JPS6250882B2 - - Google Patents
Info
- Publication number
- JPS6250882B2 JPS6250882B2 JP17657082A JP17657082A JPS6250882B2 JP S6250882 B2 JPS6250882 B2 JP S6250882B2 JP 17657082 A JP17657082 A JP 17657082A JP 17657082 A JP17657082 A JP 17657082A JP S6250882 B2 JPS6250882 B2 JP S6250882B2
- Authority
- JP
- Japan
- Prior art keywords
- lower pole
- layer
- soft magnetic
- thin film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 21
- 229920002120 photoresistant polymer Polymers 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000696 magnetic material Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
Description
【発明の詳細な説明】
本発明は、磁気記録装置に用いられる薄膜磁気
ヘツドの製造方法に関し、特に、磁気回路の一部
を成す下部磁性体の製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a thin film magnetic head used in a magnetic recording device, and more particularly to a method of manufacturing a lower magnetic body forming a part of a magnetic circuit.
第１図は、近年、実用化されつつある薄膜磁気
ヘツドの概略断面図である。第１図において、基
板１１上にAl2O3等の絶縁層１２が形成され、次
いで軟磁性体から成る下部ポール１３がメツキ
法、蒸着法あるいはスパツタ法により形成され
る。このあと、ギヤツプとなるAl3O3等の絶縁層
１４が成膜される。次いで、フオトレジスト等の
有機物から成る絶縁層１５が形成され、さらに導
体材料から成るコイル１６が形成され、コイル１
６を埋込むように再度フオトレジスト等の有機物
から成る絶縁層１７が形成され、そのあと軟磁性
体から成る上部ポール１８が下部ポール１３と同
様にして形成され、最後に、Al2O3等の絶縁物か
ら成る保護膜１９が形成され、薄膜磁気ヘツドの
トランスデユーサーが構成されている。 FIG. 1 is a schematic cross-sectional view of a thin film magnetic head that has been put into practical use in recent years. In FIG. 1, an insulating layer 12 made of Al 2 O 3 or the like is formed on a substrate 11, and then a lower pole 13 made of a soft magnetic material is formed by plating, vapor deposition or sputtering. After this, an insulating layer 14 of Al 3 O 3 or the like is formed to form a gap. Next, an insulating layer 15 made of an organic material such as photoresist is formed, and a coil 16 made of a conductive material is formed.
An insulating layer 17 made of an organic material such as photoresist is again formed so as to bury the insulating layer 17, and then an upper pole 18 made of a soft magnetic material is formed in the same manner as the lower pole 13 . A protective film 19 made of an insulator is formed to constitute a transducer of a thin film magnetic head.
このような構造を有する薄膜磁気ヘツドにおい
て、高ビツト密度記録例えば、2500BPI（Bit
Per Inch）以上の密度で記録を行なう場合に
は、上部ポール１８および下部ポール１３の膜厚
は１μｍ以下とせざるをえず、この場合、上部ポ
ール１８および下部ポール１３を成す軟磁性体の
膜厚が薄いために、磁気抵抗が増大し、上部ポー
ル１８および下部ポール１３が磁気的に飽和して
しまい、薄膜磁気ヘツドの書込み読出し効率（以
下Ｒ／Ｗ効率と略す）、特に、書込み効率が低下
し、薄膜磁気ヘツドの書込み特性が劣化するとい
う欠点がある。 In a thin film magnetic head having such a structure, high bit density recording such as 2500 BPI (Bit
In the case of recording at a density higher than (Per Inch), the film thickness of the upper pole 18 and lower pole 13 must be 1 μm or less, and in this case, the soft magnetic film forming the upper pole 18 and the lower pole Due to the thin thickness, the magnetic resistance increases and the upper pole 18 and lower pole 13 become magnetically saturated, which reduces the write/read efficiency (hereinafter abbreviated as R/W efficiency) of the thin film magnetic head, especially the write efficiency. This has the disadvantage that the write characteristics of the thin film magnetic head deteriorate.
