JPH04283236A - Production of soluble polyimide - Google Patents
Production of soluble polyimideInfo
- Publication number
- JPH04283236A JPH04283236A JP7031391A JP7031391A JPH04283236A JP H04283236 A JPH04283236 A JP H04283236A JP 7031391 A JP7031391 A JP 7031391A JP 7031391 A JP7031391 A JP 7031391A JP H04283236 A JPH04283236 A JP H04283236A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- mol
- reaction
- polyisoimide
- soluble polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 35
- 239000004642 Polyimide Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000003960 organic solvent Substances 0.000 claims abstract description 20
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 20
- 238000006243 chemical reaction Methods 0.000 claims description 32
- 239000000126 substance Substances 0.000 claims description 15
- 150000003512 tertiary amines Chemical class 0.000 claims description 9
- 239000004952 Polyamide Substances 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 125000005044 dihydroquinolinyl group Chemical class N1(CC=CC2=CC=CC=C12)* 0.000 claims 1
- 229920000642 polymer Polymers 0.000 abstract description 11
- IRFSXVIRXMYULF-UHFFFAOYSA-N 1,2-dihydroquinoline Chemical compound C1=CC=C2C=CCNC2=C1 IRFSXVIRXMYULF-UHFFFAOYSA-N 0.000 abstract description 6
- 125000000962 organic group Chemical group 0.000 abstract description 4
- 238000000746 purification Methods 0.000 abstract description 4
- 150000001412 amines Chemical class 0.000 abstract description 3
- 238000001556 precipitation Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 56
- 238000000034 method Methods 0.000 description 19
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 14
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 13
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 239000010408 film Substances 0.000 description 10
- 238000000862 absorption spectrum Methods 0.000 description 9
- VZUHQRBBQSLSHS-SSZFMOIBSA-N Isoimide Chemical compound C1=CC(Br)=CC=C1\N=C/1C(CCCC2)=C2C(=O)O\1 VZUHQRBBQSLSHS-SSZFMOIBSA-N 0.000 description 8
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 7
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 150000004985 diamines Chemical class 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- GKQLYSROISKDLL-UHFFFAOYSA-N EEDQ Chemical compound C1=CC=C2N(C(=O)OCC)C(OCC)C=CC2=C1 GKQLYSROISKDLL-UHFFFAOYSA-N 0.000 description 5
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 5
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 4
- -1 fatty acid halide Chemical class 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- YLHUPYSUKYAIBW-UHFFFAOYSA-N 1-acetylpyrrolidin-2-one Chemical compound CC(=O)N1CCCC1=O YLHUPYSUKYAIBW-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- HWWYDZCSSYKIAD-UHFFFAOYSA-N 3,5-dimethylpyridine Chemical compound CC1=CN=CC(C)=C1 HWWYDZCSSYKIAD-UHFFFAOYSA-N 0.000 description 2
- MFEIKQPHQINPRI-UHFFFAOYSA-N 3-Ethylpyridine Chemical compound CCC1=CC=CN=C1 MFEIKQPHQINPRI-UHFFFAOYSA-N 0.000 description 2
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000007810 chemical reaction solvent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 125000005462 imide group Chemical group 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- ADFXKUOMJKEIND-UHFFFAOYSA-N 1,3-dicyclohexylurea Chemical compound C1CCCCC1NC(=O)NC1CCCCC1 ADFXKUOMJKEIND-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- YFOOEYJGMMJJLS-UHFFFAOYSA-N 1,8-diaminonaphthalene Chemical compound C1=CC(N)=C2C(N)=CC=CC2=C1 YFOOEYJGMMJJLS-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- JVLRBIADOALMLB-UHFFFAOYSA-N 2-ethoxy-1,2-dihydroquinoline Chemical compound C1=CC=C2C=CC(OCC)NC2=C1 JVLRBIADOALMLB-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- DZLUPKIRNOCKJB-UHFFFAOYSA-N 2-methoxy-n,n-dimethylacetamide Chemical compound COCC(=O)N(C)C DZLUPKIRNOCKJB-UHFFFAOYSA-N 0.000 description 1
- XWKFPIODWVPXLX-UHFFFAOYSA-N 2-methyl-5-methylpyridine Natural products CC1=CC=C(C)N=C1 XWKFPIODWVPXLX-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LPBHYOYZZIFCQT-UHFFFAOYSA-N 2-methylpropyl 2-(2-methylpropoxy)-2h-quinoline-1-carboxylate Chemical compound C1=CC=C2N(C(=O)OCC(C)C)C(OCC(C)C)C=CC2=C1 LPBHYOYZZIFCQT-UHFFFAOYSA-N 0.000 description 1
- PXSFFHCHRCZARW-UHFFFAOYSA-N 2-methylpropyl 2-ethoxy-2h-quinoline-1-carboxylate Chemical compound C1=CC=C2N(C(=O)OCC(C)C)C(OCC)C=CC2=C1 PXSFFHCHRCZARW-UHFFFAOYSA-N 0.000 description 1
- DBRHBGTVTSQIQK-UHFFFAOYSA-N 2-methylpropyl 2-methoxy-2h-quinoline-1-carboxylate Chemical compound C1=CC=C2N(C(=O)OCC(C)C)C(OC)C=CC2=C1 DBRHBGTVTSQIQK-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- FPHRTSFRLFDOHZ-UHFFFAOYSA-N 3-[[4-[3-aminopropyl(dimethyl)silyl]phenyl]-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)C1=CC=C([Si](C)(C)CCCN)C=C1 FPHRTSFRLFDOHZ-UHFFFAOYSA-N 0.000 description 1
- MEJQNPUKRTVBDA-UHFFFAOYSA-N 3-methylcyclobutane-1,1,2,2-tetracarboxylic acid Chemical compound CC1CC(C(O)=O)(C(O)=O)C1(C(O)=O)C(O)=O MEJQNPUKRTVBDA-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical compound CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- QJENIOQDYXRGLF-UHFFFAOYSA-N 4-[(4-amino-3-ethyl-5-methylphenyl)methyl]-2-ethyl-6-methylaniline Chemical compound CC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(C)C=2)=C1 QJENIOQDYXRGLF-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- IYTXQZMZTQHONB-UHFFFAOYSA-N 4-[(4-aminophenoxy)-dimethylsilyl]oxyaniline Chemical compound C=1C=C(N)C=CC=1O[Si](C)(C)OC1=CC=C(N)C=C1 IYTXQZMZTQHONB-UHFFFAOYSA-N 0.000 description 1
