JPH04277616A - Support jig for substrate - Google Patents
Support jig for substrateInfo
- Publication number
- JPH04277616A JPH04277616A JP3039826A JP3982691A JPH04277616A JP H04277616 A JPH04277616 A JP H04277616A JP 3039826 A JP3039826 A JP 3039826A JP 3982691 A JP3982691 A JP 3982691A JP H04277616 A JPH04277616 A JP H04277616A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- leaf spring
- face
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 239000004615 ingredient Substances 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 34
- 238000000034 method Methods 0.000 description 12
- 230000007547 defect Effects 0.000 description 8
- 239000013078 crystal Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001451 molecular beam epitaxy Methods 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、基板を支持するための
基板支持治具に係り、特に、分子線エピタキシ膜を形成
する面に、塵埃が付着することによって発生する欠陥を
低減するのに好適な、基板の支持治具と装着治具に関す
る。[Field of Industrial Application] The present invention relates to a substrate support jig for supporting a substrate, and is particularly useful for reducing defects caused by dust adhering to a surface on which a molecular beam epitaxy film is formed. The present invention relates to a suitable substrate support jig and mounting jig.
【０００２】0002
【従来の技術】従来の基板支持治具は、特開昭５９−３
５８２９ 号公報に記載されているように、基板をイン
ジウムやガリウムなどの液体金属を用いて基板の装着板
に貼り付けていた。この方法では、貼り付けの際に、基
板の膜成長する面をピンセットなどで基板支持治具に押
さえつけなければならない。このとき基板とピンセット
がこすれて塵埃が発生する。これが、基板の膜成長する
面に付着すると、その上に形成される分子線エピタキシ
膜に欠陥を生じさせ、デバイス作製の歩留まりが低下す
るという問題があった。[Prior Art] A conventional substrate support jig is
As described in Japanese Patent No. 5829, a substrate was attached to a mounting plate using a liquid metal such as indium or gallium. In this method, when pasting, the surface of the substrate on which the film will grow must be pressed against a substrate support jig using tweezers or the like. At this time, the substrate and tweezers rub against each other, generating dust. If this adheres to the surface of the substrate on which the film is grown, it causes defects in the molecular beam epitaxy film formed thereon, resulting in a problem in that the yield of device fabrication decreases.
【０００３】また、特開昭５９−３５８２９ 号公報に
記載されているように、基板を装着板に乗せて支持して
いた。この方法では、基板の結晶成長面が装着板に面接
触しているので、接触面積が大きく、外部からの振動な
どで基板と装着板とがこすれたときに、そこから塵埃が
多量に発生し、上述と同様な問題点が生じていた。また
、特開昭６０−１７５４１０号公報に記載されているよ
うに、固定ばねで、基板の結晶成長面を押しつけ、基板
支持治具に密着させていた。この方法では、固定ばねと
結晶成長面が面接触しているので、これらがこすれたと
きに塵埃が多量に発生していた。Furthermore, as described in Japanese Patent Application Laid-Open No. 59-35829, the board was supported by being placed on a mounting plate. In this method, the crystal growth surface of the substrate is in surface contact with the mounting plate, so the contact area is large, and when the substrate and mounting plate rub against each other due to external vibrations, a large amount of dust is generated from there. , the same problem as mentioned above occurred. Further, as described in Japanese Patent Application Laid-Open No. 60-175410, a fixed spring was used to press the crystal growth surface of the substrate and bring it into close contact with a substrate support jig. In this method, since the fixed spring and the crystal growth surface are in surface contact, a large amount of dust is generated when they rub against each other.
【０００４】また、特開昭６１−１７７７１２号公報に
記載されているように、基板の裏側から、凸型にわん曲
した金属薄板で押しつけ、基板支持治具に密着させてい
た。この方法では、基板の結晶成長面が、基板支持治具
に、面接触で押しつけられる。これらがこすれると、や
はり上述と同様な問題点が生じていた。[0004] Furthermore, as described in Japanese Patent Application Laid-open No. 177712/1984, a convexly curved thin metal plate is pressed against the back side of the substrate to make it tightly contact with a substrate support jig. In this method, the crystal growth surface of the substrate is pressed against a substrate support jig in surface contact. If these were rubbed, problems similar to those described above would occur.