このような欠点を解決するために、従来、第２
図に示したような断面構造を有する薄膜磁気ヘツ
ドが提案されている。 In order to solve these drawbacks, conventionally, the second
A thin film magnetic head having a cross-sectional structure as shown in the figure has been proposed.
第２図において、軟磁性体から成る下部ポール
２３および上部ポール２８のインナーギヤツプ部
Ｂ、およびリアギヤツプ部Ｃにおける膜厚がフロ
ントギヤツプ部Ａの膜厚に比較して大きくなるよ
うな構造を有しており、上部ポール２８、および
下部ポール２３の磁気抵抗を下げ、両ポールの磁
気的な飽和を抑制した構造となつている。 In FIG. 2, the lower pole 23 and the upper pole 28, which are made of soft magnetic material, have a structure in which the film thickness at the inner gap part B and the rear gap part C is larger than the film thickness at the front gap part A. , the upper pole 28, and the lower pole 23 have a structure in which magnetic resistance is lowered and magnetic saturation of both poles is suppressed.
しかしながら、このような構造を有する薄膜磁
気ヘツドは、下記の如き欠点を有している。すな
わち、下部ポール２３の膜厚が基板２１と反対側
すなわち上部ポール２８側に厚くしたステツプ構
造となつているため、以後のプロセスで下部ポー
ル２３上に積層される各膜の形成、およびこれら
の膜をパターン化するためのフオトレジストパタ
ーンの形成が、前記下部ポール２３の段差により
困難となり、薄膜磁気ヘツドの生産性が低下する
という製造プロセス上の問題点がある。しかも、
前述のステツプにより、上部ポール２８の経験す
る段差は第１図の如き断面構造を有する薄膜磁気
ヘツドの上部ポール（第１図１８）に比較して大
きなものとなるため、フロントギヤツプ部Ａとイ
ンナー・ギヤツプ部Ｂとの間の勾配部において、
上部ポール２８の磁気特性の劣化を招くという欠
点もある。 However, the thin film magnetic head having such a structure has the following drawbacks. That is, since the lower pole 23 has a step structure in which the film thickness is increased on the side opposite to the substrate 21, that is, on the upper pole 28 side, the formation of each film to be laminated on the lower pole 23 in subsequent processes, and the There is a problem in the manufacturing process that the formation of a photoresist pattern for patterning the film is difficult due to the step difference in the lower pole 23, and the productivity of the thin film magnetic head is reduced. Moreover,
Due to the above-mentioned steps, the level difference experienced by the upper pole 28 is larger than that of the upper pole of the thin film magnetic head (FIG. 18) having the cross-sectional structure as shown in FIG. In the slope part between the gap part B,
Another disadvantage is that the magnetic properties of the upper pole 28 are deteriorated.
さらに、第２図の如き断面構造を有する薄膜磁
気ヘツドにおいては、書込みあるいは読出し時
に、前述のステツプ部（第２図中のＤ部）を介し
て大半の磁束が漏洩して、上部ポール２８から下
部ポール２３（あるいはこの逆）に流れてしま
い、磁束が有効に上部ポール２８あるいは下部ポ
ール２３の中を通過せず、Ｒ／Ｗ効率が低下する
という大きな欠点がある。 Furthermore, in a thin film magnetic head having a cross-sectional structure as shown in FIG. 2, most of the magnetic flux leaks from the upper pole 28 through the step section (section D in FIG. 2) during writing or reading. There is a major drawback in that the magnetic flux flows to the lower pole 23 (or vice versa), and the magnetic flux does not effectively pass through the upper pole 28 or the lower pole 23, resulting in a decrease in R/W efficiency.