- TZARWMRCCSKGFP-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)-1,1,1,3-tetrafluoropropan-2-yl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(CF)(C(F)(F)F)C1=CC=C(C(O)=O)C(C(O)=O)=C1 TZARWMRCCSKGFP-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- OZCJSIBGTRKJGX-UHFFFAOYSA-N 4-methylcyclohexa-1,5-diene-1,4-diamine Chemical compound CC1(N)CC=C(N)C=C1 OZCJSIBGTRKJGX-UHFFFAOYSA-N 0.000 description 1
- CNODSORTHKVDEM-UHFFFAOYSA-N 4-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)C1=CC=C(N)C=C1 CNODSORTHKVDEM-UHFFFAOYSA-N 0.000 description 1
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
- QISSLHPKTCLLDL-UHFFFAOYSA-N N-Acetylcaprolactam Chemical compound CC(=O)N1CCCCCC1=O QISSLHPKTCLLDL-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- NJYZCEFQAIUHSD-UHFFFAOYSA-N acetoguanamine Chemical compound CC1=NC(N)=NC(N)=N1 NJYZCEFQAIUHSD-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- ZHMOADYMMOAGSH-UHFFFAOYSA-N ethyl 2-methoxy-2h-quinoline-1-carboxylate Chemical compound C1=CC=C2N(C(=O)OCC)C(OC)C=CC2=C1 ZHMOADYMMOAGSH-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine powder Natural products NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- PXDYLNQHFPMMCS-UHFFFAOYSA-N methyl 2-ethoxy-2h-quinoline-1-carboxylate Chemical compound C1=CC=C2N(C(=O)OC)C(OCC)C=CC2=C1 PXDYLNQHFPMMCS-UHFFFAOYSA-N 0.000 description 1
- FJGZEBUEHKERJU-UHFFFAOYSA-N methyl 2-methoxy-2h-quinoline-1-carboxylate Chemical compound C1=CC=C2N(C(=O)OC)C(OC)C=CC2=C1 FJGZEBUEHKERJU-UHFFFAOYSA-N 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000000710 polymer precipitation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- KUDAAKIHWDFFQP-UHFFFAOYSA-N propyl 2-propoxy-2h-quinoline-1-carboxylate Chemical compound C1=CC=C2N(C(=O)OCCC)C(OCCC)C=CC2=C1 KUDAAKIHWDFFQP-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003738 xylenes Chemical class 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は有機溶媒に可溶性のポリ
イミドの製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing polyimides soluble in organic solvents.
【0002】0002
【従来の技術】ポリイミド樹脂は高い耐熱性を有し、電
気特性及び機械特性にも優れているため、構造材料とし
てあるいは電子材料として広く使われている。しかしな
がら、有機溶媒に対する溶解性に劣るため、通常はその
前駆体であるポリアミド酸溶液を基材に塗布した後、焼
成する方法が用いられる。焼成は通常250〜450℃
で行われ、溶媒の揮散とアミド酸の脱水によるイミド化
を同時に行わしめるものである。しかしながら、このよ
うに高い焼成温度が必要なため、耐熱性の劣る材料と複
合させて焼成を行うことができない。もし溶媒に可溶性
のポリイミドが得られれば、溶媒を揮散させるだけでポ
リイミドの塗布を得ることができ、このような高い温度
での焼成を避けることができ、ポリイミドの応用範囲を
広げることができる。2. Description of the Related Art Polyimide resins have high heat resistance and excellent electrical and mechanical properties, so they are widely used as structural materials or electronic materials. However, since it has poor solubility in organic solvents, a method is usually used in which a polyamic acid solution, which is a precursor thereof, is applied to a base material and then fired. Firing is usually 250-450℃
This process simultaneously evaporates the solvent and dehydrates the amic acid to imidize it. However, since such a high firing temperature is required, firing cannot be performed in combination with a material having poor heat resistance. If a polyimide that is soluble in a solvent can be obtained, a polyimide coating can be obtained simply by evaporating the solvent, and baking at such high temperatures can be avoided, and the range of applications of polyimide can be expanded.
【0003】0003
【発明が解決しようとする課題】通常行われている可溶
性のポリイミドの製造法は、特定の構造のポリアミド酸
溶液を100〜200℃の高温に長時間加熱し、発生す
る水を留去せしめる方法、常温近くでポリアミド酸溶液
に多量の無水酢酸などの酸無水物とピリジンなどの三級
アミンを添加する方法などがある。しかしながら、有機
溶剤を含む溶液を高温で長時間加熱することにより着色
が著しくなるし、多量の酸無水物の添加は溶液の特性を
著しく変質せしめるため、これらの方法で得られる可溶
性ポリイミドを使用するためにはポリマーの沈殿と精製
の工程が必要である。本発明の目的はこのような沈殿と
精製を行うことなく溶媒可溶性のポリイミドを容易に製
造する方法を提供することにある。[Problems to be Solved by the Invention] The commonly used method for producing soluble polyimide is to heat a polyamic acid solution with a specific structure to a high temperature of 100 to 200°C for a long period of time, and distill off the generated water. There is a method in which a large amount of an acid anhydride such as acetic anhydride and a tertiary amine such as pyridine are added to a polyamic acid solution at room temperature. However, heating a solution containing an organic solvent at high temperature for a long period of time causes significant discoloration, and addition of a large amount of acid anhydride significantly alters the properties of the solution, so soluble polyimides obtained by these methods are not used. This requires steps of polymer precipitation and purification. An object of the present invention is to provide a method for easily producing a solvent-soluble polyimide without performing such precipitation and purification.
【0004】0004
【課題を解決するための手段】本発明者等は、上記の課
題について研究を重ねた結果、ポリイソイミドの有機溶
媒溶液に三級アミンを添加して反応させることにより容
易に可溶性ポリイミドを製造することに成功し、本発明
を完成するに至った。すなわち、本発明の可溶性ポリイ
ミドの製造法は、ポリイソイミドの有機溶媒溶液に三級
アミンを添加して反応させることからなる。ここでポリ
イソイミドの有機溶媒溶液はポリイミド酸と前記式〔化
1〕(ただし、R1 およびR2 はそれぞれ独立に炭
素数1〜8の一価の有機基である。)で示されるジヒド
ロキノリン誘導体とを有機溶媒中で反応させて得られる
溶液が好ましい。[Means for Solving the Problems] As a result of repeated research on the above-mentioned problems, the present inventors have discovered that soluble polyimide can be easily produced by adding a tertiary amine to an organic solvent solution of polyisoimide and causing the reaction. This led to the completion of the present invention. That is, the method for producing soluble polyimide of the present invention consists of adding a tertiary amine to a solution of polyisoimide in an organic solvent and causing the mixture to react. Here, the organic solvent solution of polyisoimide contains polyimide acid and a dihydroquinoline derivative represented by the above formula [Formula 1] (wherein R1 and R2 are each independently a monovalent organic group having 1 to 8 carbon atoms). A solution obtained by reaction in an organic solvent is preferred.
