JPH0429006A - Packaging board inspection device - Google Patents

Abstract

PURPOSE:To evaluate the shape of only a solder part in detail by measuring height data and brightness data in components on a printed board, finding the quantity of variation of height data in a mask, and comparing the cumulative addition value of the brightness data on the solder part with a reference value. CONSTITUTION:In an image arithmetic processing means 113, the photocurrent signal 113 from a position detecting element is inputted to a position arithmetic circuit 202 through an A/D converter 201. The circuit 202 calculates the height data and stores them in a height data storage memory 203. Further, the brightness data are calculated by a brightness arithmetic circuit 204 and stored in a brightness data memory 205. A brightness cumulative arithmetic means 115 reads height data and brightness data only in mask data out of the memories 203 and 205 and outputs the cumulative addition value of the brightness data to a decision processing means 116. The means 116 compares the brightness data from the means 115 with a reference value from a memory 206 by a comparator 207 according to the mask data from the means 117 and a decision circuit 208 decides whether or not the solder part is normal based on the comparison data.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mounted board inspection device for inspecting mounting defects in soldering on a printed circuit board on which components are mounted.

BACKGROUND OF THE INVENTION Conventionally, inspection of soldered parts on printed circuit boards has relied on visual inspection by humans. However, as products become smaller and lighter, components on printed circuit boards are also becoming smaller and more densely packaged. Under these circumstances, it has become difficult for humans to perform visual inspections, and there is a strong desire to automate inspections.

As one method, Japanese Patent Application No. 63-45206 proposes that a two-dimensional camera uses luminance data to determine the quality of the solder portion from the cumulative frequency distribution of luminance.

FIG. 9 shows the cumulative frequency distribution of good and defective solder products, with the horizontal axis representing the brightness class and the vertical axis representing the cumulative frequency of brightness. Since a good solder part has many parts with high brightness, it exhibits a distribution characteristic like the cumulative frequency distribution 901 of long parts. Since a defective solder part has many parts with dark brightness, it exhibits a distribution characteristic like the cumulative frequency distribution 902 of the defective part. As shown in FIG. 9, good products and defective products can be distinguished because their distribution characteristics are different.

Problems to be Solved by the Invention However, in the inspection method shown in the conventional example, the curve of the cumulative frequency distribution varies depending on the positional shift of the component, the amount of solder, etc.
Unable to make reliable judgments.

Another problem is that it is difficult to distinguish between good and bad characteristics unless the lighting conditions are optimal. Furthermore, in order to optimize the illumination unevenness depending on the position on the printed circuit board and the illumination conditions, there is also the problem that it is necessary to divide the image into minute areas and take images.

The first purpose of the present invention is to simultaneously measure the height data and brightness data of the soldering part without being influenced by component positional deviation or lighting conditions, and to measure the height data of the board-soldering part part. Calculate the amount of change (difference value) in the area above, accumulate the brightness data in the good/defective areas distinguished by the difference value, and use the cumulative value of brightness to determine whether the soldering is good or bad. The second purpose is to accumulate luminance data using a correlation that uses height data and the difference value between height data as two variables, and use the accumulated luminance value to determine the details of soldering. It is to evaluate the

Means for Solving the Problems In order to solve the above problems, the technical solutions of the present invention firstly include a transport means for moving a printed circuit board on which components are mounted, and a means for transmitting laser light from a laser light source to a polygon mirror and f.
a laser beam scanning means for scanning the printed circuit board with a θ lens; and a reflecting mirror provided between the printed circuit board and the fθ lens, which reflects scattered light obtained by being reflected from the printed circuit board by scanning the laser beam. a scattered light reflecting means for reflecting the light through the fθ lens and the polygon mirror; and a light amount for further focusing the scattered light from the scattered light reflecting means on a position detection element using a condensing lens and outputting a photocurrent signal. a detection means, an image calculation means for calculating brightness data and height data of the printed circuit board or the parts mounted on the printed circuit board and the soldered parts based on the photocurrent signal from the light amount detection means, and the mounted parts. For soldering, there is a mask storage means for storing mask data for processing a plurality of predetermined sizes of masks at part positions, and the brightness data calculated by the image calculation means is stored only in the mask data from the mask storage means. A brightness cumulative calculation means for cumulatively adding the brightness cumulative value calculated by the brightness cumulative calculation means and a predetermined reference value is compared for each mask data from the mask storage means, and the soldering of the components on the printed circuit board is performed. The attachment is equipped with a determination processing means for determining whether the condition is good or bad,
The luminance cumulative calculation means includes a difference calculation circuit that calculates the amount of change (difference value) in the height data calculated by the image calculation means, and cumulatively adds the brightness data using the difference value calculated by the difference calculation circuit. A cumulative addition circuit is provided which is controlled to perform or not perform the calculation.

