JPH04309483A - Laser beam machine - Google Patents

Abstract

PURPOSE:To allow laser beam machining which selectively uses profiling devices according to the material quality of a work to be machined. CONSTITUTION:The contact type profiling device 13 and the non-contact type profiling device 14 are provided in the laser beam machine 1. A machining condition file memory 33 in which the profiling conditions ND corresponding to the material quality of the work 19 are stored is provided. A machining control section 26 which reads out and outputs the profiling conditions ND is provided. A profiling device selection control section 30 which selectively uses these profiling devices by receiving the output from the machining control section 26 is provided. Since the machine is constituted in such a manner, either of the 1st profiling means and the 2nd profiling means is selectively used in correspondence to the work to be machined at the time of executing the laser beam machining using the profiling devices and, therefore, the laser beam machining which does not require the operation for remounting the profiling device according to the work to be machined is executed.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing machine capable of cutting a workpiece into an accurate shape.

0002

[Prior Art] Conventionally, when cutting a workpiece using a copying device using a laser processing machine, if the material of the workpiece is aluminum or the like, capacitance is used to prevent scratches on the surface. A type of non-contact copying device was used, and in the case of non-conductor materials such as wood, a contact type copying device was used. That is, the contact type copying device and the non-contact type copying device are used and reinstalled depending on the material of the workpiece to be machined.

0003

[Problem to be solved by the invention] However, with this method, it is necessary to reinstall the copying device every time the material of the workpiece to be machined changes, and this labor-intensive work reduces productivity. , Also, it was not possible to automate the change in material of the laser-processed workpiece.

SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, an object of the present invention is to provide a laser processing machine that can perform laser processing by automatically selecting and using a copying device depending on the material of the workpiece to be processed.

[0005]

[Means for Solving the Problems] That is, the present invention has a workpiece support means (3) that supports a workpiece (19), and focuses a laser beam (17) at a predetermined focal length (FL). In the laser processing machine (1), the means (12) is provided so as to be movably driven in a direction perpendicular to the processing surface (19a) of the workpiece (19) supported by the workpiece support means (3). ) A first copying means (13) is provided that performs a copying operation by contacting the processing surface (19a), and a second copying means (13) is provided that performs a copying operation without contacting the processing surface (19a) of the workpiece (19). a first memory provided with a copying means (14) and storing copying means selection information (ND) instructing to use one of the first copying means (13) and the second copying means (14); Means (25
, 33), read out the copying means selection information (ND), and based on the read copying means selection information (ND),
These first copying means (13) and second copying means (1
4) is provided with copying device selection control means (26, 30) for selecting and using one of them.

[0006] The numbers in parentheses are for convenience to indicate corresponding elements in the drawings, and therefore, the present description is not limited to the descriptions in the drawings. The same applies to the "effect" column below.

[0007]

[Operation] With the above-described configuration, the present invention enables the first tracing means (13) and the second tracing means (13) to be used during laser processing.
14) to select and use one of the first copying means (13) and the second copying means (14) based on the copying means selection information (ND) instructing to use one of them. do.

[0008]

Embodiments Hereinafter, embodiments of the present invention will be explained based on the drawings. 1 is a perspective view showing an embodiment of the laser processing machine according to the present invention, FIG. 2 is an enlarged view of the vicinity of the processing torch of the laser processing machine shown in FIG. 1, and FIG. 3 is a perspective view of the laser processing machine shown in FIG. A control block diagram of the installed processing control device, FIG. 4 is a diagram showing an example of a flowchart of laser processing, FIG. 5 is a schematic diagram showing an example of a processing condition file, and FIG. 6 is a diagram showing an example of a processing program. , FIG. 7 is a diagram showing an example of a correspondence table.