【０００５】[0005]
【発明が解決しようとする課題】上記従来技術による基
板支持方法では、基板と装着板が接触する面積が大きく
、また、基板を装着板に押しつけているために、基板と
装着板とがこすれたときに、塵埃が多量に発生し、分子
線エピタキシ膜に欠陥を生じさせ、デバイス作製の歩留
まりが低下するという問題点があった。[Problems to be Solved by the Invention] In the above conventional board supporting method, the contact area between the board and the mounting plate is large, and since the board is pressed against the mounting plate, the board and the mounting plate may rub against each other. At times, a large amount of dust is generated, which causes defects in the molecular beam epitaxy film and reduces the yield of device fabrication.
【０００６】また、基板支持治具の装着板に基板を装着
する作業を簡便化する治具が無いため、装着作業が困難
で、作業中の塵埃発生量が多くなる問題点があった。[0006]Furthermore, since there is no jig that simplifies the work of mounting the board on the mounting plate of the board support jig, there is a problem that the mounting work is difficult and a large amount of dust is generated during the work.
【０００７】[0007]
【課題を解決するための手段】装着板が基板と接触する
面積をできるだけ小さくし、基板を装着板に押しつけな
いようにして、支持すれば、基板と装着板とがこすれた
ときの塵埃発生量を少なくすることができる。そのため
には、以下のような手段が考えられる。すなわち、基板
を側面からはさんで固定する板ばねを、基板支持治具に
設ける。板ばねで、基板の側面が当たるところに凹部を
設ける。[Means for solving the problem] If the area where the mounting plate contacts the board is made as small as possible and the board is supported without being pressed against the mounting plate, the amount of dust generated when the board and the mounting plate rub against each other can be reduced. can be reduced. To this end, the following methods can be considered. That is, the board support jig is provided with a leaf spring that clamps and fixes the board from the sides. A recess is provided where the leaf spring touches the side of the board.
【０００８】あるいは、基板を側面からはさまずに、基
板の膜成長する面とその裏面からはさんで固定するため
の板ばねを、基板支持治具に設ける。板ばねの、基板が
接触するところに、突起を設ける。Alternatively, the substrate support jig is provided with a leaf spring for fixing the substrate between the surface on which a film is to be grown and the back surface of the substrate without sandwiching the substrate from the sides. A protrusion is provided on the leaf spring where the board comes into contact.
【０００９】尚、板ばねは、基板外周部の３から４カ所
を支持するようにし、板ばねと基板との接触面積を極力
少なくするようにする。[0009] The leaf spring is designed to support three to four locations on the outer periphery of the board, and the contact area between the leaf spring and the board is minimized.
【００１０】あるいは、装着板に複数の突起を設け、装
着板に直接、基板を乗せたときに、基板が突起の上に乗
って、支持されるようにする。Alternatively, the mounting plate is provided with a plurality of protrusions so that when the board is placed directly on the mounting plate, the board rests on the protrusions and is supported.
【００１１】また、基板支持治具における基板の装着を
簡便化するため、基板装着治具である基板支持治具の板
ばねを広げるための板ばね開閉ばねを設ける。基板支持
治具の装着板と基板を、基板装着治具に固定したときに
、板ばねが開いて、基板が板ばねに触れることなく基板
がちょうど装着位置に来るようにする。その後、板ばね
を静かに閉じて、基板を支持する。これにより、基板装
着時に、基板と装着板や板ばねとが接触して発生する塵
埃を少なくすることができる。Further, in order to simplify the mounting of the board on the board support jig, a leaf spring opening/closing spring is provided for expanding the leaf spring of the board support jig, which is the board mounting jig. When a mounting plate of a board support jig and a board are fixed to the board mounting jig, a leaf spring is opened and the board is brought exactly to the mounting position without touching the board spring. Then, gently close the leaf spring to support the board. Thereby, when the board is mounted, it is possible to reduce dust generated by contact between the board and the mounting plate or leaf spring.