【0005】本発明の製造法で用いられるポリイソイミ
ドは、式〔化2〕The polyisoimide used in the production method of the present invention has the formula [Chemical formula 2]
【化2】
で示される。(ただし、R3 は四価の有機基であり、
R4 は二価の有機基であり、nは正の整数である。)
It is represented by [Chemical formula 2]. (However, R3 is a tetravalent organic group,
R4 is a divalent organic group, and n is a positive integer. )
【0006】本発明の製造法で用いられるポリアミド酸
は、式〔化3〕The polyamic acid used in the production method of the present invention has the formula [Chemical formula 3]
【化3】
で示される。(ただし、R3 、R4 及びnは前述の
とおりである。)ポリアミド酸は、通常、テトラカルボ
ン酸二無水物とジアミンとを有機溶媒中で反応させて得
られる。この反応溶液をそのまま、本発明の製造法にお
けるポリアミド酸有機溶媒溶液として用いることができ
る。It is represented by [Chemical formula 3]. (However, R3, R4 and n are as described above.) Polyamic acid is usually obtained by reacting a tetracarboxylic dianhydride and a diamine in an organic solvent. This reaction solution can be used as it is as a polyamic acid organic solvent solution in the production method of the present invention.
【0007】本発明の製造法で用いられるジヒドロキノ
リン誘導体は、式〔化1〕で示される。具体例としてN
‐メトキシカルボニル‐2‐メトキシ‐1,2‐ジヒド
ロキノリン、N‐メトキシカルボニル‐2‐エトキシ‐
1,2‐ジヒドロキノリン、N‐エトキシカルボニル‐
2‐メトキシ‐1,2‐ジヒドロキノリン、N‐エトキ
シカルボニル‐2‐エトキシ‐1,2‐ジヒドロキノリ
ン、N‐プロポキシカルボニル‐2‐プロポキシ‐1,
2‐ジヒドロキノリン、N‐イソブトキシカルボニル‐
2‐メトキシ‐1,2‐ジヒドロキノリン、N‐イソブ
トキシカルボニル‐2‐エトキシ‐1,2‐ジヒドロキ
ノリン、N‐イソブトキシカルボニル‐2‐イソブトキ
シ‐1,2‐ジヒドロキノリン、N‐ペントキシカルボ
ニル‐2‐ペントキシ‐1,2‐ジヒドロキノリンなど
をあげることができるが、必ずしもこれらに限定される
ものではない。The dihydroquinoline derivative used in the production method of the present invention is represented by the formula [Formula 1]. As a specific example, N
-methoxycarbonyl-2-methoxy-1,2-dihydroquinoline, N-methoxycarbonyl-2-ethoxy-
1,2-dihydroquinoline, N-ethoxycarbonyl-
2-methoxy-1,2-dihydroquinoline, N-ethoxycarbonyl-2-ethoxy-1,2-dihydroquinoline, N-propoxycarbonyl-2-propoxy-1,
2-dihydroquinoline, N-isobutoxycarbonyl-
2-Methoxy-1,2-dihydroquinoline, N-isobutoxycarbonyl-2-ethoxy-1,2-dihydroquinoline, N-isobutoxycarbonyl-2-isobutoxy-1,2-dihydroquinoline, N-pentoxycarbonyl Examples include, but are not limited to, -2-pentoxy-1,2-dihydroquinoline.
【0008】本発明で用いられる三級アミンの具体例と
してピリジン、3‐メチルピリヂン、3‐エチルピリジ
ン、4‐メチルピリジン、キノリン、イソキノリン、2
,6‐ルチジン、3,5‐ルチジン、トリメチルアミン
、トリエチルアミン、N,N‐ジメチルベンジルアミン
、2‐メチルイミダゾール、2‐エチル‐4‐メチルイ
ミダゾール、2‐フェニルイミダゾール、1‐ベンジル
‐2‐メチルイミダゾール、2‐フェニル‐4‐メチル
イミダゾールなどをあげることができるが、必ずしもこ
れらに限定されるものではない。Specific examples of tertiary amines used in the present invention include pyridine, 3-methylpyridine, 3-ethylpyridine, 4-methylpyridine, quinoline, isoquinoline, 2
, 6-lutidine, 3,5-lutidine, trimethylamine, triethylamine, N,N-dimethylbenzylamine, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole , 2-phenyl-4-methylimidazole, etc., but are not necessarily limited to these.
【0009】本発明の製造法における溶媒、およびテト
ラカルボン酸二無水物とジアミンとの反応によるポリア
ミド酸を得るための好ましい溶媒(以下反応溶媒という
こともある)として、N‐メチル‐2‐ピロリドン、N
,N‐ジメチルアセトアミド、N,N‐ジメチルフォル
ムアミド、ジメチルスルフォキシド、テトラメチル尿素
、ピリジン、ヘキサメチルホスホルアミド、メチルホル
ムアミド、N‐アセチル‐2‐ピロリドン、2‐メトキ
シエタノール、2‐エトキシエタノール、2‐ブトキシ
エタノール、ジエチレングリコールモノメチルエーテル
、ジエチレングリコールモノエチルエーテル、ジエチレ
ングリコールモノブチルエーテル、シクロペンタノン、
シクロヘキサノン、クレゾール、γ‐ブチロラクトーン
、イソホロン、N,N‐ジエチルアセトアミド、N,N
‐ジエチルフォルムアミド、N,N‐ジメチルメトキシ
アセトアミド、テトラヒドロフラン、N‐アセチル‐2
‐ピロリドン、N‐アセチル‐ε‐カプロラクタム、テ
トラヒドロチオフェンジオキシド{スルフォラン(su
lforane)}などをあげることができる。
また、上記の有機溶媒の混合溶媒を用いることができる
。更に、上記の有機溶媒を、他の非プロトン性(中性)
有機溶媒、例えば芳香族、脂環式のもしくは脂肪族炭化
水素、またはそれらの塩素化誘導体(例えば、ベンゼン
、トルエン、キシレン類、シクロヘキサン、ペンタン、
ヘキサン、石油エーテル、塩化メチレンなど)、または
ジオキサンなどで希釈したものを用いることができる。N-methyl-2-pyrrolidone is used as a solvent in the production method of the present invention and as a preferable solvent (hereinafter sometimes referred to as reaction solvent) for obtaining polyamic acid by the reaction of tetracarboxylic dianhydride and diamine. , N
, N-dimethylacetamide, N,N-dimethylformamide, dimethylsulfoxide, tetramethylurea, pyridine, hexamethylphosphoramide, methylformamide, N-acetyl-2-pyrrolidone, 2-methoxyethanol, 2-ethoxy Ethanol, 2-butoxyethanol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, cyclopentanone,
Cyclohexanone, cresol, γ-butyrolactone, isophorone, N,N-diethylacetamide, N,N
-diethylformamide, N,N-dimethylmethoxyacetamide, tetrahydrofuran, N-acetyl-2
-pyrrolidone, N-acetyl-ε-caprolactam, tetrahydrothiophene dioxide {sulfolane (su
lforane)}. Moreover, a mixed solvent of the above organic solvents can be used. Furthermore, the above organic solvent can be replaced with other aprotic (neutral)
Organic solvents such as aromatic, cycloaliphatic or aliphatic hydrocarbons or their chlorinated derivatives (e.g. benzene, toluene, xylenes, cyclohexane, pentane,
(hexane, petroleum ether, methylene chloride, etc.) or dioxane, etc. can be used.