As shown in FIG. 1, the laser processing machine 1 according to the present invention has a bed 2 which is a base in the shape of a combination of box shapes. A thin box-shaped table 3 with a workpiece mounting surface 3a formed thereon.
is supported so as to be movable in the X-axis direction (directions of arrows A and B). Further, the bed 2 is provided with a column 5 formed in a box shape so as to straddle above the table 3 so that the table 3 can move below it (in the direction of arrow F).
A control panel 6 consisting of an operation panel such as a display and switches is mounted on the front surface (in the direction of arrow D). A saddle 7 is supported on the side surface of the column 5 (on the side in the direction of arrow A) so as to be movable in the Y-axis direction (in the direction of arrows C and D).
A processing head 9 is supported by the saddle 7 so as to be movable in the Z-axis direction (arrows E and F directions). In the processing head 9,
A laser beam transmission device 10 is provided to connect a laser oscillator 11 housed in a column 5 and a processing head 9, and a processing torch 12 is provided at the lower end of the processing head 9. As shown in FIG. 2, the processing torch 12 has a cylindrical torch body 12b.
A laser exit port 12a is provided in the lower part of b so as to face downward (in the direction of arrow F), that is, toward the workpiece 19 on the table 3. Further, in the torch body 12b, a condensing lens 12c directs the laser beam 17 transmitted from the laser oscillator 11 into the torch body 12b via the laser beam transmission device 10 downward ( It is mounted on the workpiece 19 side in the direction of arrow F) in such a manner that it condenses light at a predetermined focal length FL.

[0010] In normal laser machining, piercing and cutting operations are performed with the focal position of the laser beam 17 set at a predetermined position relative to the workpiece surface. Therefore, as shown in FIG. 2, the processing torch 12 is raised and lowered in the Z-axis direction (arrows E and F directions) according to the warpage (unevenness) of the processing surface 19a of the workpiece 19, and the laser emission distance R is adjusted.
It has a contact type copying device 13 and a non-contact type copying device 14 that can maintain L at a predetermined value. These two types of copying devices are used depending on the material of the workpiece to be machined. First, the contact type copying device 13 has a main body 15 fixed to the saddle 7, and a contactor 16 is provided on the main body 15 so as to be movable in the Z-axis direction (in the direction of arrows E and F). There is. A ring-shaped contact portion 16a is provided at the tip of the contactor 16 in such a way that the laser exit port 12a of the processing torch 12 can be inserted from above in the figure, and the contact portion 16a is connected to the processing surface 19a of the workpiece 19 and the laser exit port. Laser emission distance RL with 12a
is detected by a change in electrical resistance that is proportional to the distance the contactor 16 moves. For example, while moving a warped workpiece 19 in the direction of arrow B, which is to the right in the figure, the processing torch 12
When cutting with the laser beam 17 emitted from the laser exit port 12a, the contact 16 is lowered to bring the contact portion 16a into contact with the processing surface 19a, and the vertical movement of the processing area of the workpiece 19 (arrows E, F) contactor 16 in a form that follows the direction)
be installed so that they move in the same direction. Then, the contact type copying device 13 detects the laser emission distance RL from the vertical movement amount of the contactor 16, and the copying device selection control section 30, which will be described later, calculates the correction amount. Then, the copying device selection control section 30 feeds back the correction amount to the axis control section 27, which will be described later.
Based on the correction amount fed back from zero, the processing torch 12 is driven and controlled to move up and down in the Z-axis direction (arrows E and F directions). Therefore, the laser emission distance RL from the laser emission port 12a of the processing torch 12 to the processing area of the workpiece 19 can be maintained constant during processing. Furthermore, when the contact type copying device 13 is not used, as shown by the two-dot chain line in the figure, by holding the contactor 16 in the raised position, the contact between the machining surface 19a of the workpiece 19 and the contact portion 16a is maintained. can be avoided. Next, the non-contact copying device 1
4 is provided at the lower part of the processing torch 12, and the laser emission distance RL between the processing surface 19a of the workpiece 19 and the laser emission port 12a is detected by the value of the capacitance therebetween. Therefore, when cutting a warped workpiece 19 as in the above example, the workpiece 19 must be moved vertically (arrow E).
, F direction) with the workpiece 19 and the non-contact copying device 1.
4 changes, and the processing torch 12 is driven and controlled to move up and down in the Z-axis direction (arrows E and F direction) based on the amount of change, so that the laser exit of the processing torch 12 The laser emission distance RL from 12a to the processing portion of the workpiece 19 can be maintained constant during processing.

