminated have substantially the same width and are wound or laminated without substantially shifting the films in the width direction. manufacturing method.