【0010】本発明の可溶性ポリイミドの製造法に用い
るポリイソイミドの製造法について説明する。テトラカ
ルボン酸とジアミンを有機溶媒中で反応を行うことによ
り、前記〔化3〕で示されるポリアミド酸が得られる。
この溶液に前記式〔化1〕で示されるジヒドロキノリン
誘導体を添加することにより、前記式〔化2〕で示され
るポリイソイミドが得られる。以下にその反応式を示す
。The method for producing polyisoimide used in the method for producing soluble polyimide of the present invention will be explained. By reacting a tetracarboxylic acid and a diamine in an organic solvent, a polyamic acid represented by the above [Chemical formula 3] can be obtained. By adding the dihydroquinoline derivative represented by the above formula [Chemical formula 1] to this solution, a polyisoimide shown by the above formula [Chemical formula 2] is obtained. The reaction formula is shown below.
【化4】
(R1 、R2 、R3 、R4 nは前記と同じであ
る。)embedded image (R1, R2, R3, R4 n are the same as above.)
【0011】ここで、副生した二酸化炭素は気体
として系外に除かれ、アルコールとキノリンは溶媒に溶
解しているため、あらためて除去する必要はない。反応
温度は0〜100℃好ましくは0〜50℃である。ポリ
アミド酸に対して添加するジヒドロキノリン誘導体の量
は、アミド酸反復単位ひとつに対して二分子のジヒドロ
キノリン誘導体を添加すれば、理論上すべてのポリアミ
ド酸をポリイソイミドに転換することが可能である。し
かし、ヒドロキノリン誘導体を過剰に添加しても特に問
題はなく、また少なくてもよい。しかし、少ない場合は
イソイミド反復単位とアミド酸反復単位が混在したポリ
マーが得られる。また、反応条件によっては生成したイ
ソイミドが一部イミドに変換し、イミド、イソイミド、
およびアミド酸反復単位を含むポリマーも生成する場合
がある。この溶液中には三級アミンであるキノリンを含
むため、溶液中のイソイミドは徐々にイミドに変換して
いくが、その速度は非常に遅い場合が多いため、後述す
るように同一または異種の三級アミンを追加して反応を
行う方が好ましい。またイソイミドの別の製造法として
、ポリアミド酸に脱水剤として、N,N′‐ジヒドロカ
ルビル置換カルボジイミド、ハロゲン化低級脂肪酸無水
物、または低級脂肪酸ハロゲン化物などを添加して反応
を行う方法もある。[0011] Here, the by-produced carbon dioxide is removed from the system as a gas, and since the alcohol and quinoline are dissolved in the solvent, there is no need to remove them again. The reaction temperature is 0 to 100°C, preferably 0 to 50°C. Regarding the amount of dihydroquinoline derivative added to polyamic acid, if two molecules of dihydroquinoline derivative are added to one amic acid repeating unit, it is theoretically possible to convert all of the polyamic acid to polyisoimide. However, there is no particular problem even if the hydroquinoline derivative is added in excess, and a small amount may also be used. However, if the amount is small, a polymer containing a mixture of isoimide repeating units and amic acid repeating units will be obtained. Also, depending on the reaction conditions, some of the generated isoimide may be converted to imide, resulting in imide, isoimide,
and polymers containing repeating amic acid units may also be produced. Since this solution contains quinoline, which is a tertiary amine, the isoimide in the solution is gradually converted to imide, but the rate of conversion is often very slow. It is preferable to carry out the reaction by adding a class amine. Another method for producing isoimide is to carry out the reaction by adding a dehydrating agent such as N,N'-dihydrocarbyl-substituted carbodiimide, halogenated lower fatty acid anhydride, or lower fatty acid halide to polyamic acid.
【0012】このようにして得られたポリイソイミドの
溶液に前述した三級アミンを添加して反応を行う本発明
の製造法により可溶性ポリイミドを得ることができる。
三級アミンの添加量はイソイミド基の10%以上であれ
ば良いが、好ましくは50〜300%である。反応温度
は10〜100℃、好ましくは20〜70℃である。反
応温度が低過ぎるとイミド化反応の進行が遅く、また高
すぎるとゲル化をおこし溶液が流動性をなくする場合が
あり好ましくない。反応時間は添加する三級アミンの種
類、添加量あるいは反応時間などにより一概には言えな
いが、30分以上、好ましくは2〜20時間くらいであ
る。A soluble polyimide can be obtained by the production method of the present invention, in which the above-mentioned tertiary amine is added to the polyisoimide solution obtained in this way and the reaction is carried out. The amount of tertiary amine added may be 10% or more of the isoimide group, but preferably 50 to 300%. The reaction temperature is 10-100°C, preferably 20-70°C. If the reaction temperature is too low, the imidization reaction will proceed slowly, and if it is too high, gelation may occur and the solution may lose fluidity, which is not preferable. Although the reaction time cannot be determined unconditionally depending on the type of tertiary amine added, the amount added, or the reaction time, it is 30 minutes or more, preferably about 2 to 20 hours.
【0013】本発明の製造法におけるポリアミド酸は、
通常テトラカルボン酸二無水物とジアミンとを有機溶媒
中で反応して合成する。[0013] The polyamic acid in the production method of the present invention is
It is usually synthesized by reacting a tetracarboxylic dianhydride and a diamine in an organic solvent.