Secondly, in the luminance accumulation calculation means, in the correlation where the difference value between the height data calculated by the image calculation means and the height data calculated by the difference calculation circuit is used as two variables instead of the cumulative addition circuit, A correlation luminance accumulation circuit is provided that cumulatively adds luminance data in a predetermined non-defective area and a defective area.

Function The present invention first scans the entire surface of a printed circuit board on which components are mounted using a laser beam, and guides the scattered light obtained by reflection from the printed circuit board to a position detection means using a reflecting mirror, thereby determining the height of the printed circuit board. The focused position of the scattered light on the position detection element, which changes according to the unevenness, is detected using a photocurrent signal, and from the photocurrent signal, the brightness data of the parts and soldered parts mounted on the printed circuit board are determined by image processing means. Calculate height data.

The calculated brightness data and height data are input to the brightness accumulation calculation means, and the judgment processing means compares the brightness data of the soldering part cumulatively added by the brightness accumulation calculation means with a predetermined reference value. In the luminance cumulative calculation means, the amount of change (difference value) in the height data input only in the mask data from the mask storage means set in the soldering section is used to judge the quality of the soldering state. is calculated by a difference calculation circuit, and depending on the magnitude of the difference value, the cumulative addition circuit controls whether or not to cumulatively add the luminance data. The data is accumulated and the soldering part is judged to be good or bad.

Secondly, the luminance cumulative calculation means calculates the difference value of the height data calculated by the image calculation means only within the mask data from the mask storage means set to the soldering part position, and calculates the difference value of the height data calculated by the image calculation means. In correlation using data and difference values as two variables, luminance data in a predetermined non-defective area and defective area are cumulatively added, and the cumulative luminance value in each area and a predetermined reference value are determined for each mask data. The processing means compares the results and determines whether the soldering condition of the parts is good or bad.

EXAMPLE A first example of the present invention will be described below with reference to FIG.

FIG. 1 is a block diagram showing a first embodiment of the mounted board inspection apparatus of the present invention. In FIG. 1, 101 is a printed circuit board, 102 is a component mounted on the printed circuit board 101, 103 is a transport means for moving the printed circuit board 101, and 104 is an arrow indicating the direction of movement thereof.

105 is a laser light source, 106 is a laser beam from the laser light source 106, 107 is a polygon mirror, 108 is a reflecting mirror that guides the laser beam to the polygon mirror 107, 109 is an fθ lens, and 110 is a reflecting mirror. 111 is a condensing lens, 112 is a position detection element, 113 is a position detection element 112
114 is an image calculation processing means for converting the position signal 113 into component height data and brightness data; 115 is an image calculation processing means that uses the height data and brightness data from the image calculation processing means 114 to perform a soldering process. 116 is a determination processing means for determining whether the soldering condition of the component 102 on the printed circuit board 101 is good or bad; 117 is a determination processing means for determining whether the soldering condition of the component 102 is predetermined on the component position; This is mask storage means for storing a plurality of mask data.

The operation will be explained below.

While the printed circuit board 101 on which the component 102 is mounted is moved in the direction of the arrow 104 by the transport means 103, the laser beam 106 from the laser light source 105 is directed onto the rotating polygon mirror 107 using three reflecting mirrors 108. The printed circuit board 101 is irradiated with a laser beam 106 perpendicularly by a polygon mirror 1.07 and an fθ lens 109. As a result, the laser beam 106 appears on the printed circuit board 101.
Scan the entire area two-dimensionally.

