JPH07173287A - Polyimide soluble in organic solvent - Google Patents
Polyimide soluble in organic solventInfo
- Publication number
- JPH07173287A JPH07173287A JP5318197A JP31819793A JPH07173287A JP H07173287 A JPH07173287 A JP H07173287A JP 5318197 A JP5318197 A JP 5318197A JP 31819793 A JP31819793 A JP 31819793A JP H07173287 A JPH07173287 A JP H07173287A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- organic solvent
- dianhydride
- soluble
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は弾性率、伸び等力学物性
に優れ、かつ色が無色または薄い黄色で有機溶媒に可溶
なポリイミドに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyimide which has excellent mechanical properties such as elastic modulus and elongation, is colorless or pale yellow and is soluble in an organic solvent.
【0002】[0002]
【従来の技術】ポリイミドはその力学的性質や耐熱性が
優れているためエンジニアリングプラスチックやエッチ
ング等コーティング剤として、近年注目を集めている。
しかし、そのほとんどが有機溶媒に可溶ではない。また
NMP(N−メチル−2−ピロリドン)等アミド系溶媒
やm−クレゾール等高沸点溶媒に溶けるものもあるがそ
の数は少ない。そのため著しく作業性が低く、また使用
出来る材料も限定されていた。色も多くは濃い茶色を示
し色調が問題となるコーティング用途には使用が困難な
場合が多かった。2. Description of the Related Art Polyimide has been attracting attention in recent years as a coating agent for engineering plastics and etching because of its excellent mechanical properties and heat resistance.
However, most of them are not soluble in organic solvents. Some of them are soluble in an amide-based solvent such as NMP (N-methyl-2-pyrrolidone) and a high boiling solvent such as m-cresol, but the number thereof is small. Therefore, the workability was extremely low, and the usable materials were limited. Many of the colors are dark brown, and it is often difficult to use for coating applications where color tone is a problem.
【0003】[0003]
【発明が解決しようとする課題】本発明は上記従来の問
題点を解決するものであり、その目的とするところは、
溶媒への溶解性や弾性率伸び等力学物性に優れ、かつ色
が無色に近く透明なポリイミドを提供するものである。SUMMARY OF THE INVENTION The present invention is to solve the above-mentioned conventional problems, and an object thereof is to:
It is intended to provide a polyimide which is excellent in mechanical properties such as solubility in a solvent and elongation in elastic modulus, and has a color close to colorless and transparent.
【0004】[0004]
【課題を解決するための手段】本発明者等は、上記従来
の欠点を克服する為に鋭意検討を行った結果、特定の構
造をその構造に導入することでポリイミドに有機溶媒へ
の可溶性を具備させうることを見いだした。すなわち、
本発明は化3に示すアミン化合物と化4に示す酸無水化
物との反応により得られるポリイミド成分を主成分とす
る有機溶媒可溶性ポリイミドである。Means for Solving the Problems As a result of intensive studies to overcome the above-mentioned conventional drawbacks, the inventors of the present invention introduced a specific structure into the structure, thereby making the polyimide soluble in an organic solvent. I found what I could prepare for. That is,
The present invention is an organic solvent-soluble polyimide having a polyimide component as a main component, which is obtained by reacting the amine compound shown in Chemical formula 3 with the acid anhydride shown in Chemical formula 4.
【化3】 [Chemical 3]
【0005】[0005]
【化4】 本発明のポリイミドは具体的なアミン成分として4,
4’−ジアミノジフェニルプロパン、3,4’−ジアミ
ノジフェニルプロパン、4,4’−[1,3−フェニレ
ンビス(1−メチリデン)]ビスアニリン、4,4’−
[1,4−フェニレンビス(1−メチリデン)]ビスア
ニリンのうち少なくとも一成分が挙げられ、具体的な酸
無水化物成分としては、4,4’−オキシジフタル酸二
無水物、3,3’,4,4’−ベンゾフェノンテトラカ
ルボン酸二無水物のうち少なくとも一成分が挙げられ
る。[Chemical 4] The polyimide of the present invention has a specific amine component of 4,
4'-diaminodiphenylpropane, 3,4'-diaminodiphenylpropane, 4,4 '-[1,3-phenylenebis (1-methylidene)] bisaniline, 4,4'-
At least one component of [1,4-phenylenebis (1-methylidene)] bisaniline can be mentioned, and specific acid anhydride components include 4,4′-oxydiphthalic acid dianhydride, 3,3 ′, 4. , 4'-benzophenone tetracarboxylic acid dianhydride.