【００１２】0012
【作用】板ばねは基板の装着面にたいして垂直に設けら
れているので、基板の側面を周囲からはさみ込んで支持
することができる。このようにすると、基板と板ばねが
接触する面積を、小さくできるので、両者がこすれた際
に発生する塵埃量が低減でき、膜成長する面に付着する
塵埃を低減することができる。また、板ばねは基板の外
周部の少なくとも三から四カ所に設ければ、基板をしっ
かりと支持でき、また、各板ばねの幅も小さくできる。[Operation] Since the leaf spring is provided perpendicularly to the mounting surface of the board, it can support the side surface of the board by sandwiching it from the periphery. In this way, the contact area between the substrate and the leaf spring can be reduced, so the amount of dust generated when the two rub against each other can be reduced, and the amount of dust adhering to the surface on which the film is grown can be reduced. Furthermore, if the leaf springs are provided at at least three to four locations on the outer periphery of the board, the board can be firmly supported, and the width of each leaf spring can also be reduced.
【００１３】また、板ばねに凹部が設けられているので
、基板がしっかりと固定される。このようにすると、搬
送時の振動などによる基板の落下を防ぐことができる。Furthermore, since the plate spring is provided with a recess, the board is firmly fixed. In this way, it is possible to prevent the substrate from falling due to vibrations during transportation.
【００１４】また、基板を側面でなく、両面からはさみ
込んで支持することもできる。このとき、基板と接触し
ているのは板ばねに設けられた突起部である。このよう
にすると、基板と板ばねが点接触するので、従来の面接
触に比べて、接触面積が小さく、発生する塵埃量を低減
でき、膜成長する面に付着する塵埃を低減することがで
きる。[0014] Furthermore, the substrate can be supported by being sandwiched from both sides instead of from the sides. At this time, the protrusion provided on the leaf spring is in contact with the substrate. In this way, the substrate and the leaf spring come into point contact, so compared to conventional surface contact, the contact area is smaller, the amount of dust generated can be reduced, and the amount of dust adhering to the surface on which the film is grown can be reduced. .
【００１５】装着板に直接、基板を置く方法では、基板
が、装着板に設けられた突起部で支持される。このよう
にすると、基板と板ばねが点接触するので、従来の面接
触に比べて、接触面積が小さく、発生する塵埃量を低減
でき、膜成長する面に付着する塵埃を低減することがで
きる。In the method of placing the board directly on the mounting plate, the board is supported by a protrusion provided on the mounting plate. In this way, the substrate and the leaf spring come into point contact, so compared to conventional surface contact, the contact area is smaller, the amount of dust generated can be reduced, and the amount of dust adhering to the surface on which the film is grown can be reduced. .
【００１６】また、基板の装着方法に関しては、基板装
着治具に基板支持治具を置き、基板装着治具の板ばね開
閉ばねによって板ばねを広げる。そして、基板を支持位
置に置いてから、板ばねを戻して、基板を支持する。こ
のようにすると、板ばねを広げたり戻したりする作業が
簡単になるので、装着作業中の塵埃発生量を低減するこ
とができる。Regarding the method of mounting the board, a board support jig is placed on the board mounting jig, and the leaf springs are expanded by the leaf spring opening/closing spring of the board mounting jig. Then, after placing the board in the supporting position, the leaf spring is returned to support the board. In this way, the work of expanding and returning the leaf spring becomes easy, so that the amount of dust generated during the installation work can be reduced.
【００１７】また、基板装着治具に、基板と基板支持治
具を置くと、ちょうど基板が板ばねの凹部に入る位置に
来る。このようにすると、基板の装着作業を簡便化でき
るので、装着作業時の塵埃発生量を低減することができ
る。Furthermore, when the board and the board support jig are placed on the board mounting jig, the board will come to a position where it will fit into the recess of the leaf spring. In this way, the mounting work of the board can be simplified, and the amount of dust generated during the mounting work can be reduced.