【0014】テトラカルボン酸二無水物として次の化合
物をあげることができるが、必ずしもこれらに限定され
るものではない。芳香族テトラカルボン酸二無水物とし
ては、ピロリメリット酸二無水物、3,3′,4,4′
‐ビフェニルテトラカルボン酸二無水物、2,2′,3
,3′‐ビフェニルテトラカルボン酸二無水物、2,3
,3′,4′‐ビフェニルテトラカルボン酸二無水物、
3,3′,4,4′‐ベンゾフェノンテトラカルボン酸
二無水物、2,3,3′,4′‐ベンゾフェノンテトラ
カルボン酸二無水物、2,2′,3,3′‐ベンゾフェ
ノンテトラカルボン酸二無水物、ビス‐(3,4‐ジカ
ルボキシフェニル)‐エーテル二無水物、ビス‐(3,
4‐ジカルボキシフェニル)スルホン二無水物、1,2
,5,6‐ナフタリンテトラカルボン酸二無水物、2,
3,6,7‐ナフタリンテトラカルボン酸二無水物、2
,2‐ビス(3,4‐ジカルボキシフェニル)テトラフ
ロロプロパン二無水物など、脂環式テトラカルボン酸二
無水物としては、シクロブタンテトラカルボン酸二無水
物、メチルシクロブタンテトラカルボン酸二無水物など
、脂肪族テトラカルボン酸二無水物としては、1,2,
3,4‐テトラカルボキシブタン二無水物などをあげる
ことができる。The following compounds can be mentioned as tetracarboxylic dianhydrides, but they are not necessarily limited to these. Examples of the aromatic tetracarboxylic dianhydride include pyrrolimellitic dianhydride, 3,3′,4,4′
-Biphenyltetracarboxylic dianhydride, 2,2',3
, 3'-biphenyltetracarboxylic dianhydride, 2,3
, 3',4'-biphenyltetracarboxylic dianhydride,
3,3',4,4'-benzophenonetetracarboxylic dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic acid dianhydride, bis-(3,4-dicarboxyphenyl)-ether dianhydride, bis-(3,
4-dicarboxyphenyl) sulfone dianhydride, 1,2
, 5,6-naphthalene tetracarboxylic dianhydride, 2,
3,6,7-naphthalene tetracarboxylic dianhydride, 2
, 2-bis(3,4-dicarboxyphenyl)tetrafluoropropane dianhydride, etc. Examples of alicyclic tetracarboxylic dianhydrides include cyclobutanetetracarboxylic dianhydride, methylcyclobutanetetracarboxylic dianhydride, etc. , as the aliphatic tetracarboxylic dianhydride, 1, 2,
Examples include 3,4-tetracarboxybutane dianhydride.
【0015】ジアミンとしては次の化合物をあげること
ができるが、必ずしもこれらに限定するものではない。
芳香族ジアミンとしては、4,4′‐ジアミノジフェニ
ルエーテル、4,4′‐ジアミノジフェニルメタン、4
,4′‐ジアミノジフェニルスルホン、4,4′‐ジア
ミノジフェニルスルフィド、4,4′‐ジ(メタ‐アミ
ノフェノキシ)ジフェニルスルフォン、4,4′‐ジ(
パラ‐アミノフェノキシ)ジフェニルスルフォン、オル
ト‐フェニルレンジアミン、メタ‐フェニレンジアミン
、パラ‐フェニレンジアミン、ベンジジン、3,3′‐
ジアミノベンゾフェノン、4,4′‐ジアミノベンゾフ
ェノン、4,4′‐ジアミノジフェニル‐2,2‐プロ
パン、1,5‐ジアミノナフタレン、1,8‐ジアミノ
ナフタレン、3,4′‐ジアミノジフェニルエーテル、
4,4′‐ビス(4‐アミノフェノキシ)ビフェニル、
2,2‐ビス{4‐(4‐アミノフェノキシ)フェニル
}ヘキサフロロプロパン、1,4‐ビス(4‐アミノフ
ェノキシ)ベンゼン、1,3‐ビス(4‐アミノフェノ
キシ)ベンゼン、1,3‐ビス(3‐アミノフェノキシ
)ベンゼン、4,4′‐ジアミノ‐3,3′‐ジエチル
‐5,5′‐ジメチルジフェニルメタン、4,4′‐ジ
アミノ‐3,3′,5,5′‐テトラメチルジフェニル
メタン、1,4‐ジアミノトルエン、メタ‐キシリレン
ジアミン、2,2′‐ジメチルベンジジンなど、脂肪族
ジアミンとしては、トリメチレンジアミン、テトラメチ
レンジアミン、ヘキサメチレンジアミン、2,11‐ド
デカンジアミンなど、シリコン系ジアミンとしては、ビ
ス(パラ‐アミノフェノキシ)ジメチルシラン、1,4
‐ビス‐(3‐アミノプロピルジメチルシリル)ベンゼ
ンなど、脂環式としては1,4‐ジアミノシクロヘキサ
ン、ビス(4‐アミノシクロヘキシル)メタン、イソフ
ォロンジアミンなど、グアナミン類としてはアセトグア
ナミン、ベンゾグアナミンなどをあげることができる。
また、ジアミノポリシロキサンとしては次の化合物をあ
げることができる。[0015] Examples of the diamine include the following compounds, but they are not necessarily limited to these. Aromatic diamines include 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 4
, 4'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfide, 4,4'-di(meta-aminophenoxy)diphenylsulfone, 4,4'-di(
Para-aminophenoxy) diphenylsulfone, ortho-phenylenediamine, meta-phenylenediamine, para-phenylenediamine, benzidine, 3,3'-
Diaminobenzophenone, 4,4'-diaminobenzophenone, 4,4'-diaminodiphenyl-2,2-propane, 1,5-diaminonaphthalene, 1,8-diaminonaphthalene, 3,4'-diaminodiphenyl ether,
4,4′-bis(4-aminophenoxy)biphenyl,
2,2-bis{4-(4-aminophenoxy)phenyl}hexafluoropropane, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,3- Bis(3-aminophenoxy)benzene, 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, 4,4'-diamino-3,3',5,5'-tetramethyl Diphenylmethane, 1,4-diaminotoluene, meta-xylylene diamine, 2,2'-dimethylbenzidine, etc.; examples of aliphatic diamines include trimethylene diamine, tetramethylene diamine, hexamethylene diamine, 2,11-dodecane diamine, etc. Examples of silicone diamines include bis(para-aminophenoxy)dimethylsilane, 1,4
-bis-(3-aminopropyldimethylsilyl)benzene, alicyclics such as 1,4-diaminocyclohexane, bis(4-aminocyclohexyl)methane, isophorone diamine, etc., and guanamines such as acetoguanamine, benzoguanamine, etc. I can give it to you. Moreover, the following compounds can be mentioned as the diamino polysiloxane.
【化5】[C5]
【化6】[C6]
【化7】[C7]
【化8】[Chemical formula 8]
【化9】[Chemical formula 9]
【化10】[Chemical formula 10]
【化11】[Chemical formula 11]
【化12】[Chemical formula 12]
【化13】 (ただし、上記のpは1〜100である)。[Chemical formula 13] (However, the above p is 1 to 100).
