JPH04293253A - Sticking apparatus for adhesive tape onto semiconductor wafer - Google Patents

Abstract

PURPOSE:To manufacture a mounting frame by tightly bonding an adhesive tape onto a ring type frame extending over a semiconductor wafer in the omnidirections. CONSTITUTION:A ring type frame 3 is held on a lifting frame chuck table 2 while a semiconductor wafer W is held on a wafer chuck table 1 inside the table 2. On the other hand, the frame chuck table 2 is encircled by multiple radially displaceable tape tensioning members 4. An adhesive tape T is bonded onto the tape tensioning members 4 extending over the wafer W using a tape bonding roller 8 with the frame chuck table 2 in the lowered state and then the adhesive tape T is tensioned in the omnidirections by shifting the tape tensioning members 4 outward. Finally, the frame chuck table 2 is lifted up to bond the adhesive tape T onto the frame 3.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer adhesive tape attaching apparatus for attaching a semiconductor wafer to a ring-shaped frame via an adhesive tape to obtain a mounting frame in a pre-process of a semiconductor wafer scribing process.

0002

BACKGROUND OF THE INVENTION As the above-mentioned device, for example, Japanese Patent Laid-Open No. 2-5
As disclosed in Japanese Patent No. 1248, a ring-shaped frame held on a frame chuck table and a semiconductor wafer (hereinafter referred to as wafer) held on a wafer chuck table inside the ring-shaped frame are arranged on the same plane. However, the present applicant has proposed a method in which a tape application roller is run along the surfaces of the frame and the wafer to apply a wide adhesive tape over both.

0003

However, the above-mentioned conventional device has the following problems. In other words, in the conventional apparatus described above, back tension is applied to the adhesive tape feeding side to keep the adhesive tape under appropriate tension in order to prevent the adhesive tape from sagging or wrinkling.
Since this tension acts only in the longitudinal direction of the tape, some sagging may occur in the tape width direction.

[0004] The present invention was made in view of the above circumstances, and has no sagging in all directions.
It is an object of the present invention to provide an adhesive tape pasting device capable of pasting adhesive tape across a ring-shaped frame and a wafer.

[0005]

[Means for Solving the Problems] In order to achieve the above object, the present invention has the following configuration. That is, the semiconductor wafer adhesive tape pasting device according to the present invention includes a frame chuck table that holds a ring-shaped frame;
A wafer chuck table that holds a semiconductor wafer inside the frame chuck table; a plurality of tape tensioning members arranged in an annular shape surrounding the frame chuck table, each of which is movable radially; The frame chuck table is provided with a tape application roller that can run along the upper end, and is configured to be able to move downward from the tape application surface relative to the wafer chuck table and the tape tensioning member.

[0006]

[Function] The function of the present invention is as follows. For example, Figure 3
As shown in (b), the frame chuck table is lowered and the adhesive tape is pasted over the wafer on the wafer chuck table and the upper surface of the tape tensioning member surrounding the wafer, and then the frame chuck table is As shown, an outward force is applied to the tape tensioning member to tension the adhesive tape in all directions, and then the frame chuck table is raised to attach the frame to the tensioned adhesive tape from below.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an apparatus for attaching an adhesive tape to a semiconductor wafer according to the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a main part of an embodiment of the apparatus, and FIG. 2 is a longitudinal section thereof.

In the figure, reference numeral 1 designates a frame chuck table whose upper surface is configured as a vacuum suction surface, and holds a semiconductor wafer W in a positioned state. Reference numeral 2 denotes a cylindrical frame chuck table arranged to surround the frame chuck table 1, and a ring-shaped frame 3 is mounted and held in a positioned state on the ring-shaped upper end suction surface.

Reference numeral 4 denotes a tape tensioning member installed so as to further surround the frame chuck table 2 in an annular shape, and is divided into four parts in the circumferential direction and has a cylindrical shape as a whole. Each tensioning member 4 is directed to be able to slide in the radial direction relative to the wafer chuck table 1 via a pair of guide rails 5, and is urged to slide outward with an appropriate force by a spring 6. A screw shaft 7 that is rotated forward and backward by a motor (not shown) and spirally moves back and forth.
It is supported in contact with and prevented from moving outward. Further, the frame chuck table 2 is configured to be movable up and down relative to the wafer chuck table 1 and the tape tensioning member 4.

The basic configuration of the tape pasting device of this embodiment is as described above, and the pasting operation thereof will now be explained based on FIG. 3.

(a) Semiconductor wafer W and frame 3 are placed on wafer chuck table 1 and frame chuck table 2 at predetermined positions, respectively, and fixed by suction.

(b) With the frame chuck table 2 lowered, the tape applying roller 8 is run to apply the adhesive tape T across the tape tensioning member 4 and the wafer W.

(c) Next, by retracting the screw shaft 7 that was regulating the position of each tape tensioning member 4 outward, the restoring force of the spring 6 is applied to each tape tensioning member 4, and the adhesive tape Tense T in all directions. In this case, by controlling the spiral movement of each screw shaft 7, the tape tensioning member 4
It is possible to tension the two at the same time, or to sequentially tension a pair of diagonal positions. Further, by adjusting the strength of the spring 6 in advance, the tension force may be changed depending on the direction.

(d) Next, the frame chuck table 2
The frame 3 is brought into contact with the adhesive surface of the tensioned adhesive tape T, and then the pressure roller 9 and the disc cutter 10 are run along the frame 3 to cut out the adhesive tape T in a circular shape, and the mount frame is removed. obtain.

In the above embodiment, the tape tensioning member 4
Although the number of tape tensioning members 4 is set to four, it may be more than four, and an air cylinder or a cam mechanism may be arbitrarily selected as the means for moving the tape tensioning member 4 in the radial direction. Further, when the adhesive strength of the adhesive tape is weak, it is preferable to arrange a pinch roller above the tape tensioning member and expand the adhesive tape while pressing it against the upper surface of the tape tensioning member. Alternatively, the wafer W and the ring 3 may be attached after the adhesive tape T is tensed.

[0016]

As is clear from the above explanation, according to the present invention, the adhesive tape is tensioned in all directions by radially displacing the tape tensioning members surrounding the frame chuck table. Adhesive tape can be applied without sagging.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a main part of an embodiment of an apparatus for attaching an adhesive tape to a semiconductor wafer according to the present invention.

FIG. 2 is a longitudinal sectional side view showing the main parts of the embodiment device.

FIG. 3 is an explanatory diagram showing a pasting process.

[Explanation of symbols]

1...Wafer chuck table 2...Frame chuck table 3...Frame 4...Tape tensioning member 8...Tape application roller W...Semiconductor wafer T...Adhesive tape

Claims (1)

[Claims] 1. A frame chuck table that holds a ring-shaped frame, a wafer chuck table that holds a semiconductor wafer inside the frame chuck table, and annularly arranged surrounding the frame chuck table, The frame chuck table is provided with a plurality of tape tensioning members each movable in a radial direction and a tape application roller movable along the upper ends thereof, and the frame chuck table is moved relative to the wafer chuck table and the tape tensioning member. A device for applying an adhesive tape to a semiconductor wafer, characterized in that it is configured to be able to be displaced downward from a surface to which the tape is applied.