A reflective mirror 1 installed between the printed circuit board 101, which is the object to be inspected, and the fθ lens 109 absorbs the scattered light reflected from the printed circuit board 101 by scanning the laser beam 106.
10, fθ lens 109 and polygon mirror 1.
07, and further passes through a condensing lens 111, and is condensed onto a position detection element 112. The position signal 113 from the position detection element 112 is input to the image calculation processing means 114 .

The image calculation processing means 114 converts the position signal 113 input at the timing of the synchronization signal into the printed circuit board 1o1 and the components 102 and 10 mounted on the printed circuit board 101.
In soldering 2, calculation is performed to convert the height data and brightness data of the part, and the brightness data and height data are output to the brightness accumulation calculation means 116.

In the luminance accumulation calculation means 116, the image calculation processing means 114
The height data and brightness data calculated in are extracted only within the mask data from the mask storage means 117 set at the position of the soldering area, and the brightness data is cumulatively added under control using the difference value of the height data. , the cumulative addition value is determined by the processing means 1
Output to 16.

The determination processing means 116 compares the luminance data of the solder portion cumulatively added by the luminance accumulation calculation means 116 with a predetermined reference value for each mask, and determines whether the soldering of the component 102 on the printed circuit board 101 is in the correct condition. It is used to judge quality.

By repeating and sequentially performing the above operations, the entire surface of the printed circuit board 101 can be inspected. This series of operations needs to be performed in synchronization using an appropriate signal, and in this embodiment, synchronization was achieved using a synchronization signal synchronized with the rotation of the polygon mirror 107. By adopting such a configuration, height measurement can be performed at higher speed and with higher precision than in a configuration in which spot scanning is performed using a laser beam using means such as a galvanometer mirror.

Next, the image calculation processing means 114 and the luminance accumulation calculation means 11
6 and the determination processing means 116 will be explained in more detail using FIGS. 2 and 3.

As shown in FIG. 2, the image calculation processing means 114 converts the photocurrent signal 113 from the position detection element 112 into a digital signal using an A/D converter 201, and inputs the digital signal to the position calculation circuit 202. In this embodiment, the position detection element is a PSD (position-sensitive detector).
The current flowing through the electrodes at both ends of the element is inversely proportional to the distance between each electrode, and the position of incidence on the PSD is such that the current flowing through the electrodes at both ends of the element is inversely proportional to the distance between each electrode. In the position calculation circuit 202,
Currents 11 and I2 from both electrodes converted into digital signals are used to calculate height data using equation (1). Note that K is a coefficient for normalization.

Height data 2K・(It I2)/(II +I2)
(1) The height data obtained by the position calculation circuit 202 is stored in the height data storage memo 1J203.

On the other hand, the brightness data is based on the currents I and I2 from both electrodes.
is calculated by the brightness calculation circuit 204 using equation (2).

Brightness data = 1. +I2...
(2) The brightness data obtained by the brightness calculation circuit 204 is -
The brightness data is then stored in the brightness data storage memo IJ 205.

In the luminance cumulative calculation means 116, the height data storage memory 2
03 and the brightness data storage memory 206, height data and brightness data are extracted only within the mask data from the mask storage means 117 set at the position of the soldering area, and the brightness is controlled by the difference value of the height data. The data are cumulatively added and the cumulatively added value is output to the determination processing means 116.

In the determination processing means 116, the brightness data of the solder portion cumulatively added by the brightness accumulation calculation means 116 and the reference value from the reference data storage memory 206 are compared in a comparison circuit 207 according to the mask data from the mask storage means 117, It is output to the determination circuit 208 as the differential comparison data. The determination circuit 208 determines the quality of the soldered parts based on the comparison data from the comparison circuit 207 based on the magnitude of the comparison data.

FIG. 3 shows a detailed block diagram of the luminance accumulation calculation means 115, and will be described in more detail.