By the way, the laser processing machine 1 is equipped with a processing control device 20 as shown in FIG. 1, and the processing control device 20 has a main control section 21 as shown in FIG. There is. The main control section 21 is connected via a bus line 22 to an input section 23 such as a keyboard, a system program memory 24, a machining program memory 25, a buffer memory 28, a machining condition file memory 33, a machining control section 26, and a copying device selection control section 30. , an axis control section 27, a laser oscillation control section 29, etc. are connected thereto. In the copying device selection control section 30, the contact copying device 13 and the non-contact copying device 14 selectively use either the contact copying device 13 or the non-contact copying device 14, 27 so as to be able to output a feedback signal. Further, a drive motor 39 is connected to the axis control unit 27 in a manner that drives the table 3 to move in the X-axis direction (directions of arrows A and B in FIG. 1), and an encoder 39a is connected to the drive motor 39. It is provided to feed back the amount of rotation angle of the drive motor 39 to the shaft control section 27. Further, a drive motor 36 is connected to the axis control unit 27 in a manner that drives the saddle 7 to move in the Y-axis direction (in the direction of arrows C and D in FIG. 1).
The drive motor 36 is provided with an encoder 36 a that feeds back the amount of rotation angle of the drive motor 36 to the shaft control section 27 . Further, in the axis control unit 27, a drive motor 37 moves the processing head 9 in the Z-axis direction (arrow E in FIG.
, F directions), and the drive motor 37 is provided with an encoder 37a that feeds back the amount of rotation angle of the drive motor 37 to the shaft control unit 27. The laser oscillator 11 is connected to the laser oscillation control unit 29 via the laser beam transmission device 10 from the laser oscillator 11 to the laser emission port 12a.
The laser output etc. emitted from the laser beam are controlled.

By the way, as shown in FIG. 7, the processing condition file memory 33 of the processing control device 20 shown in FIG.
The correspondence relationship between the plate type number KN and plate type code WK for each plate type of the workpiece, and the plate thickness number TN and plate thickness code WT for each plate thickness of the workpiece, which are required when setting the processing conditions described later. A correspondence table TBL indicating the correspondence relationship between the two is stored. In other words, the correspondence table TBL is the same as the sheet type correspondence table KTB and the sheet thickness correspondence table TT.
In the plate type correspondence table KTB,
Plate type numbers KN from "1" to "32" are stored. For example, for plate type number KN "1", mild steel (cold steel)
"SPCC" representing "SPCC" is stored as the corresponding plate type code WK. Furthermore, for plate type number KN "2", "SPHC" representing mild steel (hot) is stored as the corresponding plate type code WK, and for plate type number KN "3", , "AL" representing aluminum is stored as the corresponding plate type code WK. On the other hand, the sheet thickness correspondence table T in the lower part of Fig. 7 of the sheet type correspondence table KTB
In TB, plate thickness numbers TN from “1” to “12” are stored. For example, for plate thickness number TN “1”, “0.6 mm” is stored as the corresponding plate thickness code WT. ing. Furthermore, for the plate thickness number TN “2”, “0.8 mm” is stored as the corresponding plate thickness code WT, and for the plate thickness number TN “4”, “1.2” is stored as the corresponding plate thickness code WT.
mm" is stored as the corresponding plate thickness code WT. Furthermore, in the machining condition file memory 33 of the machining control device 20 shown in FIG. ) and plate thickness (0
．． 6mm, 0.8mm, 1.2mm, etc.) and are stored with a unique address ADR attached to each. Hereinafter, as an example of the processing condition file PCF, a processing condition file PCF relating to a workpiece having a plate type of mild steel (cold) and a plate thickness of 1.2 mm will be described, but the same applies to other processing condition files PCF. That is, as shown in FIG. 5, the processing condition file PCF for a workpiece whose plate type is mild steel (cold) and plate thickness is 1.2 mm has an address ADR of "SPCC1.2", and the processing conditions The file PCF is composed of a copying condition table NT, a piercing condition table PT, and a cutting condition table CT. First, in the copying condition table NT, the relevant work (i.e.,
The contact type copying device 13 is the most suitable copying device when copying a 1.2 mm thick mild steel (cold) workpiece.
A copying condition ND for selecting which copying device 14 or the non-contact copying device 14 to use is stored. That is, in the digit of "non-contact copying" in the copying condition table NT, "on" is stored as non-contact copying ND1, which is the information for selecting the copying device. Therefore, the non-contact copying device 14 is used as a copying device.
is used and the contact type copying device 13 is not used,
It has been shown that the laser processing machine 1 can properly copy the workpiece (a 1.2 mm thick mild steel (cold) workpiece). Note that if "off" is stored as ND1, contact copying device 1 is used as the copying device.
3 is used and the non-contact copying device 14 is not used. Next, the piercing condition table PT stores optimal piercing conditions PD when performing a piercing operation on the work. That is, in the piercing condition table PT, "
The laser output value PD1 is ``50'' in the digit of ``Output (W)''.
0" is the laser frequency PD in the "Frequency (Hz)" digit.
2 is "1000", and the "Duty (%)" digit is "PD3" which is the ratio of pulse width to pulse period.
20", but the "gas type" digit indicates the assist gas type PD.
4 is "Oxygen", the "Gas pressure (kg/cm2)" digit shows "2.0" as assist gas pressure PD5, and the "Dwell (s)" digit shows the piercing completion waiting time. "1.0" is stored as PD6. Therefore, when a laser beam with an output of 500 W, a frequency of 1000 Hz, and a duty of 20% is irradiated with oxygen at a pressure of 2.0 kg/cm2 for 1.0 seconds, the laser processing machine 1 This shows that it is possible to perform an appropriate piercing operation on the workpiece (in between). The cutting condition table CT is composed of multiple lines of cutting condition steps CS, and in each cutting condition step CS, "speed (mm/min)"
"5000", "4500", ..., "500" in the digits of
etc. are stored as the workpiece cutting speed WCS, and in addition, on the right side of the figure of the workpiece cutting speed WCS in the same row, the optimum value for cutting the workpiece at the workpiece cutting speed WCS is stored. Cutting conditions CD are stored. For example, in the first row where "5000" is stored as the workpiece cutting speed WCS in the "Speed (mm/min)" digit,
In the cutting condition step CS1, "1000" is set as the laser output value CD1 in the "output (W)" digit, and "frequency (H
z)" digit shows "1000" as the laser frequency CD2, "Duty (%)" digit shows "100" as the duty CD3, and "Gas type" digit shows "oxygen" as the assist gas type CD4. , Furthermore, “Gas pressure (kg/cm
In the digit of ``2)'', enter the assist gas pressure CD5 as ``2.0''.
” are stored respectively. Therefore, the workpiece (
1.2mm thick mild steel (cold) work) to 5000mm
When cutting at a speed of /min, a laser beam with an output of 1000 W and a frequency of 1000 Hz is applied at a pressure of 2.0 kg/cm2.
It has been shown that the laser processing machine 1 is able to properly cut the workpiece when irradiated with oxygen. This means that a value other than "5000" (e.g. "4500", "5000"
The same applies to the cutting condition step CS in which "00") is stored.

