JPH0429421Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a test jig suitable for use in various evaluation tests of electronic components.

Conventionally, in the manufacturing process of electronic components having a large number of lead wires mounted on a lead frame, the first
As shown in the figure, one side of the lead terminal of the electronic component 6 is used as the common side frame 1, and the frame 2 on the side of the terminal piece 3 opposite to the common side frame 1 is used as the insulated side frame. Attaching the component lead terminal → Exterior → Evaluation test →
Processes such as characteristic evaluation are being carried out.

In this case, by continuously fixing the parts, significant labor savings are achieved in each process and between processes.
In such evaluation tests, it is necessary to examine the occurrence of failures of many parts over time, and in such continuous and highly packed conditions, it is not possible to check each component for failure one by one. The disadvantage is that it is extremely complicated and requires a lot of man-hours.

In view of this, the present invention provides a dummy lead on the insulating side frame, connects a fuse between the dummy lead and the main lead, and simultaneously uses the dummy lead as a terminal for damage checking. The main purpose is to propose a jig that enables checking.

An embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a diagram showing an embodiment of the present invention. The lead frame 1 is a common side frame commonly connected to each component lead, and is made of a metal plate, usually an iron plate with a thickness of 0.2 mm or less. A dummy lead 4 is provided on the insulating frame 2 made of cardboard, and a foil fuse 5 is connected between the component lead 3 and the dummy lead 4 by caulking. FIG. 3 is an enlarged view showing component leads 3, foil fuses 5, and dummy leads 4 arranged on the insulating side frame 2. FIG. 2 shows an example of application to a multilayer ceramic capacitor, in which a chip 10 of the multilayer ceramic capacitor is mounted (with terminals) on the insulating side frame 2 and the common side frame 1.

After the chip capacitor 6 is packaged in this state, several sets of insulating frames 2 are mounted on the jig, and the common frames 1 are connected at the same time.

Figure 4 shows the configuration of the evaluation test jig. In this jig, the connection terminal 8 of the dummy lead is provided corresponding to the dummy lead 4.
The positive power supply voltage terminal is connected to the common side lead 1.
The negative power supply voltage terminal is connected to the Therefore, the row of ceramic capacitors 6 is
After being installed in an evaluation jig, a voltage approximately four times the rated voltage is applied at a temperature of 85°C to confirm reliability. After a predetermined period of time has elapsed, a check is made to see if the component 6 has been destroyed.

Furthermore, the jig with the components 6 still mounted thereon is removed from the jig stand and placed on a check board having the structure shown in FIG. 5 in order to check whether each component 6 is broken. In this check board, a positive electrode is connected to the insulated lead terminal 3, a negative electrode is connected to the connection terminal 7 of the dummy lead 4, and an indicator lamp 11 is provided on the negative electrode side. In this case, by indicating that the third component 6 from the right has dielectric breakdown by not lighting the lamp 11, it is possible to check continuity between the leads of the insulated frame 2 and the dummy leads 4 at once. It is. Therefore, it is possible to check at once whether each part will be destroyed or not.

As described above, according to the present invention, one dummy lead is provided for each component on the insulating side frame, and the fuse for evaluation is sandwiched between the lead serving as the component terminal and the dummy lead. When a voltage is applied to this dummy lead and the common side frame and a component evaluation test is performed, a large current flows through the failed component and the fuse is cut, resulting in a destructive short circuit after applying voltage to the component. Components that have been tested can be immediately confirmed by checking the resistance continuity between the lead of the component terminal on the insulated side and the dummy lead.In this case, the lead frame can be checked by connecting the measurement terminal to the terminal of each lead while the lead frame is in the test state. have an effect. Further, by combining the present invention with an automatic switching device between terminals, automatic checking becomes possible.

Therefore, since the checking operation can be easily performed mechanically, the present invention has great advantages in terms of guaranteeing reliability and saving labor, and has great industrial effects.

[Brief explanation of the drawing]

Figure 1 is a diagram showing an example of a conventional evaluation test structure.
FIG. 2 is a diagram showing an embodiment of the present invention, FIG. 3 is a detailed diagram thereof, and FIGS. 4 and 5 are diagrams showing the implementation state of an evaluation test. 1... Common side frame, 2... Insulated side frame, 3... Insulated side lead terminal, 4... Dummy lead, 5... Foil fuse, 6... Electronic component, 7...
Connecting terminal.

Claims (1)

[Scope of utility model registration request] A test jig characterized in that one dummy lead is provided for each component on an insulating side frame, and a fuse for evaluation is sandwiched between the lead serving as a component terminal and the dummy lead.