【0006】共重合されるアミン成分としてp−フェニ
レンジアミン、m−フェニレンジアミン、クロル−p−
フェニレンジアミン、4,4’−ジアミノジフェニルエ
ーテル、2,4’−ジアミノジフェニルエーテル、3,
4’−ジアミノジフェニルエーテル、4,4’−ジアミ
ノジフェニルメタン、3,4’−ジアミノジフェニルメ
タン、2,4’−ジアミノジフェニルメタン、4,4’
−ジアミノジフェニルスルフィド、3,4’−ジアミノ
ジフェニルスルフィド、4,4’−ジアミノジフェニル
スルフォン、3,4’−ジアミノジフェニルスルフォ
ン、4,4’−ジアミノジフェニルエーテル、3,4’
−ジアミノジフェニルエーテル、1,5−ジアミノナフ
タレン、3,3’−ジメチルベンジジン、3,3’,
5,5’−テトラメチルベンジジン、3,3’−ジクロ
ロベンジジン、2,2’−ジクロロベンジジン、3,
3’,5,5’−テトラクロロベンジジン、2,4−ビ
ス(β−アミノ−t−ブチル)トルエン、ビス(p−β
−アミノ−t−ブチルフェニル)エーテル等芳香族ジア
ミンを挙げることができる。As the amine component to be copolymerized, p-phenylenediamine, m-phenylenediamine, chloro-p-
Phenylenediamine, 4,4'-diaminodiphenyl ether, 2,4'-diaminodiphenyl ether, 3,
4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 2,4'-diaminodiphenylmethane, 4,4 '
-Diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ether, 3,4 '
-Diaminodiphenyl ether, 1,5-diaminonaphthalene, 3,3'-dimethylbenzidine, 3,3 ',
5,5'-tetramethylbenzidine, 3,3'-dichlorobenzidine, 2,2'-dichlorobenzidine, 3,
3 ', 5,5'-tetrachlorobenzidine, 2,4-bis (β-amino-t-butyl) toluene, bis (p-β
Aromatic diamines such as -amino-t-butylphenyl) ether can be mentioned.
【0007】酸無水化物成分としてピロメリット酸二無
水化物、2,3,6,7−ナフタレンテトラカルボン酸
二無水化物、3,3’,4,4’−ビフェニルテトラカ
ルボン酸二無水化物、1,2,5,6−ナフタレンテト
ラカルボン酸二無水化物、2,2’,3,3’−ビフェ
ニルテトラカルボン酸二無水化物、2,3,4,5−チ
オフェンテトラカルボン酸二無水化物、2,2−ビス
(3,4−ジカルボキシフェニル)プロパン酸二無水化
物、ビス(3,4−ジカルボキシフェニル)スルフォン
酸二無水化物、3,4,9,10−ペリレンテトラカル
ボン酸二無水化物等芳香族カルボン酸二無水化物を共重
合させることができる。As the acid anhydride component, pyromellitic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 1 , 2,5,6-Naphthalenetetracarboxylic dianhydride, 2,2 ', 3,3'-biphenyltetracarboxylic dianhydride, 2,3,4,5-thiophenetetracarboxylic dianhydride, 2 , 2-bis (3,4-dicarboxyphenyl) propanoic acid dianhydride, bis (3,4-dicarboxyphenyl) sulfonic acid dianhydride, 3,4,9,10-perylenetetracarboxylic acid dianhydride Homoaromatic carboxylic acid dianhydrides can be copolymerized.
【0008】上記芳香族ジアミンや芳香族カルボン酸二
無水化物を共重合させると溶解性が十分でなくなるので
芳香族のポリイミド成分は50モル%以下に保つのが望
ましい。When the above-mentioned aromatic diamine or aromatic carboxylic dianhydride is copolymerized, the solubility becomes insufficient, so it is desirable to keep the aromatic polyimide component at 50 mol% or less.