Since the laser processing machine 1 has the above-mentioned configuration, when processing a plate-shaped workpiece using the laser processing machine 1, an operator places the workpiece to be processed using the laser beam shown in FIG. It is placed on the workpiece mounting surface 3a of the table 3 of the processing machine 1, and in that state, via the input section 23 shown in FIG.
Enter the workpiece number WNO (for example, "O 0001") corresponding to the workpiece to be machined, the plate type number KN and plate thickness number TN corresponding to the plate type and plate thickness of the workpiece to be machined, and then 21 to start machining. Then, the main control unit 21 reads the work sequence program OSP composed of a plurality of steps S shown in FIG. 4 from the system program memory 24, and proceeds with the work based on the work sequence program OSP.

First, as step S1 of the work sequence program OSP, the main control section 21 starts the original machining program PRO corresponding to the input workpiece number WNO.
is read from the machining program memory 25, and the read original machining program PRO is edited into an editing machining program PRG corresponding to the plate type and thickness of the workpiece using the input plate type number KN and plate thickness number TN as parameters. do.

That is, the edited machining program PRG loaded with the plate type number KN and plate thickness number TN of the workpiece to be machined is composed of a plurality of machining steps PS, as shown in FIG. 6, for example. In the first processing step PS1 at the top of the figure, the editing processing program PRG
``O 0001'' is stored as a unique work number WNO. "G22I1J4" is stored as a machining condition selection command PCC in the second machining step PS2 immediately below the first machining step PS1, and "G22" in the machining condition selection command PCC "G22I1J4" is
This means that the second machining step PS2 is a step for instructing selection of machining conditions. Also, the number following the I code is the board type number KN input above, and is "1".
As already mentioned, the plate type number KN corresponds to the plate type code WK, "SPCC", which represents mild steel (cold), in the plate type correspondence table KTB in the correspondence table TBL shown in Figure 7. Therefore, the plate type of the workpiece to be machined is mild steel (cold work).
It means that. Furthermore, the number following the J code is
The input plate thickness number TN, which is “4”, corresponds to the plate thickness correspondence table TT in the correspondence table TBL shown in FIG.
In B, since it corresponds to the plate thickness code WT of "1.2 mm", the plate thickness of the workpiece to be machined is 1.2 m.
It means m.