【0016】次に本発明の方法で得られた可溶性ポリイ
ミドの使用方法について説明する。本発明の製造法で得
られたポリイミドは、ほとんどの場合溶媒に溶解した状
態で得られるのでそのまま使用できる。反応溶液をその
ままもしくは濃縮し、または溶媒で希釈して使用するの
が良い。希釈溶媒としては反応溶媒と同じものを使用す
ることができる。本発明の製造法で得られた可溶性ポリ
イミドを含む溶液から、ポリイミド硬化膜を形成させる
場合、公知のどのような方法で行ってもよい。例えばガ
ラス板、銅板、アルミニウム板あるいはシリコンウエハ
ーなどの基板上に本発明の方法で得られた可溶性ポリイ
ミドを含む溶液を塗布した後、100〜400℃の温度
で焼成することにより、硬化膜を得ることができる。し
かしながら、本発明の方法で得られた可溶性のポリイミ
ドは、すでにイミド化されたポリマーであるため溶液中
の溶媒を揮散せしめるだけで良く、100〜200℃の
比較的低温で数分〜数時間焼成を行うことにより硬化膜
を得ることができる。このような低温焼成を可能にする
ためには可溶性ポリイミドを構成する繰り返し単位がす
べてイミド化されている必要はなく、若干のアミド酸単
位あるいはイソイミド単位を含んでいてもよい。塗布方
法はいかなる方法でも良いが、通常、スピンコート方、
印刷法、スプレーコート法、ブレードコート法、ディッ
ピング法あるいはロールコーター法などから選択される
。Next, the method of using the soluble polyimide obtained by the method of the present invention will be explained. The polyimide obtained by the production method of the present invention is obtained in a state dissolved in a solvent in most cases, so it can be used as it is. It is preferable to use the reaction solution as it is, concentrate it, or dilute it with a solvent. As the dilution solvent, the same solvent as the reaction solvent can be used. When forming a polyimide cured film from a solution containing a soluble polyimide obtained by the production method of the present invention, any known method may be used. For example, a cured film is obtained by applying a solution containing the soluble polyimide obtained by the method of the present invention onto a substrate such as a glass plate, copper plate, aluminum plate, or silicon wafer, and then baking it at a temperature of 100 to 400°C. be able to. However, since the soluble polyimide obtained by the method of the present invention is already an imidized polymer, it is only necessary to volatilize the solvent in the solution, and it is baked at a relatively low temperature of 100 to 200°C for several minutes to several hours. By performing this, a cured film can be obtained. In order to enable such low-temperature firing, all of the repeating units constituting the soluble polyimide do not need to be imidized, and may contain some amic acid units or isoimide units. Any coating method may be used, but usually spin coating,
The method is selected from a printing method, a spray coating method, a blade coating method, a dipping method, a roll coater method, etc.
【0017】本発明の製造法で得られる可溶性ポリイミ
ドの用途として半導体用の各種保護膜、絶縁膜、液晶用
の配向膜、カラーフィルター用基材、その保護膜、ある
いはフィルム、成型用材料などが考えられる。The soluble polyimide obtained by the production method of the present invention can be used as various protective films for semiconductors, insulating films, alignment films for liquid crystals, base materials for color filters, protective films thereof, films, molding materials, etc. Conceivable.
【0018】以下、実施例および比較例によって、本発
明を更に具体的に説明するが、本発明はこれらの実施例
によって限定されるものではない。The present invention will be explained in more detail below with reference to Examples and Comparative Examples, but the present invention is not limited by these Examples.
【0019】(実施例1)かくはん装置、滴下漏斗、温
度計、コンデンサーおよび窒素置換装置を付した1リッ
トルのフラスコの系内を窒素ガスにより置換した後、脱
水精製したN‐メチル‐2‐ピロリドン(以下NMPと
略記する)の500g、1,1‐ビス{4‐(4‐アミ
ノフェノキシフェニル)}シクロブタンの85.08g
、(0.189モル)および1‐メチル,1,2,3,
4‐テトラカルボキシシクロヘキサン二無水物の39.
92g(0.189モル)を添加し、常法にしたがって
ポリアミド溶液を得た。この溶液にN‐エトキシカルボ
ニル,2‐エトキシ,1,2‐ジヒドロキノリン(以下
EEDQと略称する)の93.39g(0.378モル
)を添加し、20℃で10時間反応を行いポリイソイミ
ド溶液を得た。更にこの溶液にイソキノリンの48.7
8g(0.378モル)を添加し、20℃で10時間反
応を行い淡褐色の透明な液体を得た。この溶液をシリコ
ンウエハー上にスピンコートした後、50℃で減圧下2
4時間乾燥して薄膜を得た。この膜をウエハーからはが
し赤外線吸収スペクトルを測定した結果1780cm−
1にイミド基に基づく吸収が認められた(図1)。(Example 1) After purging the system of a 1 liter flask equipped with a stirring device, a dropping funnel, a thermometer, a condenser, and a nitrogen purging device with nitrogen gas, N-methyl-2-pyrrolidone was purified by dehydration. (hereinafter abbreviated as NMP), 85.08 g of 1,1-bis{4-(4-aminophenoxyphenyl)}cyclobutane
, (0.189 mol) and 1-methyl,1,2,3,
39. 4-Tetracarboxycyclohexane dianhydride.
92 g (0.189 mol) was added to obtain a polyamide solution according to a conventional method. 93.39 g (0.378 mol) of N-ethoxycarbonyl, 2-ethoxy, 1,2-dihydroquinoline (hereinafter abbreviated as EEDQ) was added to this solution, and the reaction was carried out at 20°C for 10 hours to form a polyisoimide solution. Obtained. Furthermore, 48.7% of isoquinoline was added to this solution.
8 g (0.378 mol) was added and the reaction was carried out at 20° C. for 10 hours to obtain a pale brown transparent liquid. After spin-coating this solution onto a silicon wafer, it was coated at 50°C under reduced pressure for 2
A thin film was obtained by drying for 4 hours. When this film was peeled off from the wafer and the infrared absorption spectrum was measured, the result was 1780 cm-
Absorption based on imide groups was observed in 1 (Figure 1).
