JPH04298808A - Thin-film magnetic head - Google Patents
Thin-film magnetic headInfo
- Publication number
- JPH04298808A JPH04298808A JP41367590A JP41367590A JPH04298808A JP H04298808 A JPH04298808 A JP H04298808A JP 41367590 A JP41367590 A JP 41367590A JP 41367590 A JP41367590 A JP 41367590A JP H04298808 A JPH04298808 A JP H04298808A
- Authority
- JP
- Japan
- Prior art keywords
- film
- copper
- films
- taking
- lead conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 28
- 239000010408 film Substances 0.000 claims abstract description 123
- 239000004020 conductor Substances 0.000 claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 35
- 239000010949 copper Substances 0.000 claims abstract description 35
- 239000002344 surface layer Substances 0.000 claims abstract description 9
- 238000006243 chemical reaction Methods 0.000 claims abstract 2
- 238000000605 extraction Methods 0.000 claims description 31
- 238000007747 plating Methods 0.000 abstract description 9
- 239000011229 interlayer Substances 0.000 abstract description 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract description 2
- 229910000889 permalloy Inorganic materials 0.000 description 13
- 230000035882 stress Effects 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、薄膜磁気ヘッドに関し
、コイル導体膜に接続されるリード導体膜のうち、少な
くとも、取出電極が形成される領域の表面層を銅膜で構
成し、この銅膜の上に取出電極を形成することにより、
基体とリード導体膜との間に生じるストレスを小さくし
、取出電極剥離などを生じることがないようにしたもの
である。[Industrial Field of Application] The present invention relates to a thin-film magnetic head, in which at least the surface layer of a lead conductor film connected to a coil conductor film in a region where an extraction electrode is formed is made of a copper film. By forming an extraction electrode on the membrane,
The stress generated between the base and the lead conductor film is reduced to prevent the lead electrode from peeling off.
【0002】0002
【従来の技術】図10は従来よりよく知られている薄膜
磁気ヘッドの要部の斜視図、図11は同じく要部の拡大
断面図、図12は取出電極部分の拡大断面図である。こ
れらの図において、1はセラミックで構成された基体、
2は下部磁性膜、3はアルミナ等でなるギャップ膜、4
は上部磁性膜、5はコイル導体膜、6はノボラック樹脂
等の有機樹脂で構成された絶縁膜、7、8はリード導体
膜、9、10は取出電極、11は各部を覆うアルミナ等
の保護膜である。2. Description of the Related Art FIG. 10 is a perspective view of a main part of a conventionally well-known thin film magnetic head, FIG. 11 is an enlarged sectional view of the same main part, and FIG. 12 is an enlarged sectional view of an extraction electrode portion. In these figures, 1 is a base made of ceramic;
2 is a lower magnetic film, 3 is a gap film made of alumina, etc., 4
1 is an upper magnetic film, 5 is a coil conductor film, 6 is an insulating film made of organic resin such as novolac resin, 7 and 8 are lead conductor films, 9 and 10 are extraction electrodes, and 11 is a protection film such as alumina that covers each part. It is a membrane.
【0003】基体1は、スライダとして利用される部分
であって、Al2O3−TiC 等でなる主部101の
表面に、アルミナ等の絶縁膜102を付着させたセラミ
ック構造体である。The base 1 is a part used as a slider, and is a ceramic structure having an insulating film 102 made of alumina or the like adhered to the surface of a main part 101 made of Al2O3-TiC or the like.
【0004】下部磁性膜2及び上部磁性膜4の先端部は
、微小厚みのギャップ膜3を隔てて対向するポール部2
1、41となっており、ポール部21、41において読
み書きを行なう。22、42はヨーク部であり、ポール
部21、41とは反対側の端部で結合させてある。[0004] The tips of the lower magnetic film 2 and the upper magnetic film 4 form pole parts 2 facing each other with a gap film 3 having a minute thickness in between.
1 and 41, and reading and writing are performed in the pole parts 21 and 41. Reference numerals 22 and 42 are yoke parts, which are connected at ends opposite to the pole parts 21 and 41.