In FIG. 3, 301 and 302 are the height data and brightness data calculated by the image calculation processing means, 303 is a difference calculation circuit that calculates the difference between the height data 301, 304 is a comparison circuit, and 306 is the value of the difference. Difference threshold storage means for specifying a comparison range; 306 and 307 are cumulative addition circuits A; 13, 309 and 310 are cumulative addition values C and D calculated and output by cumulative addition circuits A 306 and B 507;

The operation will be explained below.

The difference calculation circuit 303 calculates the amount of change (difference value) in the height data 301 inputted from the image calculation processing means, and outputs the difference value to the comparison circuit 304. In this embodiment, the difference calculation circuit 303 calculates the difference in height data in the direction from the board to the component.

The comparison circuit 304 compares the difference value calculated by the difference calculation circuit 303 with the threshold value from the difference threshold storage means 305, and if the difference value is within the range determined by the threshold value, the luminance data 302 is sent to the cumulative addition circuit. A control signal for cumulative addition is output, and if it is outside the range, a control signal for not cumulative addition is output.

In this embodiment, two types of ranges determined by the threshold values from the difference threshold storage means 305 are set, and the comparison circuit 304 compares the difference values output from the difference calculation circuit 303 to see if they are within the two types of ranges. A control signal indicating whether or not to perform cumulative addition is output to the two cumulative addition circuits A306 and B2O which correspond to two types of ranges. in particular,
The cumulative addition circuit 306 cumulatively adds the luminance data when the difference value is greater than 0 and smaller than the threshold A1, and the cumulative addition circuit B507 cumulatively adds the luminance data when the difference value is a negative value and the absolute value is smaller than the threshold A2. In this case, the luminance data is cumulatively added.

Through the above operations, the cumulative addition circuits A 306 and B 507
Cumulative addition values C309 and B3 of the brightness data of the solder part from
10 is output, and by evaluating the value of this accumulated luminance data, it is possible to inspect whether the soldering condition of the component is good or bad.

That is, when the solder portion 402 of the component 403 mounted on the board 401 is in good condition as shown in FIG. 4(b), the brightness data shown in FIG. 4(a) indicates that the solder portion 402 becomes dark, the metal portion 404 of the component 403 appears bright and shiny, and the height data difference profile 406 in the X direction shown in FIG. 4(c) is obtained. In this case, in the difference profile 405, the threshold value A is larger than ○.
, 40B (hatched area 41o) can be cumulatively added, and brightness data of the metal portion 404 of the component 403 that shines brightly can be excluded from being accumulated even if the component is misaligned. Therefore, only the solder portion 402 can be evaluated. At this time,
Since there are almost no negative values in the difference value, the cumulative addition value C30
9 is the cumulative value of the dark area luminance data, and the cumulative value D31
The value of 0 is very small and close to 0. Double arrow (Guya)
The range shown in 4OS indicates the range of mask data from the mask storage means set in the soldering section, and
As shown in the brightness data in Figure (a), a mask 4o7 (dashed line area) is set on the board 401, solder portion 402, and component 403, and height data and brightness data only within this mask are used for calculations. . Also, threshold values A1408 and A240
9 set a value of 100 for the height of the part.

Next, if the solder portion 602 of the component 603 mounted on the board 601 is in a defective state due to so-called potato solder as shown in FIG. 6(b), the brightness data shown in FIG. 5(a) In this case, the solder portion 602 shines brightly near the center, and the outside appears dark, and a difference profile 605 in the X direction of the height data shown in FIG. 5(c) is obtained. In this case, in the difference profile 606, the luminance data in the range (shaded area 508) that is larger than ○ and smaller than threshold A and 506 is cumulatively added to the cumulative addition circuit in step 306, and the absolute value of the negative value is smaller than threshold value A2607. Small range (hatched area 60
The luminance data of 9) is cumulatively added by the cumulative addition circuit B507, and the respective cumulative addition values C and D are outputted to the determination processing means. In this way, in the case of potato soldering, there are also negative values in the height data difference value, and the cumulative value of the luminance data becomes sharp regardless of whether the difference value is positive or negative. If the brightness data shines brightly due to dirt even though the solder is in good condition, the cumulative value of the brightness data will be large only in the part where the difference value is positive, so it can be distinguished from the potato solder condition and misjudgment can be avoided. I can do it. In this way, the quality of the soldering can be inspected by cumulatively adding the luminance data of the soldering part based on the difference value of the height data of the soldering part.