Furthermore, the editing processing program PR shown in FIG.
Below the second machining step PS2 during G, the fourth machining step PS4, which is the fourth stage from the top, has a Z-axis copying ON command NC.
Since "M32" is stored as C, the fourth machining step PS4 creates the corresponding machining condition file PCF based on the plate type number KN and plate thickness number TN instructed in the second machining step PS2. Read the data in the copying condition table NT of the read machining condition file PCF as the copying condition ND, and select the appropriate copying device corresponding to the material of the workpiece to be machined based on the read copying condition ND. It instructs to select and perform a copying operation.

A piercing command block PCB starting from the fifth processing step PS5, which is the fifth row from the top, is stored below the fourth processing step PS4. The fifth processing step PS5 at the top of the piercing command block PCB contains "G76" as the piercing command PLC.
is stored, the fifth processing step PS
5 reads the corresponding machining condition file PCF based on the plate type number KN and plate thickness number TN instructed in the second machining step PS2, and reads the corresponding machining condition file PCF in the piercing condition table PT of the read machining condition file PCF. Each value is read as a piercing condition PD, and a piercing operation is instructed to be performed based on the read piercing condition PD. Further, below the piercing command block PCB, a cutting command block CCB starting from the eighth processing step PS8 in the eighth row from the top is stored, for example, the eighth processing step PS8 in the uppermost row in the cutting command block CCB. "G01X60Y0" is specified as the cutting command CUC.
F5000" is stored. The cutting command CUC “G
"G01" in "01X60Y0F5000" means linear interpolation operation, the numbers following the X code and Y code represent the X and Y coordinates of the end point of the linear interpolation, respectively, and the number following the F code represents the cutting of the workpiece. It represents the speed WCS. Therefore, the eighth processing step PS8 instructs linear interpolation to be performed at a cutting speed of 5000 mm/min to a point 60 mm away from the predetermined program origin in the X-axis direction. In addition, the eighth processing step PS
A plurality of cutting commands CUC are sequentially stored after 8.

In this way, the plate type number KN and plate thickness number TN
When the editing processing program PRG corresponding to . Command execution of machining based on program PRG. Upon receiving this, the processing control unit 26 reads the edited processing program PRG from the buffer memory 28, and in step S3, the plate type number KN and The address ADR corresponding to the plate thickness number TN (“1” and “4” in the case of the editing program PRG shown in Fig. 6) following the J code (if the plate type number KN is “1” and the plate thickness number When TN is "4", the processing condition file PCF having "SPCC1.2") is stored in the processing condition file memory 33.
Based on the machining conditions stored in the read machining condition file PCF, that is, copying conditions ND, piercing conditions PD, and cutting conditions CD, machining is executed based on the edited machining program PRG.

First, the editing processing program PR shown in FIG.
In the second machining step PS2 during G, since "G22I1J4" is stored as the machining condition selection command PCC, the machining control unit 26 determines that the machining to be performed from now on is for mild steel (cold) with a plate thickness of 1.2 mm. Recognizing that it is a process for a workpiece, using the address ADR corresponding to the process, "SPCC1.2" as a search key, searching for a plate thickness of 1.2
A machining condition file PCF regarding a workpiece of mm mild steel (cold), that is, a machining condition file PCF shown in FIG. 5 is read from the machining condition file memory 33.