【0009】本発明のポリイミドの合成方法は従来より
用いられている方法、すなわち低温溶液重合法により得
られたポリアミド酸ドープ液からフイルムや繊維として
ポリアミド酸を取り出し加熱処理によりポリイミドを得
る方法やポリアミド酸ドープ液を加熱しポリイミド溶液
を得る方法を採用することができる。The method for synthesizing the polyimide of the present invention is a conventionally used method, that is, a method for obtaining a polyimide by taking out polyamic acid as a film or fiber from a polyamic acid dope solution obtained by a low temperature solution polymerization method and subjecting it to heat treatment. A method of heating the acid dope solution to obtain a polyimide solution can be adopted.
【0010】以下に本発明の実施例について述べる。Examples of the present invention will be described below.
(ポリイミドAの合成)100ml4つ口フラスコに
4,4’−[1,3−フェニレンビス(1−メチリデ
ン)]ビスアニリン4.2094gを入れ乾燥窒素雰囲
気下に乾燥N−メチル−2−ピロリドン20mlを入
れ、撹拌しながら20℃に完全に溶解させ、25℃を越
えないように4,4’−オキシジフタル酸二無水物3.
8096gを徐々に加え乾燥N−メチル−2−ピロリド
ン12mlをさらに加えて。約6時間撹拌を続けポリア
ミド酸ドープ液とした。対数粘度は2.05d /g
(30℃)であった。このドープ液をフイルムコーター
によりガラス板上にキャストし熱風乾燥し240℃でや
く6時間熱処理した。作製したフイルム(厚さ32μ
m)のイミドはIRスペクトルにより確認した。引張り
試験の結果、弾性率2.8×104 kgf/cm2 、伸
び率18.2%であり、N−メチル−2−ピロリドンや
N,N−ジメチルアセトアミド以外にTHF等にも室温
にてすみやかに溶解した。(Synthesis of Polyimide A) 4,4 ′-[1,3-Phenylenebis (1-methylidene)] bisaniline (4.2094 g) was placed in a 100 ml four-necked flask, and 20 ml of dry N-methyl-2-pyrrolidone was added under a dry nitrogen atmosphere. 2. Put it in, dissolve it completely with stirring at 20 ° C., and keep it below 25 ° C. 4,4′-oxydiphthalic acid dianhydride 3.
8096 g was gradually added, and 12 ml of dried N-methyl-2-pyrrolidone was further added. Stirring was continued for about 6 hours to obtain a polyamic acid dope solution. Logarithmic viscosity is 2.05d / g
(30 ° C.). This dope solution was cast on a glass plate with a film coater, dried with hot air, and heat-treated at 240 ° C. for 6 hours. The prepared film (thickness 32μ
The imide of m) was confirmed by IR spectrum. As a result of the tensile test, the elastic modulus was 2.8 × 10 4 kgf / cm 2 and the elongation rate was 18.2%. Dissolved in.
【0011】同様の製造方法により得られたポリイミド
B〜Jを表1に示した。同様の製造方法により得られた
ポリイミドの溶解性を表1に示した。The polyimides B to J obtained by the same manufacturing method are shown in Table 1. Table 1 shows the solubility of the polyimide obtained by the same production method.
【0012】[0012]
【表1】 [Table 1]
【0013】*BAM;4,4’−[1,3−フェニレ
ンビス(1−メチリデン)]ビスアニリン BAP;4,4’−[1,3−フェニレンビス(1−メ
チリデン)]ビスアニリン 3,4−DDP;3,4’−ジアミノジフェニルプロパ
ン 4,4−DDP;4,4’−ジアミノジフェニルプロパ
ン PPD;p−フェニレンジアミン OPAN;4,4’−オキシジフタル酸二無水化物 BTAN;3,3’,4,4’−ベンゾフェノンテトラ
カルボン酸二無水化物 BPAN;3,3’,4,4’−ビフェニルテトラカル
ボン酸二無水化物 **数字はモル比を示す。Hは両方のアミンを同時に溶
解させその後両方の酸無水化物を同時に加えた。Jはま
ずPPDにBPANを反応させ変色し始めた時点で3,
4−DDP、OPANの順で加えた。* BAM; 4,4 '-[1,3-phenylenebis (1-methylidene)] bisaniline BAP; 4,4'-[1,3-phenylenebis (1-methylidene)] bisaniline 3,4- DDP; 3,4'-diaminodiphenylpropane 4,4-DDP; 4,4'-diaminodiphenylpropane PPD; p-phenylenediamine OPAN; 4,4'-oxydiphthalic acid dianhydride BTAN; 3,3 ', 4 , 4'-Benzophenonetetracarboxylic acid dianhydride BPAN; 3,3 ', 4,4'-biphenyltetracarboxylic acid dianhydride ** The numbers indicate the molar ratio. H dissolved both amines simultaneously and then both acid anhydrides were added simultaneously. When J started reacting with PPD by reacting BPAN,
4-DDP and OPAN were added in this order.
