JPH0232613Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Technical field of the invention This invention is a SIP-type electronic component taping that clamps the terminals of a large number of single in-line package-type electronic components (hereinafter abbreviated as SIP-type electronic components). In particular, SIP involves intervening multiple parallel conducting wires and insulating tape between the tapes, making it possible to test a large number of electronic components with the same power source.
The present invention relates to a tape for taping shaped electronic components.

(b) Prior Art and Problems Conventional SIP tape for taping electronic components is shipped in the form of a strip by sandwiching the terminals of a plurality of electronic components that have passed a predetermined inspection between two pieces of tape. ing. Therefore, the user cuts the terminals of the electronic component in order to separate the electronic component from the tape on which the terminal is taped. Electronic components separated in this way must be individually subjected to various tests and inspections. For example, during an aging test, a large number of electronic components are inserted one by one into test connectors, which requires a large number of man-hours, which poses problems such as hindering automation.

(c) Purpose of the invention In view of the above-mentioned conventional problems, the present invention interposes a plurality of parallel conducting wires and insulating tape between tapes for taping SIP type electronic components, and connects the terminals and conducting wires of the electronic components to the insulating tape. The object of the present invention is to provide a tape for taping SIP type electronic components, which enables spot welding through holes provided.

(d) Structure of the invention The SIP type electronic component taping structure of the present invention is an electronic component taping structure in which the terminals of multiple SIP type electronic components are sandwiched between the tapes. A conductive wire is pasted in the longitudinal direction, and the terminal of the electronic component is sandwiched between a second insulating tape and a third tape, which are adhered to the conductive wire, and the conductive wire of the second insulating tape and this electronic component are bonded to each other. A hole is provided at a position where the terminal of the component is to be electrically connected, and the terminal of the electronic component and the conductive wire are welded through the hole.

(e) Embodiments of the invention Examples of the SIP type electronic component taping tape according to the invention will be described in detail below with reference to the drawings.

FIG. 1 is a perspective view for explaining one embodiment of the present invention, in which 1 and 4 are tapes, 2 is a conducting wire pasted on the inner surface of tape 1, and 3 is a wire inserted between conducting wire 2 and tape 4. 5 is an electronic component, and 6 is a terminal of the electronic component 5.

Before all individual SIP type electronic components 5 are inspected and shipped, the terminals 6 of the large number of electronic components 5 are taped to facilitate packaging. In this taping, the tape 4 is first removed from the insulating tape 3, and the terminals 6 of the electronic components 5 are sandwiched between the insulating tape 3 and the tape 4 at right angles to the tape 4. It is designed to be shipped by being sandwiched between the two.

FIG. 2 is a perspective view for explaining an application example of the SIP type electronic component taping tape according to the present invention.
The same parts as in the previous figure are given the same symbols, 7 is the welding point between the conductor 2 and the terminal 6, 8 is the power supply,
9 is a terminal cutout line, and 61 is a terminal protruding from the tape. As shown in FIG. 1, at least more conductive wires 2 than the number of terminals 6 of the electronic component 5 are attached to the tape 1, and the positions of the intersections at which the conductive wires 2 and the terminals 6 of the electronic component 5 are to be connected are determined. It is fixed by welding.

When performing an aging test on the taped electronic component 5, for example, the terminal 6 of the electronic component 5 and the conductive wire 2 attached to the tape 1 are regularly spot welded to form welding points 7 and held in a band shape. A large number of electronic components can be easily aged by placing the heated electronic components 5 into a constant temperature bath (not shown) and connecting the conductive wire 2 to a power source 8. Further, when testing the electronic components 5 individually, it is sufficient to use the protruding terminals 61 from the tape 1. When using electronic components, for example, when mounting them on a printed circuit board,
It is sufficient to cut along the perforation line 9.

(f) Effects of the invention As is clear from the above explanation, the effects of the invention
If you use SIP type electronic component taping tape,
This has the advantage that tests, inspections, etc. can be performed efficiently and can be automated.

[Brief explanation of the drawing]

FIG. 1 is a perspective view for explaining an embodiment of the SIP type electronic component taping tape according to the present invention;
FIG. 2 is a perspective view for explaining an example of application of the present invention. In the figure, 1 and 4 are tapes, 2 is a conductor,
3 is an insulating tape, 5 is an electronic component, 6 is a terminal, 7 is a welding point, 8 is a power source, 9 is a terminal cutout line, and 61 is a protruding terminal.

Claims (1)

[Claims for Utility Model Registration] In a taping structure for an electronic component in which terminals 6 of a large number of single inline package-type electronic components 5 are sandwiched between tapes, a plurality of parallel conducting wires are arranged inside a first tape 1. A terminal 6 of the electronic component 5 is sandwiched between a second insulating tape 3 which is adhered to the conductor 2 in the longitudinal direction, and a third tape 4. A single hole is provided at a position where the conducting wire 2 and the terminal 6 of the electronic component 5 are to be electrically connected, and the terminal 6 of the electronic component 5 and the conducting wire 2 are welded through the hole. Taping structure for inline package type electronic components.