As described above, according to this embodiment, soldering is performed based on the difference calculation circuit that measures the height data and brightness data of the part and calculates the amount of change in the height data, and the difference value from the difference calculation circuit. By providing a cumulative addition circuit that cumulatively adds luminance data, it is not affected by lighting conditions or component misalignment.
For soldering, only the parts where the part is formed with a gentle positive gradient from the board to the component are treated as cumulative sums of the brightness data of non-defective parts, so even the shape of the solder can be inspected in detail.

Next, a second embodiment of the present invention will be described with reference to FIG. 6. FIG. 6 is a block wiring diagram showing the luminance accumulation calculation means of the second embodiment of the mounted board inspection device of the present invention. be. The second embodiment of the present invention is the same as the configuration shown in FIGS. 1 and 2 in the first embodiment of the present invention except for the luminance accumulation calculation means shown in FIG. omitted.

In FIG. 6, 301 and 302 are height data and brightness data calculated by the image calculation processing means, 601 is a difference calculation circuit that calculates the difference between height data 3o1, 602 and 604 are comparison circuits A and B, 603 605 is a height threshold storage means, and 606 and 607 are cumulative addition circuits C and D.

The operation will be explained below.

The difference calculation circuit 601 calculates the amount of change (difference value) in the height data 301 between the height data 301 and the brightness data Z302 extracted from the image calculation processing means based on the mask data 30B from the mask storage means. Then, the difference value is outputted to the comparison circuit 602. In this embodiment, the difference calculation circuit 601 calculates the difference in the height data in the direction from the board to the soldering part and the component.

The comparison circuit A602 compares the difference value calculated by the difference calculation circuit 601 with the threshold value from the difference threshold value storage means 603, and if the difference value is within the range determined by the threshold value, the difference value is sent to the cumulative addition circuits C606 and B6O7. It outputs a signal of 1", and if it is outside the range, it outputs a signal of "0". On the other hand, comparison circuit B
At 604, the height data 301 and the height threshold storage means 60
If the height data is within the range determined by the threshold, the cumulative addition circuit C606 and [1607
A signal of "1" is output to the signal, and a signal of "0" is output if it is outside the range.

The cumulative addition circuit C606 cumulatively adds the luminance data 302 for each mask based on the mask data 30B only when the outputs from the comparison circuits A 602 and B2O2 are both "1". Further, the cumulative addition circuit D 607 determines for each mask based on the mask data 308 that if the outputs from the comparison circuits A 602 and B2O2 are both other than 1'', that is, (A
, -B), (1,o), (o,
1), (0, o) In the case of o, the luminance data 302 is cumulatively added.

Through the above operations, the cumulative value of the brightness of the solder part from each cumulative addition circuit is input to the judgment processing means, and by evaluating the value of this cumulative brightness data, it is possible to determine whether the soldering condition of the component is good or bad. Can be inspected in detail.

Further, a specific example will be explained using FIGS. 7 and 8.

Figure 7 is a diagram showing the soldering condition of a non-defective product.
) is the brightness data of the soldered part of the part, (b) is the cross-sectional view,
(C) shows a correlation diagram between height data and difference values, which is the basis of the present invention. A substrate 70 as shown in FIG. 7(b)
If the solder portion 702 of the component 703 mounted on the component 703 is in good condition, the brightness data shown in FIG. Moreover, the correlation diagram between the height data (Z) and the difference value (Z) shown in FIG. 7(c) is obtained. Here, Z, 705 is the average height of the board, A2706 is the average height on the component, and the measured data is indicated by an X mark. Further, the difference thresholds were set to 0707 and A70B, and the height thresholds were set to A709 and A710. It is desirable to vary the values of these threshold values appropriately depending on the height of the component and the degree of variation in the measured height data on the board and components (value of standard deviation: σ), but in this example, A3708 is Sano-, A4709, and A3710 were set to values that were approximately 2×σ higher than the respective average values Z1 and A2.