【００１８】[0018]
【実施例】以下、本発明の各実施例を説明する。[Embodiments] Each embodiment of the present invention will be described below.
【００１９】まず、図１は、本発明の基本支持治具の一
実施例を示したものである。基板１００の膜成長する面
１０１に塵埃が付着するのを防ぐたるに、基板１００は
、装着板１１０に、板ばね１２０によって固定されてい
る。板ばね１２０の数はいくつでもよいが、三，四ケ所
あれば充分である。板ばね１２０は、弾性力によって基
板１００を基板１００の中心方向にはさみこんで、基板
１００を保持している。板ばね１２０は、基板１００の
側面の一部にのみ接触しているか、または、側面と膜成
長する面１０１あるいはその裏面のごく一部にのみ接触
している。よって、板ばね１２０と基板１００とのこす
れによって生じる塵埃を少なくすることができ、それら
が膜成長する面１０１に飛散しにくいため、膜成長する
面１０１への塵埃付着量を低減し、欠陥を低減すること
ができる。また、基板に接触しているのは、板ばねだけ
なので、基板が高温に加熱されたときに、熱伝導で逃げ
る熱量を少なくできる。よって、加熱効率が向上する。First, FIG. 1 shows an embodiment of the basic support jig of the present invention. In order to prevent dust from adhering to the surface 101 of the substrate 100 on which the film is grown, the substrate 100 is fixed to the mounting plate 110 by a leaf spring 120. Any number of leaf springs 120 may be used, but three or four leaf springs are sufficient. The leaf spring 120 holds the substrate 100 by sandwiching the substrate 100 toward the center of the substrate 100 by its elastic force. The leaf spring 120 is in contact with only a part of the side surface of the substrate 100, or only with a small part of the side surface and the surface 101 on which a film is grown, or the back surface thereof. Therefore, it is possible to reduce the amount of dust generated by the friction between the leaf spring 120 and the substrate 100, and it is difficult for the dust to scatter to the surface 101 on which the film grows, thereby reducing the amount of dust adhering to the surface 101 on which the film grows, thereby reducing defects. can do. Additionally, since only the leaf springs are in contact with the board, when the board is heated to a high temperature, the amount of heat that escapes through thermal conduction can be reduced. Therefore, heating efficiency is improved.
【００２０】図２は、基板１００が板ばね１２０に、ま
た板ばね１２０が装着板１１０に支持されているところ
の断面図である。板ばね１２０には、凹部が設けられて
おり、ここで基板１００の側面が支持される。凹部の曲
率半径を、基板１００の側面の曲率半径よりも大きくし
てもよい。また、図３に示されているように、板ばねを
折り曲げて、凹部を形成してもよい。このようにすると
、基板１００が安定する位置に収まって支持されるので
、搬送時に外部から振動が加わったときに、基板１００
が外れて落下するのを防止できる。また、板ばねが基板
と接触する面積を小さくできるので、膜成長する面１０
１への塵埃付着を低減することができる。板ばね１２０
の固定方法は、図２に示されているように、装着板１１
０に設けられた溝の中に、ストッパ１３０によってはさ
み込まれて固定されている。結晶成長中に基板１００は
６００℃程度まで加熱されるので、ねじなどで固定する
と、ねじが焼き付いてしまうので使用できない。しかし
、板ばね１２０を後で取り外す必要が無いときは、ねじ
などで固定してもよい。FIG. 2 is a cross-sectional view of the substrate 100 supported by the leaf spring 120 and the leaf spring 120 supported by the mounting plate 110. The leaf spring 120 is provided with a recess, in which the side surface of the substrate 100 is supported. The radius of curvature of the recess may be larger than the radius of curvature of the side surface of the substrate 100. Alternatively, as shown in FIG. 3, the plate spring may be bent to form a recess. In this way, the substrate 100 is supported in a stable position, so that when vibration is applied from the outside during transportation, the substrate 100
This will prevent it from coming off and falling. In addition, since the area in which the leaf spring contacts the substrate can be reduced, the surface 10 on which the film grows
It is possible to reduce dust adhesion to 1. Leaf spring 120
The fixing method is as shown in FIG.