【0014】[0014]
【表2】 [Table 2]
【0015】[0015]
【発明の効果】本発明のポリイミドは有機溶媒への溶解
性に優れ,力学物性に優れた塗膜を形成しその色も淡い
黄色もしくはほぼ無色であり各種コーテイング剤として
有益に使用される。INDUSTRIAL APPLICABILITY The polyimide of the present invention forms a coating film having excellent solubility in organic solvents and excellent mechanical properties, and its color is pale yellow or almost colorless, and is useful as various coating agents.
【図面の簡単な説明】[Brief description of drawings]
【図1】実施例のポリイミドAの赤外線吸収スペクトル
を示す図である。FIG. 1 is a diagram showing an infrared absorption spectrum of polyimide A of an example.
【図2】実施例のポリイミドBの赤外線吸収スペクトル
を示す図である。FIG. 2 is a diagram showing an infrared absorption spectrum of polyimide B of an example.
【図3】実施例のポリイミドCの赤外線吸収スペクトル
を示す図である。FIG. 3 is a diagram showing an infrared absorption spectrum of polyimide C of an example.
Claims (1)
無水化物との反応により得られるポリイミド成分を主成
分とする有機溶媒可溶性ポリイミド。 【化1】 【化2】 1. An organic solvent-soluble polyimide containing a polyimide component as a main component, which is obtained by reacting an amine compound shown in Chemical formula 1 with an acid anhydride shown in Chemical formula 2. [Chemical 1] [Chemical 2]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5318197A JPH07173287A (en) | 1993-12-17 | 1993-12-17 | Polyimide soluble in organic solvent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5318197A JPH07173287A (en) | 1993-12-17 | 1993-12-17 | Polyimide soluble in organic solvent |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07173287A true JPH07173287A (en) | 1995-07-11 |
Family
ID=18096531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5318197A Pending JPH07173287A (en) | 1993-12-17 | 1993-12-17 | Polyimide soluble in organic solvent |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07173287A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021070232A1 (en) * | 2019-10-07 | 2021-04-15 | Hdマイクロシステムズ株式会社 | Polyimide precursor, resin composition, photosensitive resin composition, method for manufacturing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface-protective film, and electronic component |
TWI808096B (en) * | 2017-09-19 | 2023-07-11 | 美商杜邦電子股份有限公司 | Low-color polymers for use in electronic devices |
-
1993
- 1993-12-17 JP JP5318197A patent/JPH07173287A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI808096B (en) * | 2017-09-19 | 2023-07-11 | 美商杜邦電子股份有限公司 | Low-color polymers for use in electronic devices |
WO2021070232A1 (en) * | 2019-10-07 | 2021-04-15 | Hdマイクロシステムズ株式会社 | Polyimide precursor, resin composition, photosensitive resin composition, method for manufacturing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface-protective film, and electronic component |
JPWO2021070232A1 (en) * | 2019-10-07 | 2021-04-15 | ||
CN114502617A (en) * | 2019-10-07 | 2022-05-13 | 艾曲迪微系统股份有限公司 | Polyimide precursor, resin composition, photosensitive resin composition, method for producing patterned cured film, interlayer insulating film, covercoat, surface protective film, and electronic component |
CN114502617B (en) * | 2019-10-07 | 2024-05-03 | 艾曲迪微系统股份有限公司 | Polyimide precursor, photosensitive resin composition, interlayer insulating film, covercoat, surface protective film, and electronic component |
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