Next, as step S4 of the work sequence program OSP, the machining control unit 26 executes the Z-axis copying ON command NCC "in the editing machining program PRG shown in FIG.
M32", the copying condition ND stored in the copying condition table NT in the read processing condition file PCF (the processing condition file PCF shown in FIG. 5), that is, the digit of "non-contact copying" is set. Stored as non-contact copying ND1 "
The copying device selection control unit 3 reads "ON" and uses the non-contact copying device 14 based on the read information.
0 to command the start of copying. The copying device selection control section 3 receives the command from the processing control section 26.
0, in step S5, it is determined whether to use the contact type copying device 13 or the non-contact type copying device 14 based on the command from the processing control section 26, and as a result of the selection, in step S6, the selection is made. The determined copying device, the non-contact copying device 14, is activated to perform a copying operation. At this time, the copying device selection control unit 30 selects the selected copying device in order to correct the difference in characteristics such as scanning sensitivity and response speed between the contact type copying device 13 and the non-contact type copying device 14. At the same time, the switching operation to the appropriate copying gain and speed is performed. In this way, the laser processing machine 1 includes the contact type copying device 13 and the non-contact type copying device 14.
It has both copying devices and machining condition file PC.
F is a contact type copying device 13 or a non-contact type copying device 14
In order to select which one to use, information called copying conditions ND corresponding to the plate type number KN and plate thickness number TN of the workpiece is provided. As a result, either the contact copying device 13 or the non-contact copying device 14 is selectively operated based on the copying conditions ND read out corresponding to the plate type number KN and plate thickness number TN of the workpiece to be machined. It can be used to automatically select the appropriate copying device. Therefore, even if the material of the workpiece changes, there is no need to reinstall the copying device.
Automation of laser processing becomes possible.

[0021] Then, in step S7, the machining control section 26 executes the fifth
Processing from processing step PS5 onwards is executed. first,
The piercing command PLC "G7" stored in the fifth processing step PS5 at the top of the piercing command block PCB
6", the read processing condition file P
A plurality of piercing conditions PD stored in the piercing condition table PT in the CF (that is, the processing condition file PCF shown in FIG. 5), that is, the laser output value P is shown in the "output (W)" digit.
"500" and "Frequency (Hz)" stored as D1
"1000" stored as the laser frequency PD2 in the digit of
", "20" stored as duty PD3 in the "duty (%)" digit, "oxygen" and "gas pressure (k)" stored as assist gas type PD4 in the "gas type" digit.
"2.0" is stored as the assist gas pressure PD5 in the "dwell (s)" digit, and "1.0" is stored as the piercing completion waiting time PD6 in the "dwell (s)" digit.
0'' to the laser oscillation control unit 29 to instruct the start of the piercing operation, and at the same time outputs a signal from the already selected non-contact copying device 14 to the drive motor 37 via the axis control unit 27. is driven to move the laser exit port 12a of the processing torch 12 to a predetermined reference position in the Z-axis direction. Position to focus on a predetermined position. Then, the laser oscillation control unit 29 controls the table 3 via the laser oscillator 11.
A laser oscillation operation is performed on the workpiece 19 on the workpiece mounting surface 3a based on the output piercing condition PD. As a result, a piercing operation based on the output piercing condition PD is performed with the laser emission port 12a of the processing torch 12 spaced above the workpiece 19 by the predetermined laser emission distance RL.

Next, after the piercing operation is completed, the processing control unit 26 issues a cutting command CUC "G01
Workpiece cutting speed WCS following the F code in "F5000"
Based on "5000", the read processing condition file PCF (i.e., the processing condition file PCF shown in FIG.
Among the plurality of cutting condition steps CS stored in the cutting condition table CT in F), the first cutting condition in which “5000” is stored as the workpiece cutting speed WCS in the “speed (mm/min)” digit Select step CS1. Next, the processing control unit 26 sets the selected first cutting condition step CS.
1, "1000" is stored as the laser output value CD1 in the "output (W)" digit, "1000" is stored as the laser frequency CD2 in the "frequency (Hz)" digit, “100” is stored as duty CD3 in the “Duty (%)” digit, and “oxygen” and “gas pressure (kg/cm2)” are stored in the “Gas type” digit as assist gas type CD4. "2.0" stored as the assist gas pressure CD5 is outputted to the laser oscillation control unit 29 to instruct the start of the cutting operation. At the same time, the processing control unit 26 issues a cutting command CUC "G01X6
0Y0F5000'', a machining path on the workpiece is calculated, and a control command based on the calculated machining path is output to the axis control unit 27. Then, the laser oscillation control unit 29 performs a laser oscillation operation based on the output cutting condition CD via the laser oscillator 11, and the axis control unit 27 operates the drive motor 39 based on the output control command. The table 3 is driven to move in the direction of the arrow A in FIG. 1, which is the X-axis direction. As a result, a cutting operation is performed on the work 19 on the work mounting surface 3a of the table 3 based on the output cutting conditions CD. During this cutting operation, the non-contact copying device 14 that has already been selected is activated, and the position of the laser exit port 12a of the processing torch 12 is adjusted to match the warpage (unevenness) of the processing surface 19a of the workpiece 19 on the Z-axis. Since the workpiece 19 is positioned at an appropriate position in the direction, the workpiece 19 can be processed smoothly. It should be noted that even if the selected copying device is the contact type copying device 13, the operation is similar to that described above, so that the workpiece can be processed smoothly.