【0020】(実施例2)実施例1と同様の装置と方法
により、NMPの500g、4,4′‐ジアミノジフェ
ニルエーテルの28.34g(0.142モル)、3,
3′,4′‐ベンゾフェノンテトラカルボン酸二無水物
(以下BTDAと略称する)の52.13g(0.16
2モル)および4‐アミノフェニルトリメトキシシラン
(以下APMSと略称する)の7.76g(0.364
モル)を添加し、常法にしたがってポリアミド酸溶液を
得た。この溶液にジシクロヘキシルカルボジイミド(D
CCと略称する)の62.66g(0.304モル)を
添加し、25℃で3時間反応を行ったのち副生したジシ
クロヘキシル尿素をろ過により除去しポリイソイミド溶
液を得た。更にこの溶液にイソキノリンの36.63g
(0.284モル)を添加し、40℃で4時間反応を行
い淡褐色の透明な溶液を得た。この溶液中のポリマーを
同様に処理し、赤外線吸収スペクトルを測定した結果、
可溶性ポリイミドが得られたことが確認された。(Example 2) Using the same apparatus and method as in Example 1, 500 g of NMP, 28.34 g (0.142 mol) of 4,4'-diaminodiphenyl ether, 3,
52.13 g (0.16
2 mol) and 7.76 g (0.364 mol) of 4-aminophenyltrimethoxysilane (hereinafter abbreviated as APMS)
mol) to obtain a polyamic acid solution according to a conventional method. Add dicyclohexylcarbodiimide (D
After adding 62.66 g (0.304 mol) of acetate (abbreviated as CC) and carrying out a reaction at 25° C. for 3 hours, by-produced dicyclohexyl urea was removed by filtration to obtain a polyisoimide solution. Furthermore, 36.63 g of isoquinoline was added to this solution.
(0.284 mol) was added thereto, and the reaction was carried out at 40° C. for 4 hours to obtain a pale brown transparent solution. The polymer in this solution was treated in the same way and the infrared absorption spectrum was measured.
It was confirmed that soluble polyimide was obtained.
【0021】(実施例3)実施例1と同様の装置と方法
により、N,N‐ジメチルアセトアミド(以下DMAC
と略称する)の500g、エチレングリコール‐ビス‐
無水トリメリット酸エステルの53.43g(0.13
0モル)およびビス{4‐(3‐アミノフェノキシフェ
ニル)}スルフォンの56.32g(0.130モル)
を混合し、常法にしたがって反応を行い、ポリアミド酸
を得た。この溶液にEEDQの70.85g(0.28
7モル)を添加し25℃で15時間反応を行いポリイソ
イミド溶液を得た。更にこの溶液に1‐ベンジル,2‐
メチルイミダゾールの34.81g(0.195モル)
を添加し、25℃で5時間反応を行い淡褐色の透明な液
体を得た。この溶液中のポリマーを同様に処理し、赤外
線吸収スペクトルを測定した結果、可溶性ポリイミドが
得られたことが確認された。(Example 3) N,N-dimethylacetamide (hereinafter referred to as DMAC) was prepared using the same apparatus and method as in Example 1.
500g of ethylene glycol-bis-
53.43 g (0.13 g) of trimellitic anhydride ester
0 mol) and 56.32 g (0.130 mol) of bis{4-(3-aminophenoxyphenyl)}sulfone
were mixed and reacted according to a conventional method to obtain polyamic acid. Add 70.85 g (0.28 g) of EEDQ to this solution.
7 mol) was added and the reaction was carried out at 25°C for 15 hours to obtain a polyisoimide solution. Furthermore, 1-benzyl, 2-
34.81 g (0.195 mol) of methylimidazole
was added and the reaction was carried out at 25°C for 5 hours to obtain a pale brown transparent liquid. The polymer in this solution was treated in the same manner and its infrared absorption spectrum was measured, and it was confirmed that a soluble polyimide was obtained.
【0022】(実施例4)実施例1と同様の装置と方法
により、DMACの500g、3,3′‐ジアミノフェ
ニルスルフォン(以下DDSと略称する)の17.16
g(0.069モル)、BTDAの44.54g(0.
138モル)およびAPMSの26.53g(0.12
4モル)を混合し、常法にしたがって反応を行い、ポリ
アミド酸溶液を得た。この溶液にDCCの51.34g
(0.249モル)を添加し、30℃で10時間反応を
行いポリイソイミド溶液を得た。更にこの溶液に4‐メ
チルピリジンの11.59g(0.124モル)を添加
し、25℃で10時間反応を行い淡褐色の透明な液体を
得た。この溶液中のポリマーを同様に処理し、赤外線吸
収スペクトルを測定した結果、可溶性ポリイミドが得ら
れたことが確認された。(Example 4) Using the same apparatus and method as in Example 1, 500 g of DMAC and 17.16 g of 3,3'-diaminophenyl sulfone (hereinafter abbreviated as DDS) were prepared.
g (0.069 mol), 44.54 g (0.069 mol) of BTDA.
138 mol) and 26.53 g (0.12 mol) of APMS
4 mol) and reacted according to a conventional method to obtain a polyamic acid solution. 51.34 g of DCC in this solution
(0.249 mol) was added thereto, and the reaction was carried out at 30°C for 10 hours to obtain a polyisoimide solution. Furthermore, 11.59 g (0.124 mol) of 4-methylpyridine was added to this solution, and the reaction was carried out at 25° C. for 10 hours to obtain a pale brown transparent liquid. The polymer in this solution was treated in the same manner and its infrared absorption spectrum was measured, and it was confirmed that a soluble polyimide was obtained.
【0023】(実施例5)実施例1と同様の装置と方法
により、ジエチレングリコールジメチルエーテルの25
0g、DDSの12.84g(0.052モル)、ω,
ω‐ビス(3‐アミノプロピル)ポリジメチルシロキサ
ンの42.08g(0.052モル)およびBTDAの
33.32g(0.103モル)を混合し、常法にした
がって反応を行い、ポリアミド酸溶液を得た。この溶液
にEEDQの51.14g(0.207モル)を添加し
、20℃で8時間反応を行いポリイソイミド溶液を得た
。更にこの溶液にイソキノリンの33.39g(0.2
58モル)を添加し、40℃で3時間反応を行い淡褐色
の透明な液体を得た。この溶液中のポリマーを同様に処
理し、赤外線吸収スペクトルを測定した結果、可溶性ポ
リイミドが得られたことが確認された。(Example 5) Using the same apparatus and method as in Example 1, 25% of diethylene glycol dimethyl ether was prepared.
0 g, 12.84 g (0.052 mol) of DDS, ω,
42.08g (0.052 mol) of ω-bis(3-aminopropyl)polydimethylsiloxane and 33.32g (0.103 mol) of BTDA were mixed and reacted according to a conventional method to form a polyamic acid solution. Obtained. 51.14 g (0.207 mol) of EEDQ was added to this solution, and the reaction was carried out at 20° C. for 8 hours to obtain a polyisoimide solution. Furthermore, 33.39g (0.2g) of isoquinoline was added to this solution.
58 mol) was added thereto, and the reaction was carried out at 40°C for 3 hours to obtain a light brown transparent liquid. The polymer in this solution was treated in the same manner and its infrared absorption spectrum was measured, and it was confirmed that a soluble polyimide was obtained.