It is sandwiched and fixed by a stopper 130 in a groove provided at 0. Since the substrate 100 is heated to about 600° C. during crystal growth, it cannot be used if it is fixed with screws or the like because the screws will seize up. However, if the leaf spring 120 does not need to be removed later, it may be fixed with screws or the like.
【００２１】また、図２において、装着板１１０と基板
１００との間にすきまが生じないように、装着板の遮蔽
部１１１がすきまを覆い隠している。このようにすると
、基板を加熱するための輻射熱が、すきまから逃げにく
くなるので、加熱効率が向上する。また、図２の下方か
ら照射されるエピタキシャル原料蒸気が、すきまから入
り込んで、内部にあるヒータなどを汚染することが無い
ので、装置の寿命が長くなる。Further, in FIG. 2, a shielding portion 111 of the mounting plate covers the gap so that no gap is generated between the mounting plate 110 and the substrate 100. This makes it difficult for radiant heat for heating the substrate to escape through the gap, improving heating efficiency. Furthermore, the epitaxial raw material vapor irradiated from below in FIG. 2 does not enter through the gap and contaminate the internal heater, etc., so the life of the device is extended.
【００２２】図４は、別の方法で基板を支持する、板ば
ね１２０の形状である。前述の方法では、基板１００を
側面からはさみ込んでいたが、ここでは、膜成長する面
と、その裏面からはさんで支持している。板ばねに基板
が接触する部分には、突起部１２１が設けられている。
このようにすると、板ばねが基板と接触する面積を小さ
くできるので、膜成長する面１０１への塵埃付着を低減
することができる。FIG. 4 is a configuration of a leaf spring 120 that supports the substrate in an alternative manner. In the method described above, the substrate 100 was sandwiched from the sides, but here, it is supported by sandwiching it from the surface on which the film is to be grown and the back surface thereof. A protrusion 121 is provided at a portion where the board contacts the leaf spring. In this way, the area in which the leaf spring contacts the substrate can be reduced, so that dust adhesion to the surface 101 on which the film is grown can be reduced.
【００２３】図５は、板ばね１２０の形状である。一つ
の円筒状の部材から三個のばねが伸びている。これは、
板ばね１２０の形状の一例であるので、板ばね１２０を
、この場合は三個の部材に分割してもよい。FIG. 5 shows the shape of the leaf spring 120. Three springs extend from one cylindrical member. this is,
Since this is an example of the shape of the leaf spring 120, the leaf spring 120 may be divided into three members in this case.
【００２４】図６は、基板装着治具１４０を使用して、
基板１００を基板支持治具に装着しているところの断面
図である。図１ないし図４とは、上下が逆になっており
、膜成長する面１０１が上を向いている。まず、基板支
持治具（板ばね１２０のついた装着板１１０）を基板装
着治具１４０に乗せる。次に板ばね開閉ねじ１４１を抜
いていくと、板ばね開閉ばね１４２が弾性力で板ばねを
おして、板ばね１２０が開く。そして、基板１００を、
膜成長する面１０１を上にして置き、板ばね開閉ねじ１
４１を入れると、板ばね１２０がもとに戻って、基板１
００をはさみこみ、基板１００の装着が完了する。
ここで、基板１００の支持位置と装着板１１０の底面と
の距離をＬとし、基板１００を乗せる面と基板支持治具
を乗せる面との距離をＤとする。ＬとＤとがほぼ等しく
なるように、設計すると、基板１００が、基板支持治具
の支持位置にちょうど来る。このようにすると、装着作
業が簡単になり、基板１００の装着時に発生する塵埃の
量や、基板１００の膜成長する面１０１に付着する塵埃
の量を低減することができ、塵埃が原因で発生する欠陥
を低減することができる。FIG. 6 shows that using the board mounting jig 140,
FIG. 2 is a cross-sectional view showing the substrate 100 being mounted on a substrate support jig. 1 to 4, the top and bottom are reversed, and the surface 101 on which the film is grown faces upward. First, a board support jig (mounting plate 110 with leaf spring 120 attached) is placed on the board mounting jig 140. Next, when the leaf spring opening/closing screw 141 is removed, the leaf spring opening/closing spring 142 pushes the leaf spring with its elastic force, and the leaf spring 120 opens. Then, the substrate 100 is
Place the film growth surface 101 up and tighten the leaf spring opening/closing screw 1.