一方、第３図に示したような断面形状を有する
ヘツドにおいては、絶縁層３２に予め形成された
窪みに対して第１の軟磁性体層３３を、前記窪み
を埋込むように形成し、次いで所定のポール形成
を有する第２の軟磁性体層３４を形成し、この第
１の軟磁性体層３３と第２の軟磁性体層３４との
積層体により下部ポールを形成しており、しか
も、下部ポールの膜厚がインナー・ギヤツプ部Ｂ
およびリアギヤツプ部Ｃにおいて、基板側に厚く
なるような逆ステツプ構造となつているため、第
１図あるいは第２図に示した如き従来の薄膜磁気
ヘツドの諸欠点が解決されることとなる。 On the other hand, in a head having a cross-sectional shape as shown in FIG. 3, a first soft magnetic layer 33 is formed in a depression previously formed in the insulating layer 32 so as to fill the depression. Next, a second soft magnetic layer 34 having a predetermined pole formation is formed, and a lower pole is formed by the laminated body of the first soft magnetic layer 33 and the second soft magnetic layer 34. Moreover, the film thickness of the lower pole is smaller than that of the inner gap part B.
Since the rear gap portion C has a reverse step structure in which the thickness becomes thicker toward the substrate side, various drawbacks of the conventional thin film magnetic head as shown in FIG. 1 or 2 can be solved.
本発明の目的は第３図の如き断面形状を有する
薄膜磁気ヘツドを実現する製造方法、より具体的
には下部ポールの形成方法を提供することにあ
る。 An object of the present invention is to provide a manufacturing method for realizing a thin film magnetic head having a cross-sectional shape as shown in FIG. 3, and more specifically, to provide a method for forming a lower pole.
本発明によれば、軟磁性体材料から成る上部お
よび下部ポール間に導体材料から成るコイルを挾
んで成る薄膜磁気ヘツドの製造方法において、前
記下部ポールのインナー・ギヤツプ部およびリ
ア・ギヤツプ部に相当する領域に対して深さＬの
窪みを形成する工程と、所望の分解能に応じて決
定された膜厚ｔ（ｔ＜Ｌ）なる第１の軟磁性体層
を基板全面に形成する工程と、前記窪み以外の領
域を第１のフオトレジスト層で被覆する工程と前
記第１のフオトレジスト層をマスク層として、前
記窪み以外の下部ポールとなるべき部分に膜厚Ｌ
なる第２の軟磁性体層をメツキ法で形成する工程
と、前記第１のフオトレジスト層を除去し前記第
２の軟磁性体層を所定の下部ポール形状に加工す
る為のエツチング工程とを含むことを特徴とする
薄膜磁気ヘツドの製造方法が得られる。 According to the present invention, in a method for manufacturing a thin film magnetic head comprising a coil made of a conductive material sandwiched between an upper and a lower pole made of a soft magnetic material, a coil made of a conductive material is sandwiched between upper and lower poles made of a soft magnetic material. a step of forming a recess with a depth L in a region to be recessed, and a step of forming a first soft magnetic layer having a thickness t (t<L) on the entire surface of the substrate, which is determined according to a desired resolution; A step of covering the area other than the depression with a first photoresist layer, and using the first photoresist layer as a mask layer, a film thickness L is applied to the area other than the depression, which is to become the lower pole.
and an etching step for removing the first photoresist layer and processing the second soft magnetic layer into a predetermined lower pole shape. There is obtained a method of manufacturing a thin film magnetic head characterized by comprising:
次に、本発明による実施例について第６図を用
いて説明する。 Next, an embodiment according to the present invention will be described using FIG. 6.