In the correlation diagram of Figure 7(c), since the soldering is in good condition, each measurement data of the soldered part is distributed between the respective heights of the board and the component, and the difference value is also a positive value. A37
It is distributed in the area indicated by S1711, which is not very large and is smaller than 08.

Therefore, in the comparison circuit A that compares the difference values, since data enters between 0γ07 and A3708 indicated by the difference threshold, a signal of "1" is output for each data, and in the comparison circuit B, the height data is A4709 to A3 indicated by threshold value
710, a signal of 1 is output for each data, and the cumulative addition circuit C606 cumulatively adds the luminance data of the dark area.

Further, since data is not distributed in areas 52712 and 53713, the cumulative addition circuit D607 does not accumulate luminance data, and the luminance cumulative value becomes zero. Based on these values, the determination processing means determines that the soldering is good.
Even if 04 is located widely within the mask, the luminance data of that portion can be excluded so as not to be accumulated, and only the solder portion 702 can be evaluated.

Next, FIG. 8 (
(a) shows the brightness data of a so-called potato solder with defective soldering, (b) shows a cross-sectional view, and (c) shows a correlation diagram between height data and difference values. If the solder portion 802 of the component 803 mounted on the board 801 has a soldering defect as shown in FIG. 8(b), the brightness data shown in FIG. 8(a) indicates that the solder portion 802 The vicinity of the center shines brightly, and the outside appears dark, and the correlation diagram between the height data (Z) and the difference value (ΔZ) shown in FIG. 8(c) is obtained. Threshold values A3 to A5 and Zl, A2, each area 5I-83 in the figure
are the same as in the case of FIG. 7(c), so the same numbers are given and the explanation is omitted.

In the correlation diagram in Figure 8(c), since the solder is in a soldered state, each measurement data of the solder part is distributed between the respective heights of the board and the component, but the difference value is in the part with a gentle upward slope. The data is distributed in the area S, 711, the area 83713 in the downward slope part that is characteristic of potato solder, and the area 82712 in the steep positive slope part near the end of the component.

Therefore, in the good area cumulative addition circuit C, the sum of the cumulative values of the brightness data of the area S, 711 where a small number of data are distributed and the brightness data of the double head area of the area 52712 with a steep positive slope is output, and the judgment process is performed. In the method, since the luminance cumulative value is large in both the good and bad areas, it is determined that the soldering part is defective.
Effects similar to those of the first embodiment of the present invention can be obtained.

In this embodiment, two types of cumulative adding circuits, a cumulative adding circuit for a good area and a cumulative adding circuit for a defective area, are provided in the brightness cumulative calculation means, and the cumulative brightness values are outputted to the determination processing means, respectively. The type and number of cumulative addition circuits does not limit the present invention, and cumulative addition circuits in defective areas are further classified into negative difference areas (S3) such as potato solder.
The luminance may be separately accumulated and the accumulated luminance value may be output to the determination processing means, thereby making it possible to inspect the condition of the soldered part in even more detail.

As described above, according to this embodiment, in soldering, the height data and brightness data of the part are measured, the amount of change (difference value) in the height data is calculated, and the height data and the difference value are converted into two variables. In this correlation, by providing a luminance accumulation calculation means that calculates the cumulative value of the luminance data of each data distributed in the non-defective area and the defective area and outputs these values to the determination processing means,
Regardless of lighting conditions or component misalignment, consider the cumulative value of brightness data for non-defective parts only where the soldering part is formed with a gentle positive gradient from the board to the component. Therefore, even the shape of the solder can be inspected in detail.