41, the leaf spring 120 returns to its original position and the board 1
00 is inserted, and the mounting of the board 100 is completed. Here, the distance between the support position of the substrate 100 and the bottom surface of the mounting plate 110 is L, and the distance between the surface on which the substrate 100 is placed and the surface on which the substrate support jig is placed is D. If L and D are designed to be approximately equal, the substrate 100 will come exactly to the support position of the substrate support jig. In this way, the mounting work becomes easier, and the amount of dust generated when mounting the substrate 100 and the amount of dust attached to the surface 101 of the substrate 100 on which the film grows can be reduced. Defects can be reduced.
【００２５】図７は、装着板の上に、基板を直接乗せて
支持するときの、断面図である。基板は、装着板に設け
られた複数の突起部１１２の上に乗っている。このよう
にすると、板ばねが基板と接触する面積を小さくできる
ので、膜成長する面１０１への塵埃の付着を低減するこ
とができる。また、装着板には、基板との間にできるす
きまを覆うように、折り返し部分１１３が設けられてい
る。このようにすると、基板と突起部とのこすれによっ
て生じた塵埃が、結晶成長面１０１に飛散するのを、低
減することができる。FIG. 7 is a cross-sectional view when the board is placed directly on the mounting plate and supported. The board rests on a plurality of protrusions 112 provided on the mounting plate. In this way, the area in which the leaf spring contacts the substrate can be reduced, so that it is possible to reduce the adhesion of dust to the surface 101 on which the film is grown. Further, the mounting plate is provided with a folded portion 113 so as to cover a gap formed between the mounting plate and the board. In this way, it is possible to reduce the scattering of dust generated by rubbing between the substrate and the protrusion onto the crystal growth surface 101.
【００２６】なお、これらの一連の作業は、作業中の基
板１００への塵埃付着量を低減するために、クリーンベ
ンチなどの塵埃の少ない環境で行われる。Note that this series of operations is performed in a dust-free environment such as a clean bench in order to reduce the amount of dust adhering to the substrate 100 during the operation.
【００２７】[0027]
【発明の効果】板ばねと基板とのこすれによって生じる
塵埃が、膜成長する面で発生するのを抑制し、また、そ
れらが膜成長する面に向かって飛散しなくくなるため、
膜成長する面への塵埃付着量を低減し、欠陥を低減する
ことができる。よって、このような欠陥の少ない膜を用
いてデバイスを製作するときの歩留まりが向上する。[Effects of the Invention] Dust generated by the friction between the leaf spring and the substrate is suppressed from being generated on the surface where the film grows, and it is also prevented from scattering toward the surface where the film grows.
It is possible to reduce the amount of dust adhering to the surface on which the film is grown and reduce defects. Therefore, the yield when manufacturing devices using such a film with few defects is improved.
【００２８】また、基板を加熱したときに、熱伝導によ
って逃げる熱量を、少なくすることがでるので、加熱効
率が向上する。Furthermore, when the substrate is heated, the amount of heat that escapes by thermal conduction can be reduced, so heating efficiency is improved.
【００２９】また、基板装着治具により、基板装着作業
が簡便化されるので、基板の装着時に発生する塵埃の量
や、基板の膜成長する面に付着する塵埃の量を低減する
ことができ、塵埃が原因で発生する欠陥を低減すること
ができる。Furthermore, since the substrate mounting jig simplifies the substrate mounting work, it is possible to reduce the amount of dust generated when mounting the substrate and the amount of dust that adheres to the surface of the substrate on which the film is grown. , defects caused by dust can be reduced.