第６図ａにおいて、基板６１上に形成された絶
縁層６２に対して、下部ポールのインナー・ギヤ
ツプ部（第３図においてはＢの領域）、およびリ
ア・ギヤツプ部（第３図においてはＣの領域）以
外の領域を被覆するようにフオトレジスト層６３
を形成し、絶縁層６２を深さＬだけエツチングに
より除去し窪みを形成する（第６図ｂ）。次いで
所望の分解能に応じて決定された膜厚ｔ（ｔ＜
Ｌ）なる第１の軟磁性体層６４を基板６１全面に
成膜する（第６図ｃ）。このあと、再度、下部ポ
ールのインナー・ギヤツプ部（第３図においては
Ｂの領域）およびリア・ギヤツプ部（第３図にお
いてはＣの領域）以外の領域を被覆するようにフ
オトレジスト層６５を形成し（第６図ｄ）、前記
第１の軟磁性体層６４をメツキ下地層としてメツ
キ法により、膜厚Ｌなる第２の軟磁性体層６６を
形成する（第６図ｅ）。このあと、前記フオトレ
ジスト層６５を剥離し、新たにフオトレジストを
塗布し、フオトエツチング法を用いて所定のポー
ル形状を形成し、前述の第１の軟磁性体層６４と
前記第２の軟磁性体層６６の積層体により下部ポ
ールが構成される。 In FIG. 6a, with respect to the insulating layer 62 formed on the substrate 61, the inner gap portion (area B in FIG. 3) of the lower pole and the rear gap portion (area C in FIG. 3) A photoresist layer 63 is applied so as to cover the area other than the area).
is formed, and the insulating layer 62 is removed by etching to a depth L to form a recess (FIG. 6b). Next, the film thickness t (t<
A first soft magnetic layer 64 (L) is formed over the entire surface of the substrate 61 (FIG. 6c). After this, a photoresist layer 65 is applied again to cover the area other than the inner gap portion (area B in FIG. 3) and rear gap portion (area C in FIG. 3) of the lower pole. A second soft magnetic layer 66 having a thickness L is formed by a plating method using the first soft magnetic layer 64 as a plating base layer (FIG. 6 e). After that, the photoresist layer 65 is peeled off, a new photoresist is applied, a predetermined pole shape is formed using a photoetching method, and the first soft magnetic layer 64 and the second soft magnetic layer 64 are separated. A lower pole is formed by a stack of magnetic layers 66.
以上、述べて来た様に、本発明によれば下部ポ
ールの膜厚が、インナー・ギヤツプ部およびリ
ア・ギヤツプ部において基板側に厚くなる様な逆
ステツプ構造となつており、しかも前述した如
く、予め絶縁層６２に形成された窪みが第１の軟
磁性体層６４と第２の軟磁性体層６６とにより埋
められ平坦化されることとなる。従つて、既に述
べたように、従来の薄膜磁気ヘツドの持つ諸欠点
を改善した第３図に示した様な断面形状を有する
薄膜磁気ヘツドを生産することが可能となり、そ
の工業的価値は極めて大きいものと言える。 As described above, according to the present invention, the lower pole has a reverse step structure in which the film thickness becomes thicker toward the substrate at the inner gap portion and rear gap portion, and as described above, , the depression previously formed in the insulating layer 62 is filled with the first soft magnetic layer 64 and the second soft magnetic layer 66 and is flattened. Therefore, as already mentioned, it has become possible to produce a thin film magnetic head having the cross-sectional shape shown in Figure 3, which has improved the various drawbacks of conventional thin film magnetic heads, and its industrial value is extremely high. You can say it's big.
尚、以上の説明においては、第３図の如き薄膜
磁気ヘツドを念頭に置いて説明したあと、絶縁層
６２の一部に対して深さＬの窪みを形成する例に
ついて説明したが、第４図および第５図に示した
ような窪みとしても良いしあるいは基板の一部に
達するような窪みとしても本発明の意とするとこ
ろは何ら損われないことは勿論である。 In the above description, the thin film magnetic head as shown in FIG. It goes without saying that the spirit of the present invention will not be impaired in any way, even if the depressions can be made as shown in the figures and FIG. 5, or even if they reach a part of the substrate.
第１図および第２図は従来の薄膜磁気ヘツドを
示す概略断面図、第３図、第４図および第５図は
本発明を用いて形成された薄膜磁気ヘツドを示す
概略断面図ならびに第６図ａ〜ｅは本発明を説明
する工程図である。
図において、１１，２１，３１，４１，５１，
６１……基板、１２，１４，１５，１７，２２，
２４，２５，２７，３２，３５，３６，３８，４
２，４５，４６，４８，５２，５５，５６，５
８，６２……絶縁層、１３，２３，３４，４４，
５４……下部ポール、１８，２８，３９，４９，
５９……上部ポール、６４……第１の軟磁性体
層、６６……第２の軟磁性体層、６０，６５……
フオトレジスト層、１９，２９，４０，５０，６
０……保護膜。
1 and 2 are schematic sectional views showing a conventional thin film magnetic head, FIGS. 3, 4, and 5 are schematic sectional views showing a thin film magnetic head formed using the present invention, and FIG. Figures a to e are process diagrams illustrating the present invention. In the figure, 11, 21, 31, 41, 51,
61...Substrate, 12, 14, 15, 17, 22,
24, 25, 27, 32, 35, 36, 38, 4
2, 45, 46, 48, 52, 55, 56, 5
8, 62...Insulating layer, 13, 23, 34, 44,
54...Lower pole, 18, 28, 39, 49,
59... Upper pole, 64... First soft magnetic layer, 66... Second soft magnetic layer, 60, 65...
Photoresist layer, 19, 29, 40, 50, 6
0...Protective film.
Claims (1)
間に導体材料から成るコイルを挾んで成る薄膜磁
気ヘツドの製造方法において、前記下部ポールの
形成に際して、予め前記下部ポールの下地層に対
して前記下部ポールのインナー・ギヤツプ部およ
びリア・ギヤツプ部に相当する領域に対して深さ
Ｌの窪みを形成する工程と、所望の分解能に応じ
て決定された膜厚ｔ（ｔ＜Ｌ）なる第１の軟磁性
体層を基板全面に形成する工程と、前記窪み以外
の領域を第１のフオトレジスト層で被覆する工程
と、前記第１のフオトレジスト層をマスク層とし
て前記窪み以外の下部ポールとなるべき部分に膜
厚Ｌなる第２の軟磁性体層をメツキ法で形成する
工程と、前記第１のフオトレジスト層を除去し前
記第２の軟磁性体層を所定の下部ポール形状に加
工するためのエツチング工程とを含むことを特徴
とする薄膜磁気ヘツドの製造方法。1. In a method for manufacturing a thin film magnetic head in which a coil made of a conductive material is sandwiched between an upper and a lower pole made of a soft magnetic material, when forming the lower pole, the lower pole forming a recess with a depth L in the region corresponding to the inner gap part and the rear gap part of the a step of forming a magnetic layer on the entire surface of the substrate; a step of covering the area other than the recess with a first photoresist layer; and a step of forming a lower pole other than the recess using the first photoresist layer as a mask layer. a step of forming a second soft magnetic layer with a thickness L on the portion by a plating method; and a step of removing the first photoresist layer and processing the second soft magnetic layer into a predetermined lower pole shape. An etching step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17657082A JPS5965920A (en) | 1982-10-07 | 1982-10-07 | Manufacture of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17657082A JPS5965920A (en) | 1982-10-07 | 1982-10-07 | Manufacture of thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5965920A JPS5965920A (en) | 1984-04-14 |
| JPS6250882B2 true JPS6250882B2 (en) | 1987-10-27 |
Family
ID=16015866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17657082A Granted JPS5965920A (en) | 1982-10-07 | 1982-10-07 | Manufacture of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5965920A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7492555B2 (en) * | 2005-07-13 | 2009-02-17 | Headway Technologies, Inc. | Thin-film magnetic head structure, method of manufacturing the same, and thin-film magnetic head |
-
1982
- 1982-10-07 JP JP17657082A patent/JPS5965920A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5965920A (en) | 1984-04-14 |
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