Effects of the Invention As described above, the effects of the present invention are as follows: First, for parts and soldering on a printed circuit board, the height data and brightness data of the entire area are measured, and the soldering is set at the position of the part. Find the amount of change (difference value) in the height data only within the mask,
By controlling the difference value to cumulatively add the brightness data of the soldered area, and comparing the cumulatively added value with the reference value to determine the soldering condition of the component, you can eliminate the need to rely on Iruma's visual inspection. Furthermore, the shape of only the solder portion can be evaluated in detail without being affected by lighting conditions or component positional deviations.

Second, in the correlation using the height data and the difference value between the height data as two variables, the cumulative value of each luminance data in the predetermined non-defective area and defective area is calculated, and the cumulative luminance value and the reference value are calculated. By comparing and determining the soldering condition of the parts, the soldering condition of the soldering part can be grasped by the cumulative brightness value within each area of good/bad soldering, and the more detailed soldering condition can be inspected. It becomes possible.

[Brief explanation of drawings]

Fig. 1 is a block wiring diagram of a mounted board inspection device according to the first embodiment of the present invention, Figs. 2 and 3 are detailed block wiring diagrams of main parts of Fig. 1, and Figs. 4 and 7 are good. Figures 6 and 8 are diagrams showing brightness, height, and height difference data for defective soldering conditions. FIG. 6 is a detailed block diagram of the main parts of the mounting board inspection apparatus according to the second embodiment of the present invention, and FIG. 9 is a characteristic diagram of the cumulative frequency distribution of conventional soldering inspection. 1o1... Printed circuit board, 102... Parts, 103
...Conveying means, 106...Laser light source, 107...
・Polygon mirror 109...fθ lens, 11o・
... Reflection mirror 111 ... Condensing lens, 112 ...
Position detection element, 114... Image calculation processing means, 116
. . . Luminance cumulative calculation means, 116 . . . Judgment processing means,
117...Mask storage means. Name of agent: Patent attorney Shigetaka Awano and one other person Kazuturi Kogun-ryu Ito-113 -' Figure cumulative power 11 Calculated value 0 609' Cumulative added value D Figure (a) CC) Figure (a) Figure 6 Fig. 302 Busy 1 ball (teta 604 +:'; i sa teta judgment processing means ~ Fig. 8 (a) 70!:) / U so / 10 Fig. 8 (a) (b) tu''v luy /IU

Claims (2)

[Claims] (1) A transport means for moving a printed circuit board on which components are mounted; a laser beam scanning means for scanning a laser beam from a laser light source onto the printed circuit board using a polygon mirror and an fθ lens; a scattered light reflecting means for reflecting scattered light obtained by reflection from a printed circuit board on a reflective mirror provided between the printed circuit board and the fθ lens, and reflecting the scattered light through the fθ lens and the polygon mirror; A light amount detection means for further condensing the scattered light from the light reflection means onto a position detection element using a condensing lens and outputting a photocurrent signal, and mounting on the printed circuit board or printed circuit board using the photocurrent signal from the light amount detection means. image calculation means for calculating brightness data and height data of the mounted components and soldered portions; and a mask for storing mask data for performing multiple mask processing of predetermined arbitrary sizes on the soldered portion positions of the mounted components. a storage means, a brightness cumulative calculation means for cumulatively adding the brightness data calculated by the image calculation means only within the mask data from the mask storage means, and a brightness cumulative value calculated by the brightness cumulative calculation means and a predetermined a determination processing means for comparing each mask data from the mask storage means with a reference value to determine whether the soldering state of the components on the printed circuit board is good or bad; a difference calculation circuit that calculates a difference value that is the amount of change in the height data calculated by the means; and an accumulation addition circuit that controls whether or not to cumulatively add the luminance data based on the difference value calculated by the difference calculation circuit. Mounted board inspection equipment equipped with. (2) In the luminance cumulative calculation means, instead of the cumulative addition circuit, a predetermined correlation is performed in which the difference value between the height data calculated by the image calculation means and the height data calculated by the difference calculation circuit is used as two variables. 2. The mounted board inspection apparatus according to claim 1, further comprising a correlation luminance accumulation circuit for cumulatively adding luminance data in a non-defective area and a defective area.