【0005】絶縁膜6は複数層から構成されていて、絶
縁膜6の上に、ヨーク部22、42の結合部のまわりを
渦巻状にまわるように、コイル導体膜5を形成してある
。コイル導体膜5は、通常、下地膜の上に銅膜をメッキ
等の手段によって付着させた構造となっている。The insulating film 6 is composed of a plurality of layers, and a coil conductor film 5 is formed on the insulating film 6 so as to spiral around the joint between the yoke parts 22 and 42. The coil conductor film 5 usually has a structure in which a copper film is deposited on a base film by means such as plating.
【0006】リード導体膜7、8は銅膜71、81の上
にパーマロイ(Ni−Fe)膜72、82を被着させた
構造となっている。銅膜71、81はコイル導体膜5を
形成する工程において同時に形成されるものであり、パ
ーマロイ膜72、82は上部磁性膜4のメッキ工程にお
いて同時に形成される。The lead conductor films 7 and 8 have a structure in which permalloy (Ni--Fe) films 72 and 82 are deposited on copper films 71 and 81. The copper films 71 and 81 are formed simultaneously in the step of forming the coil conductor film 5, and the permalloy films 72 and 82 are formed simultaneously in the step of plating the upper magnetic film 4.
【0007】取出電極9、10は、当業者間ではバンプ
と呼ばれているものであって、後でリード線等の外部導
体が接続される。取出電極9、10は銅メッキ膜として
リード導体膜7、8を構成するパーマロイ膜72、82
の上に形成される。The extraction electrodes 9 and 10 are called bumps by those skilled in the art, and are later connected to an external conductor such as a lead wire. The extraction electrodes 9 and 10 are permalloy films 72 and 82 that constitute the lead conductor films 7 and 8 as copper plating films.
formed on top of.
【0008】[0008]
【発明が解決しようとする課題】しかしながら、パーマ
ロイ膜72、82の上に、取出電極9、10を形成した
従来の薄膜磁気ヘッドでは、取出電極9、10が剥離し
てしまうとう事故がしばしば生じた。特に、Al2O3
−TiC でなる主部101の表面にアルミナの絶縁膜
102を被着させた構造の薄膜磁気ヘッドにおいては、
取出電極9、10の下方領域において、絶縁膜102が
付着した状態で、取出電極9、10が剥離する事故がし
ばしば見られた。剥離の主原因は、パーマロイ膜72、
82と銅取出電極9、10の引っ張り応力の合成による
と考えられる。即ち、パーマロイ膜72、82と銅取出
電極9、10の引っ張り応力の影響を受けて、絶縁膜1
02にクラックAが発生するというものである。絶縁膜
102として、アルミナを使用した場合には、圧縮応力
が生じるため、引っ張り応力と圧縮応力との相互作用に
より、ますますクラックが入り易くなる。However, in the conventional thin film magnetic head in which the extraction electrodes 9 and 10 are formed on the permalloy films 72 and 82, accidents often occur in which the extraction electrodes 9 and 10 peel off. Ta. In particular, Al2O3
- In a thin film magnetic head having a structure in which an alumina insulating film 102 is deposited on the surface of a main portion 101 made of TiC,
In the region below the extraction electrodes 9 and 10, accidents were often observed in which the extraction electrodes 9 and 10 peeled off while the insulating film 102 was attached. The main cause of peeling is the permalloy film 72,
This is thought to be due to the combination of the tensile stress of 82 and the copper lead-out electrodes 9 and 10. That is, under the influence of the tensile stress of the permalloy films 72 and 82 and the copper lead-out electrodes 9 and 10, the insulating film 1
Crack A occurs in 02. When alumina is used as the insulating film 102, compressive stress is generated, and cracks are more likely to occur due to the interaction between the tensile stress and the compressive stress.
【0009】しかも、この種の薄膜磁気ヘッドは、その
製造工程において、熱処理を伴うのが普通であるため、
熱応力による影響を受けて、より一層クラックが入り易
くなる。Moreover, since this type of thin film magnetic head usually involves heat treatment in its manufacturing process,
Under the influence of thermal stress, cracks are more likely to occur.