【0024】(実施例6)実施例1と同様の装置と方法
により、NMPの500g、2,2‐ビス‐{4‐(4
‐アミノフェノキシフェニル)}ヘキサフロロプロパン
の43.31g(0.084モル)、3‐アミノプロピ
ルトリエトキシシラン(以下APS−Eと略称する)の
3.70g(0.017モル)および4,4′‐(ヘキ
サフロロイソプロピリデン)ジフタル酸無水物の41.
23g(0.093モル)を混合し、常法にしたがって
反応を行い、ポリアミド酸溶液を得た。この溶液にEE
DQの50.50g(0.204モル)を添加し、25
℃で10時間反応を行いポリイソイミド溶液を得た。更
にこの溶液にイソキノリンの11.99g(0.093
モル)を添加し、25℃で3時間反応を行い淡褐色の透
明な液体を得た。この溶液中のポリマーを同様に処理し
、赤外線吸収スペクトルを測定した結果、可溶性ポリイ
ミドが得られたことが確認された。(Example 6) Using the same apparatus and method as in Example 1, 500 g of NMP, 2,2-bis-{4-(4
-aminophenoxyphenyl)} 43.31 g (0.084 mol) of hexafluoropropane, 3.70 g (0.017 mol) of 3-aminopropyltriethoxysilane (hereinafter abbreviated as APS-E) and 4,4 '-(hexafluoroisopropylidene)diphthalic anhydride 41.
23 g (0.093 mol) were mixed and reacted according to a conventional method to obtain a polyamic acid solution. Add EE to this solution
Add 50.50 g (0.204 mol) of DQ,
The reaction was carried out at ℃ for 10 hours to obtain a polyisoimide solution. Furthermore, 11.99 g (0.093 g) of isoquinoline was added to this solution.
mol) was added thereto, and the reaction was carried out at 25°C for 3 hours to obtain a light brown transparent liquid. The polymer in this solution was treated in the same manner and its infrared absorption spectrum was measured, and it was confirmed that a soluble polyimide was obtained.
【0025】(実施例7)実施例1と同様の装置と方法
により、NMPの500g、DDSの46.39g(0
.187モル)、APS−Sの16.55g(0.07
5モル)および4,4′‐(ヘキサフロロイソプロピリ
デン)ジフタル酸無水物の103.73g(0.234
モル)を混合し、常法にしたがって反応を行い、ポリア
ミド酸溶液を得た。この溶液にEEDQの127.05
g(0.514モル)を添加し30℃で10時間反応を
行いポリイソイミド溶液を得た。更にこの溶液にイソキ
ノリンの60.33g(0.467モル)を添加し、2
5℃で5時間反応を行い淡褐色の透明な液体を得た。こ
の溶液中のポリマーを同様に処理し、赤外線吸収スペク
トルを測定した結果、可溶性ポリイミドが得られたこと
が確認された。(Example 7) Using the same apparatus and method as in Example 1, 500 g of NMP and 46.39 g (0.0
.. 187 mol), 16.55 g (0.07 mol) of APS-S
5 mol) and 103.73 g (0.234
mol) and reacted according to a conventional method to obtain a polyamic acid solution. This solution has an EEDQ of 127.05
g (0.514 mol) was added and the reaction was carried out at 30°C for 10 hours to obtain a polyisoimide solution. Furthermore, 60.33 g (0.467 mol) of isoquinoline was added to this solution, and 2
The reaction was carried out at 5°C for 5 hours to obtain a pale brown transparent liquid. The polymer in this solution was treated in the same manner and its infrared absorption spectrum was measured, and it was confirmed that a soluble polyimide was obtained.
【0026】(比較例1)イソキノリンを添加しない以
外は実施例7と同様に反応を行い淡褐色の溶液を得た。
この溶液中のポリマーを同様に処理し、赤外線吸収スペ
クトルを測定した結果、イミド基の吸収は見られず、1
800cm−1にイソイミドの吸収が認められた。(Comparative Example 1) The reaction was carried out in the same manner as in Example 7 except that isoquinoline was not added to obtain a light brown solution. The polymer in this solution was treated in the same manner and the infrared absorption spectrum was measured. As a result, no absorption of imide groups was observed.
Isoimide absorption was observed at 800 cm-1.
【0027】[0027]
【発明の効果】本発明の可溶性ポリイミドの製造法は、
イミド化反応に使われる触媒も危険性が少なく、沈殿精
製の工程が必要ないため、得られた溶液はそのまま実用
に供することができその効果は大きい。また得られた可
溶性ポリイミドは溶媒を揮散させるだけでポリイミド膜
を形成することができるため、耐熱性の劣る基板上にも
塗膜を形成できるため、その実用上の効果は大きい。[Effect of the invention] The method for producing soluble polyimide of the present invention is as follows:
The catalyst used in the imidization reaction is also less dangerous, and there is no need for a precipitation purification process, so the resulting solution can be put to practical use as is, which is highly effective. In addition, since a polyimide film can be formed from the obtained soluble polyimide simply by volatilizing the solvent, a coating film can be formed even on a substrate with poor heat resistance, which has a great practical effect.
【図1】本発明の可溶性ポリイミドの赤外線吸収スペク
トルである。FIG. 1 is an infrared absorption spectrum of the soluble polyimide of the present invention.
Claims (2)
アミンを添加して反応させることからなる可溶性ポリイ
ミドの製造法。1. A method for producing a soluble polyimide, which comprises adding a tertiary amine to a solution of polyisoimide in an organic solvent and causing a reaction.
アミド酸と下記式(化1)で示されるジヒドロキノリン
誘導体とを有機溶媒中で反応させて得られた溶液である
請求項1記載の可溶性ポリアミドの製造法。 【化1】2. The production of a soluble polyamide according to claim 1, wherein the organic solvent solution of polyisoimide is a solution obtained by reacting a polyamic acid and a dihydroquinoline derivative represented by the following formula (Chemical formula 1) in an organic solvent. Law. [Chemical formula 1]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3070313A JP3006802B2 (en) | 1991-03-12 | 1991-03-12 | Production method of soluble polyimide |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3070313A JP3006802B2 (en) | 1991-03-12 | 1991-03-12 | Production method of soluble polyimide |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04283236A true JPH04283236A (en) | 1992-10-08 |
JP3006802B2 JP3006802B2 (en) | 2000-02-07 |
Family
ID=13427842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3070313A Expired - Lifetime JP3006802B2 (en) | 1991-03-12 | 1991-03-12 | Production method of soluble polyimide |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3006802B2 (en) |
-
1991
- 1991-03-12 JP JP3070313A patent/JP3006802B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3006802B2 (en) | 2000-02-07 |
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