By the way, in the above embodiment, the first
Although the information on the copying conditions ND indicates that one of the copying means and the second copying means should be used, and the information is stored in the processing condition file memory 33, the original processing program P
In the RO, for example, the M60 uses the first copying means to use one of the first copying means and the second copying means.
A processing code (M code) that instructs the use of the second copying means, and M61 instructs the use of the second copying means.
The same effect can be obtained by instructing using copying device selection command information according to the method and storing the information in the machining program memory 25. Further, in the above-described embodiment, laser processing of the plate-shaped workpiece 19 has been described, but the present invention uses a three-dimensional laser processing machine or the like to process the upper or side surface of the block-shaped workpiece 19. It is also applicable when processing 19a.

[0024]

As described above, the laser processing machine 1 according to the present invention has workpiece support means such as the table 3 that supports the workpiece 19, and focuses the laser beam 17 at a predetermined focal length FL. In a laser processing machine 1 in which a processing means such as a processing torch 12 is movably driven in a direction perpendicular to a processing surface 19a of a workpiece 19 supported by the workpiece supporting means, contacting the processing surface 19a of the workpiece 19. A first copying means such as a contact type copying device 13 that performs a copying operation is provided, and the machined surface 19a of the workpiece 19 is
A second copying means such as a non-contact copying device 14 that performs a copying operation without contacting is provided, and a copying condition ND instructs to use one of the first copying means and the second copying means. , first memory means such as a machining condition file memory 33 and a machining program memory 25 storing copying means selection information such as copying device selection commands are provided, and the copying means selection information is read out and the read copying means selection information is read out. Based on the above, the present invention is configured by providing copying device selection control means such as a processing control section 26 and a copying device selection control section 30 that select and use one of the first copying means and the second copying means.

With the above configuration, when performing laser processing using a copying device, the copying device selection control means selects the first copying device corresponding to the workpiece to be machined based on the copying device selection information. Since one of the second copying means and the second copying means is selectively used, it is possible to perform laser processing without having to reinstall the copying device depending on the work to be processed. Additionally, since manual work is eliminated, productivity is improved and laser processing can be automated.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a laser processing machine according to the present invention.

FIG. 2 is an enlarged view of the vicinity of a processing torch of the laser processing machine shown in FIG. 1;

FIG. 3 is a control block diagram of a processing control device installed in the laser processing machine shown in FIG. 1.

FIG. 4 is a diagram showing an example of a flowchart of laser processing.

FIG. 5 is a diagram showing an example of a processing condition file.

FIG. 6 is a diagram showing an example of a machining condition program.

FIG. 7 is a diagram illustrating an example of a correspondence table.

[Explanation of symbols]

1...Laser processing machine 3...Work support means (table) 12...Processing means (processing torch) 13...First copying device (contact type copying device) 14...Second copying device (non-contact type Copying device) 17... Laser beam 19... Workpiece 19a... Machining surface 25... First memory means (machining program memory) 2
6... Copying device selection control means (processing control section) 30... Copying device selection control section (copying device selection control section) 33... First memory means (processing condition file memory) FL... Focal length

Claims (1)

[Claims] 1. A workpiece support means for supporting a workpiece, and a processing means for condensing a laser beam at a predetermined focal length can be driven to move in a direction perpendicular to a processing surface of the workpiece supported by the workpiece support means. In the laser processing machine installed in
A first copying means that performs a copying operation by contacting the machined surface of the workpiece is provided, and a second copying means that performs a copying operation without contacting the machined surface of the workpiece is provided, and these first copying means a first memory means storing copying means selection information instructing to use one of the copying means and the second copying means, reading out the copying means selection information and based on the read copying means selection information; A laser processing machine is provided with a copying device selection control means for selecting and using one of the first copying means and the second copying means.