【0010】そこで、本発明の課題は、上述する従来の
問題点を解決し、基体とリード導体膜との間に生じるス
トレスを小さくし、取出電極剥離を防止し得るようにし
た信頼性の高い薄膜磁気ヘッドを提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above-mentioned conventional problems, to reduce the stress generated between the base and the lead conductor film, and to provide a highly reliable device capable of preventing the lead-out electrode from peeling off. An object of the present invention is to provide a thin film magnetic head.
【0011】[0011]
【課題を解決するための手段】上述する課題解決のため
、本発明に係る薄膜磁気ヘッドは、基体上に、磁性膜及
びコイル導体膜を含む薄膜磁気変換素子と、前記コイル
導体膜に導通させたリード導体膜と、前記リード導体膜
上に形成された取出電極とを有する薄膜磁気ヘッドであ
って、前記リード導体膜は、少なくとも、前記取出電極
を形成する領域の表面層が銅膜であり、前記取出電極は
、前記銅膜の上に設けられていることを特徴とする。[Means for Solving the Problems] In order to solve the above-mentioned problems, a thin film magnetic head according to the present invention includes a thin film magnetic transducer element including a magnetic film and a coil conductor film on a base body, and a thin film magnetic transducer element that is electrically connected to the coil conductor film. A thin film magnetic head having a lead conductor film and an extraction electrode formed on the lead conductor film, wherein at least a surface layer of the lead conductor film in a region where the extraction electrode is formed is a copper film. , the extraction electrode is provided on the copper film.
【0012】0012
【作用】リード導体膜は取出電極を形成する領域の表面
層が銅膜であり、取出電極は銅膜の上に設けられていて
、取出電極の位置する領域には引っ張り応力の発生の一
つの原因となるパーマロイ膜が存在しない。このため、
基体表面層におけるクラック、それに伴う電極剥離が生
じにくくなる。[Function] The surface layer of the lead conductor film in the area where the extraction electrode is formed is a copper film, and the extraction electrode is provided on the copper film, and the area where the extraction electrode is located is one of the areas where tensile stress is generated. There is no permalloy film to cause this. For this reason,
Cracks in the substrate surface layer and accompanying electrode peeling are less likely to occur.
【0013】本発明は、面内記録再生用薄膜磁気ヘッド
に限らず、垂直記録再生用薄膜磁気ヘッドにも適用が可
能である。The present invention is applicable not only to thin film magnetic heads for longitudinal recording and reproducing, but also to thin film magnetic heads for perpendicular recording and reproducing.
【0014】[0014]
【実施例】図1は本発明に係る薄膜磁気ヘッドの斜視図
、図2は同じく取出電極部分の拡大断面図である。図に
おいて、図10〜図12と同一の参照符号は同一性ある
構成部分を示している。図示するように、リード導体膜
7、8は取出電極を形成する領域の表面層が銅膜71、
81となっており、取出電極9、10は銅膜71、81
の上に設けられている。図示はされていないが、銅膜7
1、81は下地膜を有する。パーマロイ膜72、82は
取出電極9、10の外部にあって、取出電極9、10の
下には形成されていない。リード導体膜7、8の全体を
、パーマロイ膜72、82のない銅膜71、81によっ
て構成することも可能である。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of a thin film magnetic head according to the present invention, and FIG. 2 is an enlarged sectional view of a lead-out electrode portion. In the figures, the same reference numerals as in FIGS. 10 to 12 indicate the same components. As shown in the figure, the surface layer of the lead conductor films 7 and 8 in the region where the extraction electrode is formed is a copper film 71,
81, and the extraction electrodes 9 and 10 are made of copper films 71 and 81.
is placed on top of. Although not shown, the copper film 7
1 and 81 have a base film. The permalloy films 72 and 82 are located outside the extraction electrodes 9 and 10 and are not formed under the extraction electrodes 9 and 10. It is also possible that the entire lead conductor films 7 and 8 are made of copper films 71 and 81 without the permalloy films 72 and 82.
