JPH0430729U - - Google Patents

Info

Publication number
JPH0430729U
JPH0430729U JP7262990U JP7262990U JPH0430729U JP H0430729 U JPH0430729 U JP H0430729U JP 7262990 U JP7262990 U JP 7262990U JP 7262990 U JP7262990 U JP 7262990U JP H0430729 U JPH0430729 U JP H0430729U
Authority
JP
Japan
Prior art keywords
processing liquid
wafer
processing
carrier
pipes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7262990U
Other languages
Japanese (ja)
Other versions
JP2568799Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990072629U priority Critical patent/JP2568799Y2/en
Publication of JPH0430729U publication Critical patent/JPH0430729U/ja
Application granted granted Critical
Publication of JP2568799Y2 publication Critical patent/JP2568799Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図１，２はそれぞれ本考案の第１の実施例
のウエハー処理装置の正面断面図、側面断面図、
第２図１，２はそれぞれ本考案の第２の実施例の
ウエハー処理装置の正面断面図、側面断面図、第
３図はキヤリアの斜視図、第４図はウエハー処理
装置の従来例の正面断面図である。 １……処理槽、２……外槽、３……内槽、４…
…キヤリア台、５……キヤリアガイド、６，７…
…処理液噴出パイプ、８……処理液供給パイプ、
９……ポンプ、１０……フイルタ、１１……ウエ
ハー、１２……キヤリア、１３……給水口。 1 and 2 are respectively a front sectional view and a side sectional view of a wafer processing apparatus according to a first embodiment of the present invention;
Figures 2 1 and 2 are respectively a front sectional view and a side sectional view of a wafer processing apparatus according to a second embodiment of the present invention, Figure 3 is a perspective view of a carrier, and Figure 4 is a front view of a conventional example of a wafer processing apparatus. FIG. 1...processing tank, 2...outer tank, 3...inner tank, 4...
...Carrier stand, 5...Carrier guide, 6,7...
... Processing liquid spout pipe, 8... Processing liquid supply pipe,
9...pump, 10...filter, 11...wafer, 12...carrier, 13...water supply port.

Claims (1)

【実用新案登録請求の範囲】 ウエハーが装填されたキヤリアを処理槽内の処
理液に浸漬して前記ウエハーおよびキヤリアの洗
浄を行なうウエハー処理装置において、 前記処理槽の底部またはその近傍で前記キヤリ
アの下方に、外部から処理液が供給されて前記処
理槽内に前記処理液を噴出する２本の処理液噴出
パイプが、キヤリアに装填されて前記処理槽内に
ある複数のウエハーの中心を結ぶ中心線とほぼ平
行に、かつ前記中心線を含む垂直な平面をはさん
で互いに向き合うように設けられ、 前記処理液噴出パイプは前記処理液が供給され
る側と反対側の端部が封止され、前記処理液噴出
パイプの側面には、前記ウエハーの表面に向かつ
てほぼ平行で、前記処理液噴出パイプの長手方向
に見たとき前記ウエハーの中心またはその近傍に
向かつて前記処理液を噴射するように多数の小孔
が設けられていることを特徴とするウエハー処理
装置。[Claims for Utility Model Registration] A wafer processing apparatus in which a carrier loaded with a wafer is immersed in a processing liquid in a processing tank to clean the wafer and the carrier, wherein the carrier is cleaned at the bottom of the processing tank or in the vicinity thereof. Below, two processing liquid ejection pipes are supplied with a processing liquid from the outside and eject the processing liquid into the processing tank, and a center connecting the centers of a plurality of wafers loaded in a carrier and placed in the processing tank. The pipes are provided substantially parallel to the line and facing each other across a perpendicular plane including the center line, and the processing liquid jetting pipes are sealed at ends opposite to the side to which the processing liquid is supplied. , a side surface of the processing liquid jetting pipe is substantially parallel to the surface of the wafer, and is configured to jet the processing liquid toward or near the center of the wafer when viewed in the longitudinal direction of the processing liquid jetting pipe. A wafer processing apparatus characterized by having a large number of small holes.
JP1990072629U 1990-07-10 1990-07-10 Wafer processing equipment Expired - Fee Related JP2568799Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990072629U JP2568799Y2 (en) 1990-07-10 1990-07-10 Wafer processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990072629U JP2568799Y2 (en) 1990-07-10 1990-07-10 Wafer processing equipment

Publications (2)

Publication Number Publication Date
JPH0430729U true JPH0430729U (en) 1992-03-12
JP2568799Y2 JP2568799Y2 (en) 1998-04-15

Family

ID=31610735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990072629U Expired - Fee Related JP2568799Y2 (en) 1990-07-10 1990-07-10 Wafer processing equipment

Country Status (1)

Country Link
JP (1) JP2568799Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999034420A1 (en) * 1997-12-26 1999-07-08 Spc Electronics Corporation Wafer cleaning equipment and tray for use in wafer cleaning equipment
JP2018130722A (en) * 2018-04-26 2018-08-23 光洋サーモシステム株式会社 Cleaning equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276837U (en) * 1988-11-30 1990-06-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276837U (en) * 1988-11-30 1990-06-13

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999034420A1 (en) * 1997-12-26 1999-07-08 Spc Electronics Corporation Wafer cleaning equipment and tray for use in wafer cleaning equipment
JP2018130722A (en) * 2018-04-26 2018-08-23 光洋サーモシステム株式会社 Cleaning equipment

Also Published As

Publication number Publication date
JP2568799Y2 (en) 1998-04-15

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees