JP2809466B2 - Thin film magnetic head - Google Patents
Thin film magnetic headInfo
- Publication number
- JP2809466B2 JP2809466B2 JP2048540A JP4854090A JP2809466B2 JP 2809466 B2 JP2809466 B2 JP 2809466B2 JP 2048540 A JP2048540 A JP 2048540A JP 4854090 A JP4854090 A JP 4854090A JP 2809466 B2 JP2809466 B2 JP 2809466B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- magnetic head
- thin
- extraction electrode
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明は、薄膜磁気ヘッドに関し、コイル導体膜に接
続されるリード導体膜のうち、少なくとも、取出電極が
形成される領域の表面層を銅膜で構成し、取出電極を銅
膜の上に形成することにより、基体とリード導体膜との
間に生じるストレスを小さくし、取出電極剥離を生じに
くい薄膜磁気ヘッドを提供できるようにしたものであ
る。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a thin-film magnetic head, and in a lead conductor film connected to a coil conductor film, at least a surface layer of a region where an extraction electrode is formed is made of copper. By forming the extraction electrode on the copper film, the stress generated between the base and the lead conductor film is reduced, and a thin-film magnetic head that does not easily cause the separation of the extraction electrode can be provided. is there.
＜従来の技術＞ 第10図は従来よりよく知られている薄膜磁気ヘッドの
要部の斜視図、第11図は同じく要部の拡大断面図、第12
図は取出電極部分の拡大断面図である。これらの図にお
いて、１はセラミックで構成された基体、２は下部磁性
膜、３はアルミナ等でなるギャップ膜、４は上部磁性
膜、５はコイル導体膜、６はノボラック樹脂等の有機樹
脂で構成された絶縁膜、７、８はリード導体膜、９、10
は取出電極、11は各部を覆うアルミナ等の保護膜であ
る。<Prior Art> FIG. 10 is a perspective view of a main part of a thin film magnetic head which is well known from the prior art, FIG. 11 is an enlarged sectional view of the main part, and FIG.
The figure is an enlarged sectional view of the extraction electrode portion. In these figures, 1 is a substrate made of ceramic, 2 is a lower magnetic film, 3 is a gap film made of alumina or the like, 4 is an upper magnetic film, 5 is a coil conductor film, and 6 is an organic resin such as a novolak resin. The configured insulating films, 7, 8 are lead conductor films, 9, 10
Is an extraction electrode, and 11 is a protective film made of alumina or the like covering each part.
基体１は、スライダとなる部分であって、Al2O3−TiC
等でなる主部101の表面にAl2O3等の絶縁膜102を被着さ
せたセラミック構造体となっている。The substrate 1 is a portion to be a slider, and is made of Al 2 O 3 —TiC
It has a ceramic structure in which an insulating film 102 such as Al 2 O 3 is adhered to a surface of a main portion 101 made of the same.
下部磁性膜２及び上部磁性膜４の先端部は、微小厚み
のギャップ膜３を隔てて対向するポール部21、41となっ
ており、ポール部21、41において読み書きを行なう。2
2、42はヨーク部であり、ポール部21、41とは反対側の
端部で結合させてある。The tip portions of the lower magnetic film 2 and the upper magnetic film 4 are pole portions 21 and 41 opposed to each other with the gap film 3 having a small thickness therebetween. Reading and writing are performed in the pole portions 21 and 41. Two
Reference numerals 2 and 42 denote yoke portions, which are connected at ends opposite to the pole portions 21 and 41.
絶縁膜６は複数層から構成されていて、絶縁膜６の上
に、ヨーク部22、42の結合部のまわりを渦巻状にまわる
ように、コイル導体膜５を形成してある。コイル導体膜
５は、通常、下地膜の上に銅膜をメッキ等の手段によっ
て付着させた構造となっている。The insulating film 6 is composed of a plurality of layers, and the coil conductor film 5 is formed on the insulating film 6 so as to spiral around the joint of the yoke portions 22 and 42. The coil conductor film 5 generally has a structure in which a copper film is adhered on a base film by plating or the like.
リード導体膜７、８は銅膜71、81の上にパーマロイ
（Ni−Fe）膜72、82を被着させた構造となっている。銅
膜71、81はコイル導体膜５を形成する工程において同時
に形成されるものであり、パーマロイ膜72、82は上部磁
性膜４のメッキ工程において同時に形成される。パーマ
ロイ膜72、82は、主として、イオンミリング等の製造工
程において、銅膜71、81の膜減りを防止するために設け
られている。The lead conductor films 7 and 8 have a structure in which permalloy (Ni-Fe) films 72 and 82 are applied on copper films 71 and 81, respectively. The copper films 71 and 81 are formed simultaneously in the step of forming the coil conductor film 5, and the permalloy films 72 and 82 are formed simultaneously in the step of plating the upper magnetic film 4. The permalloy films 72 and 82 are provided mainly to prevent the copper films 71 and 81 from being reduced in a manufacturing process such as ion milling.
取出電極９、10は、当業者間ではバンプと呼ばれてい
るものであって、後でリード線等の外部導体が接続され
る。取出電極９、10は銅メッキ膜としてリード導体膜
７、８を構成するパーマロイ膜72、82の上に形成され
る。The extraction electrodes 9, 10 are called bumps by those skilled in the art, and external conductors such as lead wires are connected later. The extraction electrodes 9 and 10 are formed as copper plating films on the permalloy films 72 and 82 constituting the lead conductor films 7 and 8.
＜発明が解決しようとする課題＞ しかしながら、パーマロイ膜72、82の上に、取出電極
９、10を形成した従来の薄膜磁気ヘッドでは、取出電極
９、10が剥離してしまうという事故がしばしば生じた。
特に、Al2O3−TiCでなる主部101の表面にAl2O3の絶縁膜
102を被着させた構造の薄膜磁気ヘッドにおいては、取
出電極９、10の下方領域において、絶縁膜102が付着し
た状態で、取出電極９、10が剥離する事故がしばしば見
られた。剥離の主原因は、取出電極９、10を構成する銅
バンプの熱応力と、パーマロイ膜72、82の引っ張り応力
にあると考えられる。即ち、取出電極９、10を構成する
銅バンプの引っ張り応力P1及びパーマロイ膜72、82の引
っ張り応力P2の影響を受けて、絶縁膜102にクラックＡ
が発生するというものである。絶縁膜102として、Al2O3
を使用した場合には、圧縮応力P3が生じるため、引っ張
り応力P1、P2と圧縮応力P3との相互作用により、ますま
すクラックが入り易くなる。<Problems to be Solved by the Invention> However, in the conventional thin-film magnetic head in which the extraction electrodes 9 and 10 are formed on the permalloy films 72 and 82, an accident that the extraction electrodes 9 and 10 are often peeled off occurs. Was.
In particular, an insulating film of Al 2 O 3 is formed on the surface of the main portion 101 made of Al 2 O 3 -TiC.
In the thin-film magnetic head having the structure with the electrode 102 attached thereto, in the region below the extraction electrodes 9 and 10, the extraction electrodes 9 and 10 were often peeled off with the insulating film 102 adhered. It is considered that the main causes of the peeling are the thermal stress of the copper bumps constituting the extraction electrodes 9 and 10 and the tensile stress of the permalloy films 72 and 82. That is, under the influence of the tensile stress P1 of the copper bumps constituting the extraction electrodes 9 and 10 and the tensile stress P2 of the permalloy films 72 and 82, the crack A is formed on the insulating film 102.
Is generated. Al 2 O 3 as the insulating film 102
In the case where is used, since a compressive stress P3 is generated, cracks are more easily generated due to an interaction between the tensile stresses P1, P2 and the compressive stress P3.
パーマロイ膜72、82を除去して、その引っ張り応力に
よる電極剥離を防止しようとすると、銅膜71、81がイオ
ンミリング等のドライエッチングに曝れて膜減りを起こ
し、断線もしくは電気抵抗増大を招く。If the permalloy films 72 and 82 are removed to prevent electrode peeling due to their tensile stress, the copper films 71 and 81 are exposed to dry etching such as ion milling, and the thickness of the copper films 71 and 81 is reduced, resulting in disconnection or an increase in electric resistance. .
そこで、本発明の課題は、上述する従来の問題点を解
決し、基体とリード導体膜との間に生じるストレスを小
さくし、取出電極剥離を防止し得る薄膜磁気ヘッドを提
供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a thin-film magnetic head which solves the above-mentioned conventional problems, reduces the stress generated between the base and the lead conductor film, and prevents the extraction electrode from peeling.
＜課題を解決するための手段＞ 上述した課題解決のため、本発明に係る薄膜磁気ヘッ
ドは、基体上に、磁性膜及びコイル導体膜を含む薄膜磁
気変換素子と、前記コイル導体膜に導通させたリード導
体膜と、前記リード導体膜に形成された取出電極とを有
する。<Means for Solving the Problems> In order to solve the above-described problems, a thin-film magnetic head according to the present invention is configured such that a thin-film magnetic conversion element including a magnetic film and a coil conductor film is provided on a substrate, and is electrically connected to the coil conductor film. And a lead electrode formed on the lead conductor film.
前記リード導体膜は、少なくとも前記取出電極を形成
する領域の表面層が銅膜となっている。前記取出電極
は、前記銅膜の上に設けられている。更に、前記リード
導体膜は、前記取出電極を形成した領域外の部分が、レ
ジスト膜によって覆われている。In the lead conductor film, at least a surface layer in a region where the extraction electrode is formed is a copper film. The extraction electrode is provided on the copper film. Further, a portion of the lead conductor film outside a region where the extraction electrode is formed is covered with a resist film.
＜作用＞ リード導体膜は取出電極を形成する領域の表面層が銅
膜であり、取出電極は銅膜の上に設けられていて、取出
電極の位置する領域には引っ張り応力の発生原因となる
パーマロイ膜が存在しない。しかも、取出電極の熱応力
はリード導体膜の展性により吸収される。このため、基
体表面層におけるクラック、それに伴う電極剥離が生じ
にくくなる。<Operation> In the lead conductor film, the surface layer of the region where the extraction electrode is formed is a copper film, and the extraction electrode is provided on the copper film, and the region where the extraction electrode is located causes a tensile stress. No permalloy film is present. Moreover, the thermal stress of the extraction electrode is absorbed by the malleability of the lead conductor film. For this reason, cracks in the substrate surface layer and accompanying electrode peeling are less likely to occur.
リード導体膜は、取出電極を形成した領域外の部分
が、レジスト膜によって覆われている。こうすることに
より、製造工程中におけるイオンミリング等のドライエ
ッチングによる膜減りが防止され、所定の膜厚及び電気
抵抗のリード導体膜を有する薄膜磁気ヘッドが得られ
る。A portion of the lead conductor film outside the region where the extraction electrode is formed is covered with a resist film. By doing so, film loss due to dry etching such as ion milling during the manufacturing process is prevented, and a thin-film magnetic head having a lead conductor film having a predetermined thickness and electric resistance is obtained.
本発明は、面内記録再生用薄膜磁気ヘッドに限らず、
垂直記録再生用薄膜磁気ヘッドにも適用が可能である。The present invention is not limited to the thin-film magnetic head for in-plane recording and reproduction,
It is also applicable to a thin film magnetic head for perpendicular recording and reproduction.
＜実施例＞ 第１図は本発明に係る薄膜磁気ヘッドの斜視図、第２
図は同じく取出電極部分の拡大断面図である。図におい
て、第10図〜第12図と同一の参照符号は同一性ある構成
部分を示している。図示するように、リード導体膜７、
８は取出電極を形成する領域の表面層が銅膜71、81とな
っており、取出電極９、10は銅膜71、81の上に設けられ
ている。図示はされていないが、銅膜71、81は下地膜を
有する。<Embodiment> FIG. 1 is a perspective view of a thin film magnetic head according to the present invention, and FIG.
The figure is an enlarged sectional view of the extraction electrode portion. In the drawings, the same reference numerals as those in FIGS. 10 to 12 indicate the same components. As shown, the lead conductor film 7,
Reference numeral 8 denotes a copper film 71, 81 in the surface layer of the region where the extraction electrode is formed, and extraction electrodes 9, 10 are provided on the copper films 71, 81. Although not shown, the copper films 71 and 81 have a base film.
12はフォトレジスト等によるレジスト膜である。リー
ド導体膜７、８は、取出電極９、10を形成した領域外の
部分が、このレジスト膜12によって覆われている。Reference numeral 12 denotes a resist film such as a photoresist. The portions of the lead conductor films 7 and 8 outside the regions where the extraction electrodes 9 and 10 are formed are covered with the resist film 12.
上述のように、取出電極９、10の位置する領域には引
っ張り応力の発生原因となるパーマロイ膜が存在しな
い。このため、基体１の表面層となる絶縁膜102におけ
るクラック、それに伴う電極剥離を確実に防止できるよ
うになる。As described above, there is no permalloy film in the regions where the extraction electrodes 9 and 10 are located, which causes tensile stress. For this reason, cracks in the insulating film 102 serving as a surface layer of the substrate 1 and accompanying electrode peeling can be reliably prevented.
しかも、リード導体膜７、８は、取出電極９、10を形
成した領域外の部分が、レジスト膜12によって覆われて
いるので、製造工程中におけるイオンミリング等のドラ
イエッチングによる膜減りが防止される。In addition, since the portions of the lead conductor films 7 and 8 outside the regions where the extraction electrodes 9 and 10 are formed are covered with the resist film 12, film loss due to dry etching such as ion milling during the manufacturing process is prevented. You.
上述のような構造を有するリード導体膜７、８及び取
出電極９、10は、この種の薄膜磁気ヘッド製造技術にお
いて周知のパターン形成技術によって簡単に製造でき
る。第３図〜第９図にその１例を示す。第３図〜第９図
では１つの薄膜磁気変換素子を示しているだけである
が、薄膜磁気ヘッド製造工程は、基体１をウエハーとし
て、薄膜磁気変換素子を多数個整列した状態で、工程が
進められる。The lead conductor films 7 and 8 and the extraction electrodes 9 and 10 having the above-described structures can be easily manufactured by a pattern forming technique well-known in this type of thin-film magnetic head manufacturing technique. 3 to 9 show one example. 3 to 9 show only one thin-film magnetic transducer, the thin-film magnetic head manufacturing process is performed in a state where a large number of thin-film magnetic transducers are aligned with the substrate 1 as a wafer. Can proceed.
まず、第３図の工程では、ウエハーである基体１上に
下部磁性膜２、ギャップ膜３、コイル導体膜５及び層間
の絶縁膜６等を形成した後、上部磁性膜を形成する前
に、銅膜71、81の上に、取出電極用のパターンP1が生じ
るようにパターンニングされたレジスト膜12を形成す
る。このレジスト膜12は絶縁膜６と同時に形成してもよ
いし、別工程で形成してもよい。First, in the step of FIG. 3, after the lower magnetic film 2, the gap film 3, the coil conductor film 5, the interlayer insulating film 6, etc. are formed on the substrate 1, which is a wafer, before the upper magnetic film is formed, On the copper films 71 and 81, a resist film 12 patterned so as to generate a pattern P1 for an extraction electrode is formed. This resist film 12 may be formed simultaneously with the insulating film 6, or may be formed in another step.
次に、第４図に示すように、取出電極用のパターンP1
をマスク13した上で、上部磁性膜４を形成する。Next, as shown in FIG. 4, the pattern P1 for the extraction electrode
Is masked, and then the upper magnetic film 4 is formed.
次に、第５図に示すように、マスク13を除去すると共
に、薄膜磁気変換素子の上に保護用としてレジストマス
ク14を付着させる。Next, as shown in FIG. 5, the mask 13 is removed, and a resist mask 14 is attached on the thin-film magnetic transducer for protection.
次に、第６図に示すように、銅メッキ処理を行なうこ
とにより、レジスト膜12によって画定されたパターンP1
内の銅膜71、81上に銅メッキ膜を成長させる。これによ
り、銅膜71、81の上に銅メッキ膜でなる取出電極９、10
が形成される。Next, as shown in FIG. 6, by performing a copper plating process, the pattern P1 defined by the resist film 12 is formed.
A copper plating film is grown on the copper films 71 and 81 therein. As a result, the extraction electrodes 9 and 10 made of a copper plating film are formed on the copper films 71 and 81.
Is formed.
この後、第７図に示すようにレジストマスク14を除去
した後、第８図に示すように、保護膜11をスパッタリン
グ等の手段によって形成し、次に第９図に示すように、
保護膜11の表面を研磨して、取出電極９、10の面出しを
行なう。Then, after removing the resist mask 14 as shown in FIG. 7, a protective film 11 is formed by means such as sputtering as shown in FIG. 8, and then as shown in FIG.
The surface of the protective film 11 is polished to expose the extraction electrodes 9 and 10.
上述した製造方法は１例であり、種々の製造方法をと
り得ることはいうまでもない。The above-described manufacturing method is an example, and it goes without saying that various manufacturing methods can be adopted.
＜発明の効果＞ 以上述べたように、本発明によれば、次のような効果
が得られる。<Effects of the Invention> As described above, according to the present invention, the following effects can be obtained.
（ａ）コイル導体膜に導通するリード導体膜は、取出電
極を形成する領域の表面層が銅膜となっており、取出電
極は前述の銅膜の上に設けられているので、基体とリー
ド導体膜との間に生じるストレスが小さくなり、取出電
極剥離などを生じにくい高信頼度の薄膜磁気ヘッドを提
供できる。(A) In the lead conductor film conducting to the coil conductor film, the surface layer in the region where the extraction electrode is formed is a copper film, and the extraction electrode is provided on the above-mentioned copper film. It is possible to provide a highly reliable thin-film magnetic head in which the stress generated between the thin-film magnetic head and the conductor film is reduced and the extraction electrode is not easily peeled off.
（ｂ）リード導体膜は、取出電極を形成した領域外の部
分が、レジスト膜によって覆われているので、所定の膜
厚及び電気抵抗のリード導体膜を有する薄膜磁気ヘッド
を提供できる。(B) Since the portion of the lead conductor film outside the region where the extraction electrode is formed is covered with the resist film, it is possible to provide a thin-film magnetic head having a lead conductor film of a predetermined thickness and electric resistance.
第１図は本発明に係る薄膜磁気ヘッドの要部の斜視図、
第２図は同じく取出電極部分の拡大断面図、第３図〜第
９図は本発明に係る薄膜磁気ヘッドの製造方法の１例を
示す図、第10図は従来の薄膜磁気ヘッドの要部における
斜視図、第11図は同じく要部の断面図、第12図は同じく
取出電極部分における拡大断面図である。 １……基体、２……下部磁性膜 ３……ギャップ膜、４……上部磁性膜 ５……コイル導体膜、６……絶縁膜 ７、８……リード導体膜、９、10……取出電極 12……レジスト膜、71、81……銅膜FIG. 1 is a perspective view of a main part of a thin film magnetic head according to the present invention,
FIG. 2 is an enlarged sectional view of an extraction electrode portion, FIGS. 3 to 9 are views showing an example of a method of manufacturing a thin film magnetic head according to the present invention, and FIG. 10 is a main part of a conventional thin film magnetic head. , FIG. 11 is a cross-sectional view of the main part, and FIG. 12 is an enlarged cross-sectional view of the extraction electrode part. DESCRIPTION OF SYMBOLS 1 ... Base | substrate 2, ... Lower magnetic film 3 ... Gap film, 4 ... Upper magnetic film 5 ... Coil conductor film, 6 ... Insulating film 7, 8 ... Lead conductor film, 9, 10 ... Extraction Electrode 12: Resist film, 71, 81: Copper film
Claims (1)
薄膜磁気変換素子と、前記コイル導体膜に導通させたリ
ード導体膜と、前記リード導体膜上に形成された取出電
極とを有する薄膜磁気ヘッドであって、 前記リード導体膜は、少なくとも前記取出電極を形成す
る領域の表面層が銅膜となっており、 前記取出電極は、前記銅膜の上に設けられており、 更に、前記リード導体膜は、前記取出電極を形成した領
域外の部分が、レジスト膜によって覆われていること を特徴とする薄膜磁気ヘッド。1. A thin-film magnetic transducer including a magnetic film and a coil conductor film on a base, a lead conductor film electrically connected to the coil conductor film, and an extraction electrode formed on the lead conductor film. In the thin-film magnetic head, the lead conductor film has a copper layer at least in a surface layer of a region where the extraction electrode is formed, and the extraction electrode is provided on the copper film. The thin-film magnetic head according to claim 1, wherein a portion of the lead conductor film outside a region where the extraction electrode is formed is covered with a resist film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2048540A JP2809466B2 (en) | 1990-02-28 | 1990-02-28 | Thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2048540A JP2809466B2 (en) | 1990-02-28 | 1990-02-28 | Thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03252908A JPH03252908A (en) | 1991-11-12 |
| JP2809466B2 true JP2809466B2 (en) | 1998-10-08 |
Family
ID=12806201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2048540A Expired - Lifetime JP2809466B2 (en) | 1990-02-28 | 1990-02-28 | Thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2809466B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63187412A (en) * | 1987-01-28 | 1988-08-03 | Fujitsu Ltd | Production of thin film magnetic head |
-
1990
- 1990-02-28 JP JP2048540A patent/JP2809466B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03252908A (en) | 1991-11-12 |
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