【0015】上述のように、取出電極9、10の位置す
る領域には引っ張り応力の発生原因となるパーマロイ膜
が存在しない。このため、基体1の表面層となる絶縁膜
102におけるクラック、それに伴う電極剥離を確実に
防止できるようになる。As described above, there is no permalloy film that causes tensile stress in the region where the extraction electrodes 9 and 10 are located. Therefore, cracks in the insulating film 102, which is the surface layer of the base 1, and electrode peeling accompanying the cracks can be reliably prevented.
【0016】上述のような構造を有するリード導体膜7
、8及び取出電極9、10は、この種の薄膜磁気ヘッド
製造技術において周知のパターン形成技術によって簡単
に製造できる。図3〜図9にその一例を示す。図3〜図
9では1つの薄膜磁気変換素子を示しているだけである
が、薄膜磁気ヘッド製造工程は、基体1をウエハとして
、薄膜磁気変換素子を多数個整列した状態で、工程が進
められる。Lead conductor film 7 having the above-described structure
, 8 and the extraction electrodes 9 and 10 can be easily manufactured using pattern forming techniques well known in this type of thin film magnetic head manufacturing technology. An example is shown in FIGS. 3 to 9. Although only one thin film magnetic transducer is shown in FIGS. 3 to 9, the thin film magnetic head manufacturing process is carried out with the substrate 1 as a wafer and a large number of thin film magnetic transducers aligned. .
【0017】まず、図3の工程では、ウエハである基体
1上に下部磁性膜2、ギャップ膜3、コイル導体膜5及
び層間の絶縁膜6等を形成した後、上部磁性膜を形成す
る前に、リード導体膜となる銅膜71、81の取出電極
形成領域に対応する部分を、フォトレジスト等によって
マスク12する。銅膜71、81は、コイル導体膜5の
形成工程において同時に形成されたものである。First, in the process shown in FIG. 3, after forming a lower magnetic film 2, a gap film 3, a coil conductor film 5, an interlayer insulating film 6, etc. on a substrate 1 which is a wafer, and before forming an upper magnetic film. Next, portions of the copper films 71 and 81, which will become lead conductor films, corresponding to the extraction electrode forming region are masked 12 with photoresist or the like. The copper films 71 and 81 are formed at the same time in the process of forming the coil conductor film 5.
【0018】次に、図4に示すように、上部磁性膜4を
形成する。上部磁性膜形成工程においては、絶縁膜6の
上に、パーマロイを主成分とする上部磁性膜4が形成さ
れると共に、マスク12によって覆われた部分を除いて
、リード導体膜を構成する銅膜71、81の表面にも、
パーマロイ膜72、82が付着する。Next, as shown in FIG. 4, an upper magnetic film 4 is formed. In the upper magnetic film forming step, the upper magnetic film 4 mainly composed of permalloy is formed on the insulating film 6, and the copper film constituting the lead conductor film is formed on the insulating film 6, except for the part covered by the mask 12. Also on the surface of 71 and 81,
Permalloy films 72 and 82 are attached.
【0019】次に、マスク12を除去した後、図5に示
すように、薄膜磁気変換素子及びリード導体膜7、8の
上にレジストマスク13を付着させる。レジストマスク
13は、マスク12によって覆われていた銅膜71、8
1の上に、取出電極用のパターンP1 が生じるように
パターンニングして形成する。Next, after removing the mask 12, a resist mask 13 is deposited on the thin film magnetic transducer element and lead conductor films 7 and 8, as shown in FIG. The resist mask 13 removes the copper films 71 and 8 covered by the mask 12.
1, patterning is performed to form a pattern P1 for an extraction electrode.
【0020】次に、図6に示すように、銅メッキ処理を
行なうことにより、レジストマスク13によって画定さ
れたパターンP1 内の銅膜71、81の上に銅メッキ
膜を成長させる。これにより、銅メッキ膜でなる取出電
極9、10が得られる。Next, as shown in FIG. 6, a copper plating process is performed to grow a copper plating film on the copper films 71 and 81 within the pattern P1 defined by the resist mask 13. Thereby, lead electrodes 9 and 10 made of copper plating film are obtained.