【図１】基板が装着されている本発明の基板支持治具の
斜視図。FIG. 1 is a perspective view of a substrate support jig of the present invention on which a substrate is mounted.
【図２】基板が板ばねに、また板ばねが装着板に支持さ
れているところの断面図。FIG. 2 is a cross-sectional view of the board supported by the leaf spring and the leaf spring supported by the mounting plate.
【図３】板ばねを折り曲げて形成した凹部が、基板を支
持しているところの断面図。FIG. 3 is a cross-sectional view showing a recess formed by bending a leaf spring supporting a substrate.
【図４】板ばねが基板を、膜成長する面とその裏面から
はさみ込んで支持する方法の断面図。FIG. 4 is a cross-sectional view of a method in which a plate spring supports a substrate by sandwiching it from the surface on which a film is to be grown and the back surface thereof.
【図５】基板支持治具の板ばねの斜視図。FIG. 5 is a perspective view of a leaf spring of the board support jig.
【図６】基板装着治具を使用して、基板を基板支持治具
に装着しているところの断面図。FIG. 6 is a cross-sectional view showing a board being mounted on a board support jig using a board mounting jig.
【図７】装着板に基板を乗せて支持する方法の断面図。FIG. 7 is a cross-sectional view of a method for mounting and supporting a board on a mounting plate.
１００…基板、１０１…膜成長する面、１１０…装着板
、１１１…装着板の遮蔽部、１１２…装着板の突起部、
１１３…装着板の折り返し部分、１２０…板ばね、１２
１…板ばねの突起部、１３０…ストッパ、１４０…基板
装着治具、１４１…板ばね開閉ねじ、１４２…板ばね開
閉ばね。DESCRIPTION OF SYMBOLS 100... Substrate, 101... Surface on which film grows, 110... Mounting plate, 111... Shielding part of mounting plate, 112... Projection part of mounting plate,
113...Folded portion of mounting plate, 120...Leaf spring, 12
DESCRIPTION OF SYMBOLS 1... Protrusion of leaf spring, 130... Stopper, 140... Board mounting jig, 141... Leaf spring opening/closing screw, 142... Leaf spring opening/closing spring.
Claims (1)
とからなる基板の支持治具において、前記基板を膜成長
する面以外の面で、支持することを特徴とする基板の支
持治具。1. A substrate support jig comprising a substrate and a mounting plate for holding the substrate, wherein the substrate is supported on a surface other than a surface on which a film is grown. Ingredients.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3039826A JPH04277616A (en) | 1991-03-06 | 1991-03-06 | Support jig for substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3039826A JPH04277616A (en) | 1991-03-06 | 1991-03-06 | Support jig for substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04277616A true JPH04277616A (en) | 1992-10-02 |
Family
ID=12563783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3039826A Pending JPH04277616A (en) | 1991-03-06 | 1991-03-06 | Support jig for substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04277616A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002524237A (en) * | 1998-09-04 | 2002-08-06 | エシロール アンテルナショナル コムパニージェネラル ドプテイク | Optical lens support and method of using the same |
| JP2006156905A (en) * | 2004-12-01 | 2006-06-15 | Nikon Corp | Substrate omission preventing device and exposure device |
-
1991
- 1991-03-06 JP JP3039826A patent/JPH04277616A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002524237A (en) * | 1998-09-04 | 2002-08-06 | エシロール アンテルナショナル コムパニージェネラル ドプテイク | Optical lens support and method of using the same |
| JP2006156905A (en) * | 2004-12-01 | 2006-06-15 | Nikon Corp | Substrate omission preventing device and exposure device |
| JP4513533B2 (en) * | 2004-12-01 | 2010-07-28 | 株式会社ニコン | Substrate drop prevention device and exposure apparatus |
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