【0021】この後、図7に示すようにレジストマスク
13を除去した後、図8に示すように、保護膜11をス
パッタリング等の手段によって形成し、次に図9に示す
ように、保護膜11の表面を研磨して、取出電極9、1
0の面出しを行なう。After that, as shown in FIG. 7, after removing the resist mask 13, as shown in FIG. 8, a protective film 11 is formed by means such as sputtering, and then as shown in FIG. Polishing the surface of 11, the extraction electrodes 9, 1
Perform surface leveling of 0.
【0022】上述した製造方法は1例であり、種々の製
造方法をとり得ることはいうまでもない。[0022] The above-mentioned manufacturing method is just one example, and it goes without saying that various manufacturing methods can be used.
【0023】[0023]
【発明の効果】以上述べたように、本発明に係る薄膜磁
気ヘッドは、コイル導体膜に導通するリード導体膜の取
出電極を形成する領域の表面層が銅膜となっており、取
出電極は前述の銅膜の上に設けられているので、基体と
リード導体膜との間に生じるストレスが小さく、取出電
極剥離を生じにくい高信頼度の薄膜磁気ヘッドを提供で
きる。[Effects of the Invention] As described above, in the thin film magnetic head according to the present invention, the surface layer of the region where the lead conductor film that is electrically connected to the coil conductor film is formed is a copper film, and the lead electrode is formed of a copper film. Since it is provided on the above-mentioned copper film, the stress generated between the base and the lead conductor film is small, and a highly reliable thin-film magnetic head in which the extraction electrode does not easily peel off can be provided.
【図1】本発明に係る薄膜磁気ヘッドの要部の斜視図で
ある。FIG. 1 is a perspective view of essential parts of a thin film magnetic head according to the present invention.
【図2】図2は同じく取出電極部分の拡大断面図である
。図3〜図9本発明に係る薄膜磁気ヘッドの製造方法の
1例を示す図である。FIG. 2 is an enlarged sectional view of the extraction electrode portion. 3 to 9 are diagrams showing an example of a method for manufacturing a thin film magnetic head according to the present invention.
【図10】従来の薄膜磁気ヘッドの要部における斜視図
である。FIG. 10 is a perspective view of a main part of a conventional thin film magnetic head.
【図11】同じく要部の断面図である。FIG. 11 is a cross-sectional view of the main parts.
【図12】同じく取出電極部分における拡大断面図であ
る。FIG. 12 is an enlarged sectional view of the extraction electrode portion.
1 基体
2 下部磁性膜3
ギャップ膜4 上
部磁性膜5 コイル導体膜6
絶縁膜
7、8 リード導体膜
9、10 取出電極
71、81 銅膜
72、82 パーマロイ膜1 Base 2 Lower magnetic film 3
Gap film 4 Upper magnetic film 5 Coil conductor film 6
Insulating films 7, 8 Lead conductor films 9, 10 Extracting electrodes 71, 81 Copper films 72, 82 Permalloy film
Claims (1)
含む薄膜磁気変換素子と、前記コイル導体膜に導通させ
たリード導体膜と、前記リード導体膜上に形成された取
出電極とを有する薄膜磁気ヘッドであって、前記リード
導体膜は、少なくとも、前記取出電極を形成する領域の
表面層が銅膜であり、前記取出電極は、前記銅膜の上に
設けられていることを特徴とする薄膜磁気ヘッド。1. A thin film magnetic conversion element including a magnetic film and a coil conductor film, a lead conductor film electrically connected to the coil conductor film, and an extraction electrode formed on the lead conductor film on a base. The thin film magnetic head is characterized in that at least a surface layer of the lead conductor film in a region where the extraction electrode is formed is a copper film, and the extraction electrode is provided on the copper film. Thin film magnetic head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP41367590A JPH04298808A (en) | 1990-12-24 | 1990-12-24 | Thin-film magnetic head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP41367590A JPH04298808A (en) | 1990-12-24 | 1990-12-24 | Thin-film magnetic head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04298808A true JPH04298808A (en) | 1992-10-22 |
Family
ID=18522262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP41367590A Withdrawn JPH04298808A (en) | 1990-12-24 | 1990-12-24 | Thin-film magnetic head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04298808A (en) |
-
1990
- 1990-12-24 JP JP41367590A patent/JPH04298808A/en not_active Withdrawn
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980312 |